VISTA, CA — Machine Vision Products, Inc will be exhibiting on booth 924 at the IPC Apex Expo in the San Diego Convention Center between January 24-26.

MVP will be demonstrating its latest ground-breaking software release containing major new inspection capabilities for inspection and metrology across a broad range of MicroElectronic, Semiconductor, and SMT applications. For Microelectronics inspection, MVP will be demonstrating both Hybrid/MCM Style Wirebond and RF product inspections. A preview of our latest AI/Deep Learning integration will also feature. We look forward to discussing your inspection requirements at our booth at the forthcoming IPC Apex show.

MVP continues to be a leader of AOI innovation, applicable to the most complex inspection challenges. With inspection platforms for Microelectronics, Semiconductor, and SMT, MVP continue to be versatile and adaptable for multiple inspection challenges and material handling formats.

In anticipation of the show Dr. George T. Ayoub, President of MVP said "The newly released 8.1 software elevates the AOI inspection experience to new levels. In effect, with 8.1 software release, MVP has added major inspection capabilities to its extensive toolbox. Among other notable innovations in this release, MVP has revamped all of its algorithms, enhancing them with new power and fusing them all into one common framework with a unified interactive user interface that is completely graphical (GTilt). As a result, the benefits to the user are ease of tuning, ease of learning and improved performance across the board for all applications. In addition, the program generation has been enhanced and streamlined to quickly and easily generate recipes programs in a step-by-step guided approach.

MVP is also demonstrating a preliminary version of its 8.3 software highlighting a brand-new, friendly user interface for the operator and programmer. 8.3 software will also showcase Artificial Intelligence (Deep Learning) module that integrates seamlessly with Cognex's VisionPro Deep Learning software suite providing exceptional capabilities in AI when needed.

With these landmark releases of software, MVP strengthens its leadership position in the AOI market in general and in the wire bond market, metrology, and surface inspection markets in particular. We feel confident that the software additions will be well received by all customers."

For more information about the new capabilities, and to learn more about the applications on the systems beyond what is described here, please contact MVP directly for more info by enquiring on its website www.visionpro.com/info or talking to any of its representatives in the show.

WATERBURY, CT — As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next- generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha’s technology supply chain is fully optimized with over 3,000 employees worldwide, servicing customers in over 50 countries with local and regional services, a rapid delivery time, lower manufacturing costs, and a seamless ‘start to finish’ experience. Combining strength in critical markets such as 5G, automotive and EV, military, aerospace, medical devices, and consumer goods, with world-class technologies and unrivaled, 24/7 technical support, MacDermid Alpha’s family of brands includes Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone.

Julia Murray, Senior Vice President of Marketing at MacDermid Alpha, comments, “We are in a unique position to offer the electronics community a complete ‘start to finish’ technology roadmap with some of the most advanced circuitry, assembly, and semiconductor technologies on the market. We are helping our customers redefine what’s possible and leverage capabilities to the next level. This is something we’re very excited about and we will be showcasing solutions from our 3 cornerstone divisions during the show.”

MacDermid Alpha will also present 4 separate technical papers on lightweight materials, solder alloy performance in automotives following vibration tests, surface finish performance for next- generation technology and assess the performance of assemblies coated with state-of-the-art materials as opposed to standard conformal coatings used by manufacturers. Each technical paper will provide audiences with groundbreaking findings that unlock, explore and unveil new test data.

Visit the MacDermid Alpha team at booth 1933 to find out how to power up complete electronics interconnection solutions. For further information, please visit www.macdermidalpha.com

AUSTIN, TX ― Cetec ERP, a leading cloud ERP software provider, is pleased to announce that Jordan Jolly, Director of Sales and Implementation, will host a round table during the Wiring Harness Manufacturer’s Association (WHMA) Conference. The event is scheduled to take place Feb. 14-16, 2023 in Albuquerque, New Mexico.

Jolly will host the round table discussion entitled, ‘Making ERP Less Evil: An ERP Best Practices on Wednesday, Feb. 15th . ERP systems might be described as a "necessary evil". If they are necessary, in what ways do you think they could be made less evil? What lessons have you learned over the years?

Jolly has been directing ERP implementations for the electronics industry for more than 10 years, and has seen numerous different situations, successes and failures. He would love to share those experiences with a round table and potentially learn from others’ experiences as well.

Over the past 30 years, the WHMA Annual Wire Harness Conference has become one of few investments that give an opportunity to learn, grow, share, and discover new approaches to many aspects of the wire harness industry. The conference features a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. It also includes peer-to-peer networking, best-practices roundtables, a technical education workshop and an Exhibit Hall with industry leading suppliers. It’s a conference you do not want to miss! Cetec ERP’s leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription.

To learn more about Cetec ERP, visit http://cetecerp.com/ 

HELSINKI — Incap Estonia upgraded its two current SMT production lines and added a third SMT line to its factory in Kuressaare. The EUR 1.35 million investment increases the factory’s overall SMT production capacity by more than 50%.

According to Margus Jakobson, the Interim Managing Director of Incap Estonia, the investment in SMT (surface-mount technology) supports the company’s rapid growth and flexibility in customer service. New electronics equipment in the Kuressaare factory was acquired from SMT Renting on a long-term lease agreement.

“We decided to upgrade two existing production lines to make the production process faster. The third 30-meter long line will help to increase our SMT production capacity and increase it by more than 50%,” Jakobson explained. The new production machinery will contribute significantly to the production of the most important part of electronic devices.

Incap Estonia is part of Incap Corporation, which is an international contract manufacturer. Electronics manufactured by Incap Estonia can be found for example in smart meters, in light electric vehicles on the streets, in smart led lights in different regions in Estonia as well as in the machinery of the world’s most famous maritime company.