Press Releases
NORTHBROOK, IL ― Impossible Objects today announced that it awarded three of its manufacturers’ representatives for exceptional sales during the 2023 IPC APEX EXPO at the San Diego Convention Center in California. The company presented awards to Josh Casper of Horizon Sales, Don Dennison of PIT Equipment Services, LLC and Mike Gunderson of MaRC Technologies.
“Impossible Objects’ rapid growth in 2022 was made possible thanks to the outstanding efforts of our reps, Josh, Don, and Mike," said Dan Migely, Impossible Objects. "Their deep industry knowledge and connections, combined with their commitment to providing customer-focused solutions and embracing cutting-edge technologies, were key factors in our success this year.”
Horizon Sales manages and sells to the following states: Michigan, Ohio, Indiana, Kentucky, Western Pennsylvania, Illinois, Eastern Iowa, Wisconsin and Florida. The company has grown from a one-man operation to an entire group of people covering multiple states, and a corporate office and warehouse that houses a machine demonstration area and facilities for the sale and distribution of materials, equipment and supplies used in the SMT industry. The team at Horizon takes great pride in its ability to maintain a strong customer base as a well as the stability and longevity of its core product lines.
Global SMT’s award-winning Rep of the Year for 2022, Don Dennison of PIT Equipment Services, LLC, represents Impossible Objects on the East Coast. PIT started in 1988 with a mission to assist electronic assembly companies in the New York/New Jersey/Eastern Pennsylvania metropolitan area. Their extensive product knowledge and strategic customer relationships have made them a key supplier and long-term partner to companies down the east coast. The key to their long-term success is their service and support of each product sold.
Mike Gunderson and the team at MaRC Technologies provide sales and service for Impossible Objects’ customers in the Pacific Northwestern states of: Oregon, Washington, Idaho and Northern California. MaRC Technologies is a specialized supplier of tools and supplies for the electronics manufacturing and high-tech industry.
Impossible Objects 3D prints composite tools and parts that would normally be machined or injected molded. Their high-speed, high-performance low-labor CBAM process is perfect for NPI projects, since it is able to both produce inexpensive complex quality tools for customers in less than a week and be cost-effective in low-volume manufacturing of up to 10,000 units when compared to injection molding. In particular, Impossible Objects can do low-cost prototyping with finished product quality.
To learn more about Impossible Objects, visit www.impossible-objects.com.
DURYEA, PA ― SMT Tooling, a division of PSA Systems, named its three top manufacturers’ representatives of the year for 2022 during the IPC APEX EXPO in San Diego. The company presented awards to Mike Gunderson of MaRC Technologies, Ron Torenko of Torenko & Associates, and Don Dennison of PIT Equipment Services, LLC.
“Our representatives are critical to our customers’ and our success!” states Jeffrey Pulaski, Project Manager, SMT Tooling. “I am thankful and proud to have Don, Mike and Ron’s expertise and support.”
Mike Gunderson and the team at MaRC Technologies provide sales and service for SMT Tooling customers in the Pacific Northwestern states of: Oregon, Washington, Idaho and Northern California. MaRC Technologies is a specialized supplier of tools and supplies for the electronics manufacturing and high-tech industry.
Torenko & Associates represents SMT Tooling’s Matrix™ Automatic SMT Support Tooling throughout Mexico. Over its 45 years in business Torenko has established strong relationships with its accounts and developed a reputation for being a leader in technology in the area. Torenko is headquartered in the Dallas/Fort Worth metroplex with other locations in the regional USA and Mexico. The company’s mission is straight-forward; Torenko & Associates strives to provide the best semiconductor, SMT manufacturing, test and repair solutions and service available.
Global SMT’s award-winning Rep of the Year for 2022, Don Dennison of PIT Equipment Services, LLC represents SMT Tooling on the east coast. PIT started in 1988 with a mission to assist electronic assembly companies in the New York / New Jersey / Eastern Pennsylvania metropolitan area. Their extensive product knowledge and strategic customer relationships have made them a key supplier and long-term partner to companies down the east coast. The key to their long-term success is their service and support of each product sold.
SMT Tooling’s Matrix system installs in minutes and includes the company’s proprietary pneumatic connections for quick and easy product changeover utilizing “Smart Touch” operator interface with on-screen operator instructions and access to PSA downloadable process apps. Features include feather-lite setup force and the most rigid locking force of any system in the industry.
The new and improved Matrix SMT tooling solution installs on most screen printers and placers in about 30 minutes and offers fully automatic PCB support to each consecutive board.
For more information about PSA Systems, visit www.smttooling.com.
CLINTON, NY — Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
Amongst the company’s award-winning portfolio of proven products for power electronics, Indium Corporation will feature:
- InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
- QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
- Durafuse™ HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse™ HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.
REDMOND, WA — Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will demonstrate significant performance improvements on the Lumen ® X programming platform for automotive grade Universal Flash Memory (UFS) devices with VerifyBoost™ and the latest evolution of the ConneX Service software platform for connected factory enablement in booth number 1334 at the IPC APEX Expo in San Diego, California from January 24th -26th.
About LumenX Programming Platform & VerifyBoost
VerifyBoost delivers rapid verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices for a massive 4.5x increase in performance. This enables our customers to immediately leverage existing production capacity for significant throughput gains, reduce the total cost of programming by up to 39% and maximize their existing investment in Data I/O’s programming technology. High-throughput PSV programming systems using LumenX programmers with high socket capacity and VerifyBoost enable manufacturers to use one PSV system to program what previously required multiple systems to produce. Learn more about VerifyBoost for LumenX programmers at www.dataio.com/VerifyBoost.
About ConneX Service Software
Electronics manufacturers, focused on operational efficiency to drive down costs and increase production capacity, are expanding their smart factory initiatives to integrate offline pre- programming processes into their Manufacturing Execution Systems (MES). ConneX enables customers to directly integrate data programming and security provisioning inputs and outputs between a Data I/O PSV programming system and an external application such as MES systems and analytics or web dashboards via industry standard protocols, to enable traceability, process analysis and two-way communication that improves factory efficiency and quality.
To show the power of ConneX, Data I/O will display an example of a factory monitoring application with samples of dashboards a customer can build by accessing key areas of data collected during the programming process including system status, availability, utilization, socket adapter usage statistics and more. Learn more about ConneX at www.dataio.com/Solutions/ConneX.
Customers attending the IPC APEX Expo in San Diego, California can visit Data I/O’s booth #1334 to see a demonstration of VerifyBoost for LumenX displaying up to 750 MBps performance, the ConneX Service Software with system monitoring dashboards and the PSV7000 and PSV5000 automated programming systems.
NEWARK, N.J. — Panasonic Connect North America will showcase its manufacturing solutions, including its newest NPM-GP/L screen printing machine and Auto-Setting Feeder at IPC APEX EXPO 2023. These new solutions allow the company to further aid manufacturing customers in their digital transformation processes and increase efficiency across their operations.
With the passing of the CHIPS Act, which includes $39 billion in manufacturing incentives, companies are reinvigorating their investments in their North American manufacturing plants so they can keep up with global demand. To do so, companies must implement emerging technologies, such as automation, into their production lines. Panasonic’s NPM-GP/L screen printing machine and Auto-Setting Feeder allow manufacturers to keep up with demand and future-proof their production lines by fixing issues in real- time.
At the Panasonic Connect booth #933, attendees have an opportunity to interact with several Panasonic manufacturing solutions, including:
- NPM-GP/L, a screen-printing machine that can be completely changed over in approximately four minutes, compared to the 10-minute industry standard. The NPM-GP/L can automatically implement production line changes with precise accuracy. An optional function can create a fully automatic printing process, supplying and collecting solder, reconfiguring pin support of the substrate, and undertaking a range of other processes required for production line changes. With this automation, production line changes can happen within a cycle time of approximately 12 seconds and with a printing accuracy of ±3.8 µm.
- Auto-Setting Feeder, an automated component supply system which offers the flexibility of easily fitting tape reels from 8mm up to 104mm in width. The Auto-Setting Feeder is the industry’s first feed mechanism that can automatically peel the cover on surface mount component tape between 4 mm and 104 mm wide. This enables the automatic supply of mounting components without requiring skilled workers. Further, when a reel of tape is finished, a loading unit automatically — and instantly — supplies the next reel. This facilitates full autonomy for the component supply process. Moreover, the use of a dedicated cart means that the current NPM and NPM-X series can support the Auto-Setting Feeder without restructuring the entire line.
The NPM-GP/L printer and the Auto-Setting Feeder provide a new level of speed, accuracy, and automatic process control for manufacturers. By implementing cutting-edge technologies which increase productivity, manufacturers can invest more time building a skilled workforce to handle higher level tasks. And with an estimated 2.1 million jobs expected to go unfilled by 2030, filling this talent pipeline is crucial.
Panasonic Connect is helping customers and industry professionals understand – and see – how automation enhances the future of manufacturing. Visit Panasonic Connect at IPC APEX EXPO 2023 booth #933. For more information visit: https://na.panasonic.com/us/event/apex-2023
ARLINGTON, VA -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce a new collaboration to establish a framework for the transfer of technology captured in an OCP-approved specification to JEDEC for inclusion in one of its standards. This alliance brings together members from both the OCP and JEDEC communities to share efforts in developing and maintaining global standards needed to advance the electronics industry.
Under this new alliance, the current effort will be to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification to become part of JEDEC JEP30: Part Model Guidelines for use with today’s EDA tools. With this updated JEDEC standard, expected to be published in 2023, Chiplet builders will be able to provide electronically a standardized Chiplet part description to their customers paving the way for automating System in Package (SiP) design and build using Chiplets. The description will include information needed by SiP builders such as Chiplet thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing the Chiplet in package, and security parameters.
“One of the key efforts at the OCP is centered around the need for specialized computation for AI and ML workloads driving the need for specialized silicon. To deliver on the need for specialized silicon while enabling a rapid pace of innovation, we believe a new open Chiplet economy with a low barrier to entry is needed and will require collaboration and standardizations on multiple dimensions, ensuring that companies are able to interact in an open efficient and scalable manner. The OCP has been investing in being a catalyst for an open Chiplet economy for several years through its Open Domain Specific Architecture (ODSA) Project and are pleased to establish this alliance with JEDEC to allow work done in ODSA to become part of a global international standard that advances the industry," said Cliff Grossner, Ph.D., VP Market Intelligence & innovation at the Open Compute Project Foundation.
There are many opportunities to create additional standardization efforts bringing together JEDEC’s strength in setting global standards for the microelectronics industry with OCP’s expertise in specifying system level devices seeding emerging technologies and markets, to set new global standards for novel device components in emerging markets eliminating market fragmentation and wasteful duplication of efforts by market participants.
“JEDEC is delighted to collaborate with the OCP to support our common goal to provide standards that serve the industry and move the market forward,” said John Kelly, President, JEDEC. “JEDEC and the OCP are united in our belief that standards developed in an open community and industry collaboration are essential to help foster efficient markets”.
“The silicon supply chain is diverse. It has to serve many vertical electronic equipment segments including Automotive, Personal Data Processing, Data Center and Enterprise Data Processing, Communications and Infrastructure, Medical, Defense, Aerospace and Industrial. Each market includes different value and application-specific requirements that need to be served. Processor suppliers have turned to highly heterogeneous chip platforms to remain competitive. This approach is becoming increasingly complex and costly to manufacture. In response to these challenges, chip builders have begun to adopt the use of chiplets. However, the same diversity that created the demand for chiplets, also makes it unlikely that any one supplier has the broad expertise to serve all these markets. Thus, many different Chiplet supply chains will emerge and no one solution will serve all markets. The emerging market around Chiplets will need many players and a low barrier to entry allowing for rapid innovation. Open communities sharing the effort for building common tools, prototypes, business workflows and standardizations are critical to accelerate a Chiplet Economy,” said Tom Hackenberg, Principal Analyst, Computing & Software Semiconductor, Memory and Computing Division, Yole Group
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