ISLE OF WIGHT, UNITED KINGDOM – EVS International, the leader in solder recovery, is pleased to announce its 20-year anniversary. The company attributes its contribution to reducing the carbon footprint and providing a rapid ROI as the main drivers of its success over the past 20 years.

EVS International develops and manufactures environmentally friendly and innovative solutions to address the production of dross created by all wave solder machines. The EVS range of environmentally friendly Solder Recovery Systems enhances its customers’ ISO 14001 credentials by recovering pure solder from dross, therefore reducing their carbon footprint. The company has won more than 25 international awards, including best product, best environmental product, and most innovative product.

“EVS is proud of its 20 years in the business and over these 20 years our customers have saved millions of dollars in solder and helped reduce waste, which is good for the environment,” stated Simon Norman, Business Director. “Solder prices are at an all-time high and EVS is going from strength to strength developing new machines to recover solder and save our customers money.”

EVS International works closely with its customers so that a complete understanding of manufacturing requirements results in a support service tailored to shop floor requirements. Being number one in its market segment gives EVS an advantageous insight into its customers’ need of fast ROI and user- friendly operation.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com.

ROME, NY – The EOS/ESD Association, Inc. (ESDA) announces the release of ESD and Latch-up Challenges – An Outlook until 2030, a white paper focused on four essential areas to enable the technical advances of the coming years. EOS/ESD Association, Inc. provides a vision and roadmap for research and development (R&D) and education in the field of ESD and latch-up. The document guides academic institutions and research centers toward the relevant topics in ESD and latch-up. The white paper further provides a framework and the background for successful applications for R&D funding by academic institutions. Each topic is introduced together with the individual research challenges that need to be solved in the coming years to advance the knowledge in ESD and latch-up.

The European Union (EU) commission and the United States (US) government are stimulating their home-grown semiconductor manufacturing capabilities and capacities. For this effort, they strongly support the expansion of European and American semiconductor manufacturing, including constructing new semiconductor production facilities in the EU member countries and the US.

The White Paper identifies research challenges, provides an industry outlook, and establishes collaborations across industry and academia in the field of electrostatic discharge (ESD) and latch-up. In support of digitalization and decarbonization in a transforming worldwide economy, the white paper addresses essential areas necessary for these critical technical advances.

Executive Director Lisa Pimpinella of EOS/ESD Association, Inc. said, “The EOS/ESD Association, Inc. is the independent association with the technical expertise to provide the roadmap for research and development (R&D) and education in electrostatic discharge (ESD) and latch-up. We support academia in their funding efforts as they define proposals addressing the topics named in this White Paper. As an association that combines representatives from all of the major semiconductor companies in the world, we want to highlight the criticality of research, development, education, and funding to ensure electrostatic discharge is recognized and the major thrust behind reliability.”

The White Paper consists of four focus areas essential for technological advances of the future. Advances in CMOS technologies, applications of new materials such as III/V compound semiconductors, Electrical Design Automation (EDA), and an outlook on challenges in ESD manufacturing control and testing.

EOS/ESD Association, Inc., founded and located in Rome, NY, in 1982, focuses on providing electrostatic discharge awareness, education, controls, and prevention.

Details of the White Paper can be found at https://www.esda.org/store/white-papers/product/379/eosesd-association- inc-white-paper-esd-and-latch-up-challenges-an-outlook-until-2030. For more information please refer to www.esda.org, or contact Lisa Pimpinella, Executive Director via e-mail at lpimpinella@esda.org, or call (315) 339-6937.

MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping and contract PCB assembly, announced that Brian Tharp has been added to the STI Team as Quality Manager.

Tharp brings with him seven years of experience as quality process auditor/trainer and logistics administrator. He was certified as lead auditor under AS9100 Rev. D & ISO 9001:2015 standards as well as certified in IPC A-610 for the electronics industry. As lead audit, Tharp reviewed meetings with engineers, technicians, operators and supervisors to address process findings and collaborate to find viable solutions to identified issues.

Tharp earned his Master’s Degree in Strategic Leadership and Business Analytics and a Bachelor’s of Science in Business Management. He will be an asset to the STI team, ensuring its customers receive the experience and knowledge needed to provide quality products and services.

FOUNTAIN INN, SC – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to announce that its MIL-PRF-32535 BME NP0 MLCCs have been approved to the Defense Logistics Agency (DLA) Qualified Products Database (QPD).

The new MIL-PRF-32535 BME NP0 MLCCs have higher CV capabilities than standard surface-mount PME MLCCs qualified to military and aerospace specifications and are currently available in “M” and “T” reliability levels and 0402, 0603, and 0805 case sizes and rated for 68–1,500pF and 4–100V. These small, high-CV MLCCs enable revolutionary board space, weight, and component count reductions. They also feature KYOCERA AVX’s patented FLEXITERM® termination technology, which, compared to standard terminations, significantly enhances resistance to the thermomechanical stresses experienced during assembly and operation.

MIL-PRF-32535 BME NP0 MLCCs are approved for use in high-reliability military and aerospace applications including filtering, tuning, decoupling, timing, and blocking circuits.

“We have been honing and perfecting best-in-class BME MLCC technology since the 1990s and are proud to further extend our portfolio of tested and proven high-CV solutions qualified for use in high-reliability military and aerospace applications,” said Michael Conway, Product & Marketing Manager – High-Reliability Components, KYOCERA AVX. “The new MIL-PRF-32535 BME NP0 series is the latest development in our enduring mission to meet our high-rel customers’ needs. It satisfies a growing demand for smaller, high-CV, military-qualified capacitor technology, and we will continue to expand this product range and this portfolio to meet the ever-evolving demands of the global military and aerospace industry.”

Lead time for the series is currently 22 weeks for M-level reliability parts (Group A) and 38 weeks for T-level reliability parts (Groups A and B). However, lead times could be shorter if the parts are in stock at an authorized distributor, such as Avnet, Arrow, and TTI.

For prototype and verification designs, KYOCERA AVX recommends the use of its Engineering Module (EM) Range X7R BME MLCCs for non-flight prototypes. This series covers capacitors in the ESCC 3009041, NASA S311-P838, and MIL 32535 ranges and uses the same materials as the fully qualified part numbers, just without the final DLA and European Space Components Coordination (ESCC) testing and screening processes and QPD/QPL listings, so it’s available with shorter lead times.