New Britain, CT - MicroCare, LLC is pleased to announce that Marufur Rahim has joined the company as Technical Director to oversee the company’s laboratory, research and development and quality teams. Rahim is responsible for all laboratory staff, equipment and supplies. He manages quality analysis activities associated with the ongoing manufacture of MicroCare products and also leads research and development activities for new MicroCare technologies which includes writing patents and securing company intellectual property.

Rahim joins MicroCare with over 20 years of experience in technical direction and management. Before coming to MicroCare, Rahim held director and manager roles at Chemence, Dymax and Selena, among others.

He holds a Ph.D. in Chemistry from the University of Vermont and an MS in Technology Management from the University of Waterloo in Canada.

Tom Tattersall, MicroCare CEO said, “Marufur brings an impressive track record of successful laboratory management and will undoubtedly make a great contribution to the continued success of our organization. We are excited to add him to our team.”

Rahim is also happy to be joining MicroCare. “We’ve got a strong laboratory team and some really exciting product research and development projects happening. I’m looking forward to working with our team to introduce these new products to meet our customers’ evolving demands.” he said.

SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in the industry showcasing their latest developments, the fair provides an opportunity to connect, create and drive technology.

In addition to networking, collaborating and exchanging information, participants at the fair can expect all the best of the SMTconnect.

The EMS Park

Following two years of predominantly digital encounters, participants will welcome the opportunity to enjoy the EMS Park. With a natural and open design, reminiscent of a park, the forum offers a clear focus on networking.

In addition to the EMS Park, attendees can visit the special showcase area “PCB Meets Components” with exhibitors covering all aspects of printed circuit boards, components and materials.

The Heartbeat of Electronic Production

Renowned exhibitors to the fair include Asys Automatisierungssysteme GmbH, FUJI Europe Corporation GmbH, Koh Young Europe GmbH, OMRON Europe BV Inspection Systems Division Europe, Panasonic Connect Europe GmbH, smartTec GmbH, SMT Maschinen- und Vertriebs GmbH & Co. KG, YAMAHA Motor Europe N.V. Presenting their latest innovations, solutions and products, those attending will be able to gain valuable insights into the industry.

Fraunhofer Institute for Reliability and Microintegration Presents…

Further highlights include the Fraunhofer Institute for Reliability and Microintegration IZM, showcasing the highly anticipated update to their production line. The main topic this year is “Trustworthy electronics - digital twin: sense or nonsense.” The sessions include live production slots with commentary daily at 10 a.m., 1 p.m. and 3 p.m.

The Best of the Best – IPC Hand Soldering Contest

Following a two year break, participants eagerly await the hand soldering competition held by the IPC - Association Connecting Electronics Industries from the USA. Soldering professionals will have the opportunity to demonstrate their skills on all three days of the exhibition. They are to compete against each other for the manual soldering of complex circuit boards and will be evaluated primarily in terms of speed and precision. The winner of the professional competition will receive a cash prize as well as the chance to win a trip to the Championships later this year in Munich, Germany.

VDMA Market Forecast

As ever, the VDMA will present its market forecast for electronic mechanical engineering. Participants can look forward to hearing all the latest from Volker Pape, Viscom AG (Chairman of the Department Productronic) and Dr. Sandra Engle, VDMA Productronic. The press conference will take place from 11 a.m.-12 p.m., NCC East, Level 3, Room Shanghai.

SMTconnect – the Place to Be

All those attending the SMTconnect can look forward to a return to normality. Restrictions have been lifted, allowing for a close and personal trade fair experience, although the organizer Mesago Messe Frankfurt recommends wearing FFP2 masks indoors.

For additional information, visit www.smtconnect.com.

Seoul, Korea – Originating from a passionate team of ten engineers, Koh Young Technology has flourished into the industry leader of True 3D measurement-based inspection solutions. May 2022 will see us celebrate 20 years of innovation! “From being a newcomer in the inspection industry to the global leader in the SPI market took us just three years. This accomplishment is – without doubt – thanks to our team, our customers, and our partners,” reflects Dr. Kwangill Koh, Founder and CEO of Koh Young Technology.

Back in the early 2000s, machines were not dependable enough to inspect printed solder paste or mounted components, so a human worker had to sit at the line, stare at each solder brick and component on a board, and then identify defects with their eyes under a magnifying lens. The industry had to replace this manual process with an inspection machine designed with enough software intelligence to substitute a human mind with more accuracy than the human eye. Now, our 3D inspection systems are the de facto standard for inspection and have revolutionized the electronics manufacturing industry.

During our climb to the zenith of the inspection market, we achieved several notable accomplishments along the way. Some of Dr. Koh’s most memorable events include:

1. Shifting the inspection market paradigm in 2003 with our 3D solder paste inspection (SPI) system

2. Overcoming impossible hurdles to invent 3D automated optical inspection (AOI) in 2010

3. Creating the industry’s first A.I. (artificial intelligence) technology that helped build the ultimate smart factory of the future, all the while developing our foray into semiconductor and advanced packaging inspection solutions with the Meister Series in 2017

4. Developing the industry’s first in-line dispensing process inspection system in 2021 (Neptune) to inspect the thickness of conformal coating as well as any transparent materials in 2021

“Inventing an innovative technology and shifting an industry paradigm is not a road often taken, yet Koh Young will gladly hop on the path,” commented Dr. Koh. “The unyielding commitment and fighting spirit required to take such paths are in our DNA.”

About Koh Young Technology, Inc.

Established in 2002, Koh Young pioneered the market by launching the first 3D solder paste inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and automated optical inspection (AOI) equipment for the electronics industry. Based on its True3D™ measurement-based inspection technology, Koh Young has developed innovative solutions for challenges with machining optical inspection (MOI), dispensing process inspection (DPI), and semiconductor inspection. Through its innovations, Koh Young has secured thousands of global customers, and maintains the largest global market share in the SPI and AOI markets. Additionally, by adopting its user-centric R&D activities, it continues to use its core competencies and develop solutions for new and existing markets. Its activities stem from the corporate headquarters in Korea to into sales and support offices in Europe, Asia, and the Americas. These local facilities ensure it stays connected with the market, and more importantly, its growing customer base to provide access to an award-winning network of inspection and measurement experts. Learn why so many electronics manufacturers trust Koh Young for reliable inspection at www.kohyoung.com.

For More Information

Koh Young, 14F Halla Sigma Valley, 53 Gasandigital 2-ro, Geumcheon-gu, Seoul, Korea www.kohyoung.com

Schweitzer Engineering Laboratories (SEL) is a leading electronics manufacturer that specializes in creating digital products and systems that protect, control, and automate power systems around the world. The company has added two Universal Instruments FuzionXC™ Platforms in its Lewiston, ID facility. The platforms have been integrated into existing production lines, enabling SEL to minimize changeovers and improve efficiency.

The new six-machine lines include three Fuzion2-60™ and the FuzionXC2-37™, followed by a Fuzion2-14™ and a Fuzion1-11™. The FuzionXC2-37 features an industry-best 272 8mm feeder inputs, providing the capacity to support multiple products at the same time. It also supports a large component range from 01005 to 150mm square and 25mm tall, including press-fit, connectors, micro BGA, die, PoP, and PTH parts.

“The additional feeder inputs of FuzionXC have really helped streamline our production schedule. Because of the increased capacity, we’re able to run production with minimal major changeovers,” said SEL Engineering Manager, Justin White. “And for our high-mix production, this is a considerable advantage,” added White. “We’re also leveraging the flexibility of FuzionXC to place many components from up-line and down-line platforms, giving us improved line balancing and 30% greater output.”

From generation to consumption, SEL’s products and solutions are critical at every stage of the electric power system. Many of these products incorporate new, cutting-edge technologies that are invented, designed and manufactured at SEL. This level of vertical integration has led to a successful long-term partnership between Universal and SEL, which leverages a full complement of Universal’s assembly equipment, including surface-mount platforms, radial and axial insertion platforms, and odd-form automation cells. SEL’s production requirements demand both high-mix and high-volume environments and the company now has five SMT lines in its Pullman, WA facility and four lines in its Lewiston, ID production facility, with another on the way this year.

“We’ve had the pleasure of working with SEL for many years and it’s impressive to watch the team using barcode changeover to seamlessly execute changeovers on the high-mix lines. However, even with this level of proficiency, FuzionXC has taken SEL’s high-mix productivity to the next level,” noted Kevin Clue, Universal Instruments General Manager, North America Field Operations. “Many of our high-mix customers have seen exceptional utilization gains by incorporating FuzionXC and driving down changeovers. FuzionXC also enables SEL to place complex components outside the scope of basic surface mount – a capability that prompted the company to implement Universal’s SMT solutions more than ten years ago.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.