NEWMAN LAKE, WA — Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Elan Industries has finalized the purchase of a Hentec/RPS Vector 300 selective soldering system.

The Vector 300 is a compact selective soldering system with a small factory floor footprint and is ideally suited for 24/7 production, the same as the Vector 460 and Vector 600 models. The Vector 300 is fully lead-free compatible and features an integrated computer with unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector 300 is offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. The Vector 300 is UL and CE compliant and carries both a two-year system warranty and a four-year solder pot warranty.

NASHVILLE — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will celebrate the Sweet 16 of its world-famous Leaping Water Display at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California.

The display symbolizes the beauty of the convergence of science and care in a continuous, flowing movement of water that literally leaps back and forth in a captivating rhythm that never ceases to capture the amazement of onlookers. It also represents continuous improvement, like the KYZEN name (formed on the Japanese word KAIZEN).

KYZEN debuted Leaping Water for the first time at the 2007 IPC APEX EXPO in Los Angeles. The stunning presentation quickly grew in popularity to become a memorable part of every major industry tradeshow. Attendees’ appreciation of KYZEN’s Leaping Water sent it traveling across the oceans and around the world to be featured in Germany, Sweden, China, Australia, Asia and Mexico. Its luster has not faded over these past 16 years. It is captivating and draws the interest of all who see it, especially engineers who marvel with smiles at the visual display and the physics that make it work so beautifully.

Leaping Water also symbolizes KYZEN’s commitment to solving complex cleaning problems through the convergence of science and uncompromising care. This intentional approach nurtures innovation, which is a hallmark of the KYZEN brand.

For more than 32 years, KYZEN's focus has been to look at the complete process and work with customers to improve that process. Their aim is to ultimately increase yields, advance reliability and help to realize cost savings along the way. KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards, unrivaled in the industry.

Visit KYZEN in Booth #1545 during the IPC APEX EXPO to learn why. If you have trouble finding them – just look for the incredible Leaping Water!

To keep up with all the latest news regarding KYZEN at the IPC APEX EXPO and more, visit https://www.kyzen.com/about-kyzen/events/ 

DURYEA, PA — SMT Tooling, a division of PSA Systems, today announced that it will showcase its Matrix™ Automatic SMT Support Tooling system on a Hanwha/ESE printer during the 2023 IPC APEX EXPO. The company will demonstrate Matrix on the Hanwha/ESE US-2000DXH1 Screen Printer in Booth #1813 at the San Diego Convention Center in California.

“SMT Tooling is proud to support Hanwha’s line of printers and pick-and-place machines, and has a close relationship with Hanwha to grow and develop our line of components to accommodate specific needs presented to us,” stated Jeffrey Pulaski – SMT Tooling. “We look forward to continued success for both Hanwha and SMT Tooling.”

The unique Hanwha/ESE US-2000DXH1 Screen Printer is truly one of a kind in the market. The back-to-back configurable printer allows dual-lane processing for higher throughput., bar code recognition for setup verification, paperless cleaning (with environmentally friendly quick change-out cartridges that can be replaced is less than 5- seconds), and optional auto paste dispensing.

The stable and user-friendly operator interface includes Windows 10 and a 500GB hard drive. The fast and accurate Hanwha/ESE vision system for a simultaneous recognition of PCB and stencil (3-stage lighting for PCB, 1-stage lighting for stencil); any mark can be recognized/registered; auto calibration equipped.

The Matrix system installs in minutes and includes SMT Tooling’s’ proprietary pneumatic connections for quick and easy product changeover utilizing “Smart Touch” operator interface with on-screen operator instructions and access to PSA downloadable process apps. Features include feather-lite setup force and the most rigid locking force of any system in the industry.

SMT Tooling recognized the need for a more evenly spaced pin pattern when designing the latest version and formed the support modules with a diamond shaped pin pattern that fills in the gaps that contribute to "soft spots" in the support. The Matrix diamond grid pattern is key to a more even support in turn yielding much lower rate of defects like bridging etc.

The new and improved Matrix SMT tooling solution installs on most screen printers and placers in about 30 minutes and offers fully automatic PCB support to each consecutive board.

For more information about PSA Systems, visit www.smttooling.com 

TOKYO — Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Automotive powertrain and electric drive systems play critical roles in tackling our world’s energy and climate change challenges. The demand for higher efficiency of electrical drives in e-mobility to generate more travel distance or higher speed per battery loading requires perfectly matched materials providing high-temperature stability and maximum reliability. Heraeus offers innovative materials such as the Die Top System (DTS®), PowerCu Soft copper bonding wires and ribbons, mAgic® sinter pastes, lead-free solder pastes and metal ceramic substrates. These materials are perfectly matched to provide high temperature stability to exceed device reliability demands.

Mega trends such as 5G, artificial intelligence and high-performance computing continue to play a part in revolutionizing the semiconductor market. New material solutions are needed to meet the increasing demands and challenges of semiconductor advanced packaging. Specifically, three new products will be introduced from Heraeus Electronics – offering solutions to meet thermal dissipation, miniaturization and defect challenges.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. The new sinter paste, featuring fast sintering, high shear strength and high thermal conductivity, is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN) and other top-of-the-line power devices.

Welco AP520 is a state-of-the-art water-soluble type 7 printing paste designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables and electric vehicles.

AP500X is a water-soluble, halogen-zero tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

As part of its drive to achieve greater sustainability, Heraeus Electronics offers an extended product portfolio with gold bonding wire made with 100 percent recycled gold and Welco solder paste series made with 100 percent recycled tin. Both gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and IS014021:2016. Heraeus Materials Singapore also is certified with UL2809 in accordance with IS014021:2016.

With the latest materials portfolio and technical know-how, Heraeus Electronics is prepared to support customers in response to trends and challenges for EV (Electric Vehicles), 5G communications, IoT (Internet of things), AI (Artificial Intelligence), HPC (High Performance Computing) and environmental sustainability.

Visit Heraeus Electronics at booth #25-36 at 24th IC & Sensor Packaging Technology Expo at NEPCON Japan to explore more.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com