Products
Three new UV-cure encapsulants for use in Smart Card IC module manufacturing are now available: Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, they reportedly provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.
Designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are low viscosity materials used for the fill process. 3329 has a higher Tg of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness.
Are easy to dispense, adhere strongly to a range of carrier substrates and possess a low coefficient of thermal expansion (45ppm below Tg and 130ppm above Tg). Typical UV cure times per IC module are 26 to 46 sec., which enables a maximum of 10,000 UPH.
Henkel,
henkelelectronics.com
LDS9000 mechanical dispensing system is a fully programmable, electric powered and mechanically operated system that is air-free.
Features an easy-to-program control unit and a hand-held dispensing gun that employs a precise, linear actuator-driven piston to push a fluid or adhesive through a plastic syringe. Permits repeatable shots, runs on 115 VAC and eliminates the problems associated with conventional air dispensers such as variations in pressure, moisture and fluid viscosity.
Suitable for in-plant assembly and field maintenance, has a microprocessor-based portable control unit, a foot or hand operated pedal, and gun stand. The software-driven unit knows the I.D. of the syringe, dispense rate and required volume; calculates the precise distance the piston needs to travel. It also draws back to prevent oozing.
Fishman Corp., fishmancorp.com
Version 5 of the Web-based Flopack software enables the creation of Delphi compact models that predict the performance of electronic components under soon-to-be-published thermal testing standards from JEDEC committee JC-15.1. Produces behavioral compact models that can predict the temperature of component packages at critical points such as the junction, case and board. New features include a faster, more accurate nonlinear optimizer, support for additional nodes, user access to setup parameters and the ability to create compact models from non-Flomerics simulation data.
Consists of a collection of "Smart Part" modules installed on a central web server. Users enter data describing the IC package through simple forms using a standard Web browser.
An advanced nonlinear optimization method reportedly provides more accurate Delphi compact models. The new algorithm automatically optimizes the area assigned to each node, eliminating the need for manual nodal partitioning. Provides a more flexible objective function that combines flux and junction temperature contributions. In addition to the top inner/outer and bottom inner/outer nodes supported in the past, the new version also supports up to two side nodes for all packages and up to four lead nodes for leaded packages.
Flomerics, flomerics.com
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