CLINTON, NY – Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles.

O’Leary’s presentation, scheduled for 11:40 a.m.–12:05 p.m. on March 29, is titled U.S. Charging 2.0: Building a More Reliable Public Infrastructure. The presentation will address the main issues causing the current 70–80% of public uptime performance for EV chargers, while defining what 97% uptime performance means. O’Leary will also review best practices for building a more reliable public charging infrastructure.

O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, and battery energy storage systems. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on electronics manufacturing and currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, O'Leary co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

NEUSS, GERMANY – Yamaha Motor Robotics SMT Section is bringing its 1 STOP SMART SOLUTION to SMTconnect 2023 in Nuremberg, May 9-11, with innovations to ease program generation, cut cycle time, and accelerate product changes.

Promoting its collaboration with ANS-ANSWER ELEKTRONIK, the appointed regional distributor for Germany, Yamaha will be at booth 245, hall 4. The presentation showcases the YSP10 printer, YSi-SP solder-paste inspection system, YRM20 mounter, and YRi-V Automatic Optical Inspection (AOI) system. A special software area will highlight YSUP tools for machine control, smart factory management, and AOI programming.

“SMTconnect is a valuable opportunity to make new connections and strenghten our bonds with existing customers and contacts,” said Daisuke Yoshihara, Sales General Manager at Yamaha Motor Europe, Robotics Division. “We’re pleased to extend cooperation with our distributor by sharing space this year. As always, our experts will be there to help visitors discover how Yamaha’s solutions save labour, raise quality, and increase productivity.”

The YSP10 printer combines Yamaha’s proven technologies for superior accuracy with advanced features including the fully automated stencil mechanism for faster, easier product changeovers. The YRM20 is Yamaha’s latest-generation high- speed mounter, with up to 115,000 cph placement speed, dual-head capability, and automated features for non-stop changeovers. The YRi-V inspection system handles modern, densely populated boards, with enhanced lighting, 4D camera algorithms to spot hard-to-find defects, and high-speed image processing, for superior speed and accuracy.

In the software area, visitors can see how Yamaha’s YSUP tools maximise the value of the 1 STOP SMART SOLUTION. Powerful features include the state-of- the-art 3D graphical interface and the richly featured dashboard for tracking equipment status and process performance. Yamaha’s advanced AOI software generates inspection programs automatically and leverages AI to simplify component recognition and enhance image analysis.

For more information, please visit the website at https://smt.yamaha-motor-im.de/ 

REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, and Nuvoton Technology Corporation Japan partner to enable security deployment services for Nuvoton’s M2354 Series-based IoT Security Microcontroller (MCU) series using Data I/O’s SentriX® security deployment platform. The collaboration enables OEMs designing solutions such as building automation, metering, medical and many other applications with high-security requirements to simplify the deployment of IoT security using Data I/O’s SentriX Product Creator TM software tool.

New connected device-based revenue models require trusted data and trusted devices to enable data-driven services and to protect physical systems. Protecting and securing device firmware and data requires robust hardware-based security. Traditionally, defining provisioning and deploying IoT device security in mass production has been complex and required disparate tools and processes. The SentriX Product Creator tool simplifies IoT security by delivering pre- configured security deployment profiles for the most popular IoT use cases such as device identity, cloud onboarding, secure boot, firmware encryption, mutual authentication and more. The SentriX Product Creator pre-configured profiles present the most popular security features of the M2354 Series. Nuvoton’s M2354 Series inherits the security features of the M2351 Series that have PSA Certified Level 1, Level 2, and PSA Functional API Certified. The M2354 Series is an Arm® Cortex®-M23 based IoT Security MCU that leverages Armv8-M TrustZone hardware-enforced isolation. Nuvoton and Data I/O are partnering to enable security deployment services starting with Nuvoton M2354 Series support. With SentriX support, OEMs can leverage M2354 Series and quickly and cost-effectively deploy the security capabilities through robust provisioning in mass production. The predefined use cases streamline the security product definition process for OEMs by presenting the most common security use cases for connected device security in an intuitive user interface.

“As new services and applications for IoT markets expand, OEMs require a simplified process to define and deploy hardware-based security into their products during manufacturing. We are excited to collaborate with Nuvoton to support the M2354 Series on the SentriX platform,” said Michael Tidwell, vice president of marketing and business development at Data I/O Corporation. “The SentriX security deployment platform enables OEMs to easily define security profiles and provision M2354 Series at the chip level before the device goes to the manufacturing line for board assembly. Because the SentriX platform is scalable and is supported globally through SentriX service provider partners, OEMs with low or high volume can cost-effectively deploy robust IoT security in their products.”

“The M2354 Series is designed to support high-security requirements that are essential for even the most demanding IoT solutions,” said Tomohiro Shimo, vice president at Nuvoton Technology Corporation Japan. “Our collaboration with Data I/O enables our customers to leverage the extensive security features of the M2354 Series. SentriX Product Creator enables our OEM customers to define and build hardware-based security into their products more easily and in less time.”

SentriX GO pre-defined use cases through the SentriX Product Creator tool will be made available for M2354 Series through SentriX Service providers globally by the third quarter 2023. Data I/O and Nuvoton plan to collaborate and announce support on SentriX Product Creator with pre-defined use cases on additional devices in the future.

CLINTON, NY – Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology.

ASIC is a coalition of more than 170 organizations developing a proposal to utilize CHIPS and Science Act funding to serve as the main technical driver for the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP). ASIC supports the research, development, prototyping, and manufacturing transfer goals of the NSTC and NAPMP and is developing strategies to ensure they are met.

“Indium Corporation is proud to join ASIC, and its members, in the pursuit of strengthening U.S. technology leadership and expanding domestic semiconductor production and packaging capabilities,” said Ross Berntson, COO and President of Indium Corporation. “ASIC’s work to create technology hubs and develop U.S. supply chains and production for our future economic prosperity aligns perfectly with our goals. Continued development of our technology alongside industry leaders in co-materials, tools, and manufacturing will help strengthen America’s leadership in technology supply chains, increase production, and grow jobs in the U.S.”

Founded in 1934 in upstate New York, Indium Corporation has a nearly 90-year history of materials innovation in electronics assembly, thermal interface materials, high-purity and ultrahigh purity metals, metal salts, and oxides used in a wide variety of electronics applications. It also has strong current and expanding capabilities in materials sustainability. Together with ASIC, Indium Corporation seeks to support advancements in both wafer fabrication and packaging in the U.S.

By joining ASIC’s growing membership of companies, universities, startups, and nonprofits, Indium Corporation will have access to both high-volume wafer fabs through NSTC, and packaging prototyping lines through the Centers of Excellence under development by NAPMP. Through co-development of materials and their associated cutting-edge usages in advanced applications, Indium Corporation will be able to fine-tune the company’s technology to volume production, alongside its current high-volume electronics materials.

“Indium Corporation is a long-standing New York-based leader in innovative materials technology and is a great example of continuity of U.S.-based innovation,” said Douglas Grose, Ph.D., spokesperson for ASIC. “The company’s unique expertise and input will be great assets to our efforts to strengthen U.S. leadership in semiconductor and advanced packaging R&D and bolster microelectronics manufacturing in America.”