Products
ER6006 and ER7006 Bio epoxy resins provide good flow characteristics to allow potting of difficult and complex geometries. ER6006 is two-part high thermally conductive epoxy encapsulation resin primarily developed for encapsulation of LED driver units.
Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.
Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.
Press Releases
- CE3S Announces Strategic Partnership with Ideal-tek to Expand Precision Tools Offering
- Bittele Electronics’ Malaysia Facility Achieves ISO 9001:2015 Certification
- Bittele Electronics’ Malaysia Facility Achieves ISO 9001:2015 Certification
- Kitov AI Inc., FANUC America partner to advance AI-driven smart manufacturing solutions