PLYMOUTH, UK – Bentec is pleased to announce that Incap Electronics UK Ltd. purchased a Mirtec MV- 3XL OMNI with increased maximum PCB load size, angled cameras and Z-axis.

“Incap is one of Europe’s top EMS companies. As such we are delighted that Incap have decided to continue with their long-established partnership with Mirtec over the last decade,” said David Bennett Managing Director Bentec Ltd. “By deploying Mirtec’s leading 3D Inspection technology, the company can continue to offer their recognised high-quality service to customers.”

Incap Corporation is a trusted partner and full-service electronics manufacturing services provider. As a global EMS company, Incap supports customers ranging from large multinationals and mid-sized companies to small start-ups in their complete manufacturing value chain. Incap offers state-of-the-art technology backed by entrepreneurial culture and highly qualified personnel. The company has operations in Finland, Estonia, India, Slovakia, UK and Hong Kong. Employing approximately 2,500 people across the group.

“We decided to make this investment in our machinery to better meet customer demand and to support our company’s growth. Technology is changing rapidly, and we see that investing in a new Mirtec AOI machine allows us to provide the highest quality capability and standards,” said Dave Elms, Technical Director.

The MV-3XL OMNI Desktop 3D AOI machine is configured with the same hardware and software as Mirtec’s inline OMNI-VISION ® 3D inspection systems, providing 100% compatibility across Mirtec’s 3D AOI product line. The MV-3XL OMNI is a variant of the MV-3 OMNI for customers such as Incap that require a larger maximum PCB load size of 660 x 510 mm (as opposed to 450 x 400 mm). The system features OMNI-VISION ® 3D inspection technology that combines 15-megapixel CoaXPress camera technology with the company’s revolutionary digital tri-frequency Moiré 3D system in a cost-effective platform. The 15-megapixel CoaXPress vision system is a proprietary camera system designed for use with its complete product range of 3D inspection systems. Mirtec’s 12 projection digital tri- frequency Moiré technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post-reflow. Fully configured, the Mirtec MV-3 OMNI machine features four 10-megapixel sideview cameras in addition to the 15-megapixel top-down camera and multifunction AOI/SPI inspection capability.

To find out more about Incap Electronics UK Ltd., visit the company at www.incapcorp.com. For further information about Mirtec, visit www.bentec-int.com/mirtec-aoi-systems/ 

FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, will exhibit at Southern Manufacturing & Electronics 2023, scheduled to take place Feb. 7-9, 2023 at the Farnborough International Exhibition Centre. The company will showcase the AutoSIR2+™ Surface Insulation Resistance Testing System and a new CM+ Series demo unit in Stand L90. Additionally, AOI systems from MEK Europe BV will be on display.

Gen3’s AutoSIR2+™ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows state- of-the-art accuracy resistance measurements to be made up to 10¹⁴ Ω.

One AutoSIR2+ chassis can hold between 1 to 16 measurement cards and can monitor up to 256 x 2- point test patterns or 78 x 5-point test patterns, or 32 x 9-point test patterns at selectable intervals from minutes to days. Each channel is current limited (1 M Ω), which encourages growth of dendrites for failure analysis. The frequent monitoring capability provides a full picture of the electrochemical reactions taking place on a circuit assembly, and provides early trend analysis enabling tests to be curtailed, thus saving considerable test time and money.

Also on display the 6 Sigma verified CM+ Series is the world’s first combined ROSE and Process Ionic Contamination Tester (PICT). The industry-leading system, also a Global award winner, measures the amount of ionic contamination in accordance with all existing test methods, often referred to as ROSE testing, as well as Process Ionic Contamination Testing (PICT) test.

The CM+ series is available in five different models and tank sizes – when selecting a Test System, it is important to use the smallest possible tank size for the circuit under test. For the first time ever Gen3 will be demonstrating how the CM works, providing an inside tutorial to ionic contamination. Don’t miss this unique, show stopping, piece of equipment, stop by stand L90.

Gen3 recently launched the new Objective Evidence website. This site details the requirements from the latest J Std 001 Rev H which can be met by the combination of the AutoSIR and PICT test. The AutoSIR can perform the initial qualification, and then the PICT test can be used to demonstrate ongoing conformity to the primary setup using the SIR technique.

For more information about Objective Evidence, visit www.objectiveevidence.org 

For more information about Gen3, visit www.gen3systems.com 

SANTA CLARA, CA – Promex Industries, a Silicon Valley–based provider of advanced design, packaging, and microelectronics assembly services, today announced the next key addition to its die-bonding service capabilities: a Finetech FINEPLACER® sigma advanced sub-micron bonder. Designed to deliver high placement accuracy for an array of processes (flip chip, wafer-level packaging, package stacking, and chip-on-glass/flex/board, to name a few), the FINEPLACER® sigma system was received at the Promex facility in December.

The FINEPLACER® sigma purchase is the second Finetech system selected by Promex, joining a FINEPLACER® pico system purchased in 2019. The new sigma system delivers several features that will further benefit Promex customers seeking die bonding for precision bonding requirements in optical, medical, biotech, automotive, and other applications.

Combining sub-micron placement accuracy with a 450 mm x 150 mm working area and bonding forces up to 1000 N, the sigma system features a modular design for valuable flexibility. Modules can be easily combined or exchanged to pursue various projects within a single tool. Key technologies that can be performed, depending on the modules selected, include sintering, thermocompression bonding, ultrasonic bonding, eutectic soldering, adhesive bonding, and precision vacuum die bonding.

Placing small devices on large substrates is achieved via the FINEPLACER® sigma’s ultra-high-definition FPXVisionTM vision alignment system. FPXVisionTM allows the smallest structures to be viewed across the entire field of view, at the highest magnification, and enables pattern recognition with manual bonder alignment across a large bonding area.

“Choosing our next-generation sub-micron FINEPLACER® sigma illustrates the trust that Promex places in us and our bonding-technology expertise,” stated Neil O’Brien, General Manager, with Finetech. “We look forward to continuing to work closely with Promex as they bring the sigma system online and are able to share the benefits with its vital customer base.”

“The FINEPLACER® sigma is a perfectly paired addition to our Finetech FINEPLACER® pico and extends our extreme placement accuracy and control to the next level,” said Chip Greely, vice president of engineering for Promex. “We’re excited about the additional capability and capacity we now have available to support our customer’s precision flip chip and placement needs.”

CLINTON, NY – Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.

In this role, Wang leads the China sales team and is responsible for all sales in the China region. He works with multiple departments to develop sales strategies and facilitate strong connections to customers throughout China.

Wang has more than 10 years of sales and multinational account management experience with focused knowledge of the semiconductor assembly and automotive electronic business sectors. Prior to joining Indium Corporation, he worked as vice sales director for assembly materials, bonding wires, DCB substrate, and thick films products at a German global materials company. Wang earned his bachelor’s degree in Medicine English at Sichuan University.