HANAU, GERMANY – Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus Printed Electronics, the worldwide only provider of a turnkey solution for digital inkjet printing on electronic components, offers metallic inks, deep process knowledge and printing systems. It complements the broad product portfolio of Heraeus to the electronics industry. The Prexonics ® technology enables selective printing on different substrates for a wide range of applications such as shielding against electromagnetic interference (EMI), printing of conductive structures and metallization for heat dissipation.

"This collaboration represents the missing piece in the mosaic of scaling to mass production for us, having recently passed the important milestone of fulfilling the broad functional requirements of the semiconductor industry with our ground-breaking technology," said Franz Vollmann, Head of Heraeus Printed Electronics. "By combining our core expertise in metallic specialty inks and digital printing processes with the scaling competence of our strong partner SUSS MicroTec, we are setting a new industry standard for mass production in the semiconductor market."

SUSS MicroTec, known for its advanced equipment and process solutions for semiconductor manufacturing, brings its leading-edge automation platform and industrial inkjet production capabilities to the table. Their high-volume production equipment, JETx, designed to integrate various printhead and substrate technologies, expands the application potential of Heraeus' digital printing technology. SUSS MicroTec´s high production capacity and excellent global sales and service network support the smooth transfer of the solution into high-volume manufacturing.

"The integration of Heraeus' breakthrough ink technology and digital printing capabilities with our robust automation platforms is a testimonial to our pursuit of excellence and innovation. We are confident that our combined efforts will result in unprecedented production efficiencies and costs in line with current and future market expectations," said Dr. Robert Wanninger, Senior Vice President Advanced Backend Solutions of SUSS MicroTec.

The scope of the collaboration calls for the development of equipment that integrates Heraeus' digital printing technology, image processing software and advanced ink technology into SUSS MicroTec's automation and JETx platform. The end goal is a state-of-the-art system with a competitive total cost of ownership (TCO) that not only sets new standards in the industry, but also aligns with Heraeus and SUSS MicroTec's vision of cost and performance optimization. The product of this partnership looks to redefine the boundaries of what is possible and push forward into a future where technology serves as the cornerstone for innovation and growth.

DIRKSLAND, NETHERLANDS – VDL TBP Electronics has announced a significant leap in production capacity and operational efficiency with the acquisition of a cutting-edge ASMPT SMT assembly line, sourced through Partnertec. This strategic move is poised to meet soaring customer demand and reinforce the company's industry stature, while also fostering greater synergy with Rena Electronica. With the new assembly line becoming operational in May, VDL TBP aims to adapt more fluidly to market dynamics and enhance service delivery.

Strategic Investment for Enhanced Production

The decision to invest in the ASMPT SMT assembly line marks a pivotal moment for VDL TBP Electronics. It reflects not only a commitment to leveraging advanced technology for improved output but also an understanding of the critical role such investments play in maintaining competitive edge. This state-of-the-art equipment is designed to significantly upscale the company's manufacturing capabilities, ensuring that customer demands are met with efficiency and precision. By doing so, VDL TBP Electronics is set to solidify its position as a leader in the electronics manufacturing sector.

Meeting Customer Demand with Cutting-Edge Technology

The electronics industry is characterized by rapid innovation and evolving customer needs. VDL TBP Electronics' investment in the ASMPT SMT assembly line is a response to these challenges, enabling the company to boost its production capacity and meet the increasingly complex demands of its customers. The new assembly line incorporates the latest advancements in surface mount technology (SMT), which, as highlighted in a recent study, is crucial for enhancing the quality and reliability of electronic components through improved inspection techniques and failure analysis. This move not only enhances VDL TBP's operational efficiency but also ensures the production of high-quality, reliable products.

Enhancing Synergy and Market Responsiveness

The collaboration between VDL TBP Electronics and Rena Electronica is set to benefit significantly from this new investment. By incorporating ASMPT's advanced SMT assembly line, both companies can expect to see enhanced synergy in their operations, leading to more streamlined processes and improved product offerings. Moreover, the ability to respond more adeptly to changing market conditions signifies a strategic advantage. With this enhanced capacity, VDL TBP Electronics is better positioned to bring its assembly services to market more effectively, catering to the fast-paced demands of the electronics industry.

As VDL TBP Electronics embarks on this new chapter with the ASMPT SMT assembly line, the implications for the company and its partners are profound. This investment not only underscores a commitment to excellence and innovation but also sets a new benchmark for manufacturing efficiency in the electronics sector. As the assembly line becomes operational, the industry will keenly watch the ripple effects of this strategic move, anticipating the broader impacts on production quality, customer satisfaction, and market competitiveness. Through foresight and technological adoption, VDL TBP Electronics is charting a course for sustained growth and industry leadership.

WASHINGTON – The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.

Integrated circuit substrates are a critical part of the technology stack that powers the microelectronics that make modern life possible. Semiconductors, substrates and printed circuit boards (PCBs) make up the stack that every electronic device needs to function.

PCBAA Executive Director David Schild said, “This is an important expansion of the work being done at the CHIPS program to reshore the industries we invented here in America but long ago offshored. To build a secure and resilient supply chain for all elements of the technology stack, we need a robust American capacity to manufacture all three: semiconductors, IC substrates and PCBs. That’s why we say ‘Chips Don’t Float’. The third element of the technology stack also needs government investment. We are calling on Congress to pass H.R. 3249, the Protecting Circuit Boards and Substrates Act, which would provide $3 billion to fund factory construction, workforce development and R&D along with a 25% tax credit for purchasers of American-made PCBs and substrates.”

PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is excited to announce its participation alongside Comtree at EPTECH Toronto, scheduled to take place Wednesday, April 17, 2024 at the Sheraton Parkway Toronto North. As trusted partners, representatives from Comtree will be on hand to engage with attendees and discuss Ersa's comprehensive range of solutions tailored for the electronics manufacturing industry.

A key highlight of Kurtz Ersa's offerings at EPTECH Toronto is its patented IR rework technology. This groundbreaking technology has earned a reputation for consistently delivering outstanding results, even in the most challenging rework applications. With a proven track record of benefiting countless users worldwide, Ersa's IR rework systems have become synonymous with reliability, efficiency, and unmatched performance. Their remarkable cost-to- performance ratio makes them the preferred choice for electronics manufacturers seeking superior rework solutions.

Visitors to the event can expect to explore a diverse range of Ersa's rework and soldering systems, all of which showcase the brand's signature superiority and adaptability. Kurtz Ersa has set the benchmark for high-end reflow ovens. Notably, the HOTFLOW series boasts impressive energy savings of up to 25 percent, along with a remarkable 20 percent reduction in N2 consumption.

Comtree represents Ersa throughout Canada. For more information about Comtree, e-mail Ernesto Provenzano at ernesto@comtreeinc.com, Graham Gibson P.Eng. at graham@comtreeinc.com, or call 905 673-7777.

For more information about Kurtz Ersa Inc., visit www.ersa.com