REDDITCH, UK – Laser depaneling is one of the most advanced techniques for cutting and separating PCBs from the panel today and is changing how electronic components are manufactured. To ensure production is futureproofed, and products are manufactured to the highest quality, leading CEM, Sellectronics has invested in an innovative system from Altus Group to assist in the process.

The LPKF CuttingMaster 2240 system has the capability to laser depanel to the highest tolerances. It offers significant advantages compared to conventional mechanical separation methods thanks to its flexibility and stress-free methods.

Working closely with leading OEMs, Sellectroinics sees a wide range of PCB designs that require precise solutions. The LPKF CuttingMaster significantly improves depaneling efficiency with increased cutting speeds of up to 25% on all quality levels depending on the specific application.

Jason O’Connell, Sellectronics Technical Director, said: “Integrating the latest innovative technology and equipment into our operations is fundamental in ensuring we consistently manufacture the very best products and do not miss any business opportunities.

“Sellectronics continue to look at future trends and invest in our production line to help support our customers in the coming years. We are seeing more and more populated rigid and flexible PCBs, sensitive parts, and complex miniaturised assemblies in varying materials. By investing in the LPKF CuttingMaster we can effectively produce components of today and also have the capability to produce those of tomorrow, as the equipment gives us the flexibility and scalability to always stay ahead.”

Joe Booth, Altus CEO, added: “Sellectronics is an excellent example of a company looking to the future and investing their money wisely to offer short-term results but long-term risk mitigation and value to their customers. This investment has put them in a pool of a handful of CEMs in the UK and Ireland who have invested in a process that will give them a significant competitive edge, which is a considerable advantage within the electronics industry.”

The LPKF CuttingMaster 2240 is the first laser system with ultra-fast Tensor Technology which sets a new standard in laser processing. Tensor is a highly innovative beam deflection module developed to distribute pulses around the laser spot in a targeted manner. This enables significantly higher laser powers to be used effectively and meets the highest requirements. Importantly, Tensor increases the quality of the PCB as cooling times are no longer necessary due to an ultra-fast beam guidance system.

The system offers a very attractive price-performance ratio, and with the added Tensor the available power is optimally utilised leading to a significant increase in efficiency. This innovative technology enhances with increasing material thickness, particularly with technically clean cuts. LPKF CuttingMaster 2240 sets new standards in terms of performance, technical cleanliness, and efficiency of depaneling.

To find out more about the LPKF CuttingMaster, and other laser depaneling systems, contact Altus Group, www.altusgroup.co.uk 

MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototype development and contract PCB assembly, announces Jon Eaton has been added to the STI Team as Manufacturing Planner.

Eaton brings with him 12 years of experience in engineering, logistics and network/cyber security. He will be an asset to the STI Team, using his experience & knowledge for the Engineering Services Division.

SUWANEE, GA – Although the processing of odd-shaped components at the end of the line usually accounts for only about ten percent of the entire SMT process, it represents the majority of the challenges in placement operations. With a smart high-performance solution from technology leader ASMPT, the company’s SIPLACE TX high-speed placement systems can now also be used as end-of-line machines for the automated processing of odd-shaped components (OSCs), replacing expensive and slow robotic solutions or manual work. The SIPLACE Tray Unit enables the automatic, uninterrupted feeding of components from up to 82 JEDEC trays. And the associated seamless traceability of products, components and batches ensures total auditing security, which is particularly important in sensitive areas such as the automotive sector.

“With its proven Waffle Pack Changer and Matrix Tray Changer, ASMPT has long offered the option of automatically supplying odd-shaped components (OSCs) to the highly flexible SIPLACE SX and the high-volume SIPLACE X S. Due to design limitations, this was previously not possible for the SIPLACE TX,” explains Petra Klein-Gunnewigk, Senior Product Manager at ASMPT. “With the new SIPLACE Tray Unit we fulfill the wish of many electronics manufacturers to make this machine, which is highly valued for its impressive floorspace performance, fit for automated, highly efficient and more productive end-of-line processing. As a result, SIPLACE TX users can now balance their lines even more effectively while gaining valuable space on the shop floor and increasing their flexibility by integrating processes that previously had to be handled offline – with all the advantages that our Open Automation concept delivers.”

Ready for OSC processing

To ensure the correct processing of odd-shaped components in a single step, the SIPLACE TX can now be equipped with two stationary high-end camera systems for use with two TwinHeads or a placement head combination of a CPP and a TwinHead. With its great selection of special nozzles and grippers, the TwinHead makes it possible to place OSCs measuring up to 200 mm × 110 mm × 25 mm (L × W × H) and weighing up to 160 grams. And with the optional OSC Package, the OSC placement capabilities are expanded even further.

Powerful feeding solution

To operate as an end-of-line machine, the SIPLACE Tray Unit is now available for the SIPLACE TX. It uses carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 trays measuring up to 355 × 275 mm are possible. As a special feature, new trays can be refilled without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.

Perfect fit for more space on the shop floor

The SIPLACE TX is the placement solution of choice for mobile devices, increasingly complex automotive solutions, and many more applications. Whenever manufacturers wanted to integrate the processing of OSCs into the line, they previously had to resort to alternative end-of-line solutions, which take up significantly more space, as shown in this simple example: Three SIPLACE TX and one SIPLACE SX with a Waffle Pack Changer occupy an area of 13.76 square meters. Four SIPLACE TX machines, on the other hand, the last being equipped with the new SIPLACE Tray Unit, take up only 9.92 square meters – a whopping 27.5 percent less. And the SIPLACE Tray Unit protrudes less than 13 centimeters from the front of the machine.

A more balanced line

Automated OSC processing makes the entire SMT line much more balanced because it drastically accelerates the slowest placement process. It increases the line’s productivity considerably and minimizes the robot-supported or manual processing of OSCs or eliminates it completely. Another contributor to an optimally balanced line is the powerful CP20 placement head, the latest generation of which can process components that are one millimeter taller. This makes it possible to process a higher range of components at the beginning of the line, which in turn relieves subsequent machines.

Automation for the integrated smart factory

Integrating the placement of OSCs into the SMT line also enables this process to benefit from the wide-ranging capabilities of ASMPT’s flexible and manufacturer-independent Open Automation concept. In contrast to downstream manual processes, all production, product and component data is automatically recorded during the placement process and transmitted to the IT systems for seamless traceability and documentation. In addition, the productivity- and efficiency-enhancing applications of the WORKS smart shop floor management suite can also be used to their full extent for the OSC process – another important step toward the integrated smart factory.

End-of-line processing in the ‘Facts on Open automation’ livestream

What the ideal end-of-line machine must look like is the subject of our ‘Facts on Open Automation’ livestream on March 29, 2023. Host Laszlo Sereny and his studio guests will explain why component diversity and standardization are not mutually exclusive and prove this with illustrative examples from practical applications.

This ASMPT show format offers viewers each month a roughly half-hour English-language livestream around ASMPT’s Open Automation concept with live feeds from international SMT hot-spots, interviews with experts, practical examples from SMT productions, and much more.

More information about the “Facts on Open Automation” series of livestreams is available at https://facts-on-open-automation.smt.asmpt.events/.

NEUSS, GERMANY – Yamaha Motor Robotics Business, SMT Section held its annual distributor meeting at the Company headquarters in Neuss, Germany, February 7-9. Partners from across the European network gathered to discuss business performance, enhance their product knowledge and focus their energies for the coming year.

“We continue to strengthen our position in the market, thanks to the dedication of this great team,” said Daisuke Yoshihara, General Sales Manager, noting particularly positive response to the 1 STOP SMART SOLUTION that enhances cohesion between printing, placement, and inspection processes.

The delegates also benefited from learning opportunities, through practical demonstrations of the latest equipment features. They included a preview of forthcoming enhancements to the YSUP graphical software for machine control and factory management.

Moving to the prestigious Hotel De Medici in Dusseldorf for day two, the meeting brought everyone up to speed with Yamaha’s product and sales strategies for the coming year.

The event closed by presenting the annual distributor awards, which recognise outstanding performances over the past year. Mancini Enterprise, Yamaha’s distributor in Italy, Albania, and Croatia, received the Most Valuable Distributor Award 2022 for its excellent annual sales.

Mindaugas Pališaitis from Etama received the Best Service Award 2022, recognising the team’s support for customers in Latvia and Lithuania. Thomas Metz, Yamaha’s SMT Manager Operations presenting the award, highlighted the long-term value gained from nurturing customer confidence thanks to a knowlegable team.

Slawomir Florian, Yamaha Area Sales Manager for East Europe presented the Special Achievement Award 2022 to Amtest. The distributor for Bulgaria received the commendation for growing the local market, both for Yamaha’s YS-series printing, placement, and inspection machines as well as complete 1 STOP SMART SOLUTION lines.