Products
New control and hardware capabilities are available for the Power Column 2 vertical lift module (VLM).
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
FKI Logistex, www.fkilogistex.com
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
FKI Logistex, www.fkilogistex.com
Soder-Wick Lead-Free Desoldering Braid is engineered for high-temperature, lead-free solder removal. Maximizes heat transfer to the solder joint, melting the solder faster and more efficiently than conventional desoldering braids. Designed and optimized for all lead-free solders, said ton prolong the tip life on soldering irons.
ITW Chemtronics, www.chemtronics.com
Release 4.2 of the graphical Boundary Scan operating system SYSTEM CASCON features more than 20 new technologies and tools. Besides the Navigator, Component Explorer and an improved programmer, the HYSCAN (Hybrid Scan Technology) addition aids the execution and diagnosis of hybrid formatted test patterns.
HYSCAN is based on a new hardware-independent emulation method and relieves the user from the entire handling of serial-to-parallel vectors. Test program generation and fault diagnosis can be done without knowing the type of test access. The parallel test vectors are connected with the individually configured pin electronic by means of Wrapper Modules. By exchanging these modules, the parallel vectors can be linked to the required pin electronic without re-compilating the test program. The first supported pin electronic are the parallel I/O modules PXI 5296 and PXI 52192 with 96 and 192 test channels, respectively.
The Component Explorer is a graphical tool for the interactive generation and manipulation of intelligent design data. Unknown components and complete component cluster can be defined and implemented into the database. Is directly linked with Scan Vision tools for the visualization of schematic and layout as well as the graphical library.
The Navigator tool for the interactive user guidance gives support in terms of hyperlinks, videos or topic related documents.
The new version is downwards compatible to all previous versions and supports all Boundary Scan controllers on basis of VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232 and Fast Ethernet.
GÖPEL electronic, www.goepel.com
HYSCAN is based on a new hardware-independent emulation method and relieves the user from the entire handling of serial-to-parallel vectors. Test program generation and fault diagnosis can be done without knowing the type of test access. The parallel test vectors are connected with the individually configured pin electronic by means of Wrapper Modules. By exchanging these modules, the parallel vectors can be linked to the required pin electronic without re-compilating the test program. The first supported pin electronic are the parallel I/O modules PXI 5296 and PXI 52192 with 96 and 192 test channels, respectively.
The Component Explorer is a graphical tool for the interactive generation and manipulation of intelligent design data. Unknown components and complete component cluster can be defined and implemented into the database. Is directly linked with Scan Vision tools for the visualization of schematic and layout as well as the graphical library.
The Navigator tool for the interactive user guidance gives support in terms of hyperlinks, videos or topic related documents.
The new version is downwards compatible to all previous versions and supports all Boundary Scan controllers on basis of VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232 and Fast Ethernet.
GÖPEL electronic, www.goepel.com
Press Releases
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- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing