CLINTON, NY – Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in and test at TestConX 2024, March 3-6 in Mesa, Ariz., U.S.

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase selections from its array of high-performance metal TIM solutions.

Renowned for their superior thermal conductivity compared to non-metals, Indium Corporation’s indium-containing TIMs for burn-in and test stand out, with pure indium metal delivering 86W/mK. These TIMs are available in various forms, including pure indium, indium-silver alloys, and indium-tin. The pure indium TIM can be optionally clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent indium from adhering to the surface. Indium Corporation’s suite of standard Heat-Spring® solutions, which feature a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® HSD

• The original and best standard option for interfaces with flat, smooth and parallel surfaces.
• Designed for interfaces with tight surface control >30psi

Heat-Spring® High Profile Preforms

• Patterned to optimize contact with non-planar surfaces delivering 86W/mK
• Ideal for assemblies with an extruded, unfished heatsink
• Recommended for immersion cooling and Burn-In applications
• Provides uniform contact between the burn-in head and the DUT
• Provides more uniform thermal conductivity
• Recyclable and reclaimable

Heat-Spring® HSK

• Recommended specifically for burn-in applications where multiple insertions are required
• Provides uniform contact with low resistance for high-density heat loads
• Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
• No staining or cracking

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX or online at indium.com/TIM

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

With his extensive experience and expertise in the field, Sr. Applications Engineer, Ravi Parthasarathy will delve into the challenges and solutions related to defluxing strategies for high-density advanced packaging. The presentation will focus on the unique demands of ultra-fine pitch die on CoWs, providing valuable insights and practical approaches to enhance cleaning processes.

ZESTRON is at the forefront of developing cutting-edge solutions for precision cleaning and Ravi’s presentation aligns perfectly with the company's commitment to advancing industry knowledge and addressing emerging challenges.

ZESTRON invites all DPC attendees to join Ravi Parthasarathy's presentation on Thursday, March 21, from 10:30 AM to 11:30 AM, and visit the ZESTRON booth to learn more about their state-of-the-art precision cleaning solutions.

CLINTON, NY – As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at productronica China, March 20-22, in Shanghai.

With nearly a decade of experience in EV manufacturing and more than 10 million EVs on the road with its innovative materials, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions proven to reduce manufacturers’ time to market. Rel-ion material solutions deliver reliability by:

• Eliminating non-wet opens and head-in-pillow defects
• Preventing dendritic growth by meeting stricter surface insulation resistance requirements
• Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
• Reducing hot spots-induced voiding through improved thermal efficiency

Some of the Rel-ion products featured at Productronica China will include:

• Durafuse® HR – based on a novel alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications.
• Award-winning Durafuse® LT – a novel solder paste mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
• Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK® – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK® is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
• QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE™ range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die-attach and substrate attach in power electronics.
• Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
• Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.

To learn why Indium Corporation is trusted by top EV manufacturers across the globe, visit them at booth E4.4102 or at www.indiumchina.cn

POOLE, UK – Europlacer has signed a global partnership agreement with Siemens, provider of the industry’s leading electronics manufacturing software solutions, to integrate Valor Process Preparation software into its Surface Mount assembly platforms and products worldwide.

The integration of Valor Process Preparation software boosts manufacturing productivity by offering a seamless transition from design to programming of all equipment in the SMT assembly line. The software supports a wide range of assembly machines and product types, allowing Europlacer customers to streamline programming along the length of the line from a variety of data sources and formats, including Gerber, ODB++, IPC2581 and other popular protocols.

Companies like EMS providers and Contract Electronic Manufacturers operating in high-mix environments will leverage the automation, simplification and time savings offered by the Valor software and benefit from true commercial value. It elevates the NPI process to a completely new level.

“Our customers can take any design file and automatically create the programming not only for the Europlacer pick & place machine and screen printer but for all other products in a full SMT line,” explains François Erceau, Group Strategic Direction and Marketing Officer at Europlacer. “Integrating the Valor software further extends our capability to deliver comprehensive full-line solutions globally,” he adds.

“I am excited about this new partnership with the Europlacer Group,” says Jeremy Schitter, Product Line Director at Siemens Digital Industry Software. “Common customers worldwide will benefit from the industry-leading PCB assembly digitalization platform to accelerate the NPI process. The Digital Twin methodology is a must for every customer operating in high-mix environments and looking to enable right-first-time programming to significantly improve their shopfloor operations”, he adds.