Circuits Assembly Online Magazine - Current

Press Releases

(Waterbury, CT USA) – August 10th, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will highlight its range of advanced solutions for circuit board assembly at the upcoming SMTA Queretaro Expo, Mexico on August 18th, SMTA Ohio Expo, USA on August 24th and SMTA Chihuahua Expo on August 25th.

MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste, will be a highlight at all three SMTA Expos. The paste is designed to minimize warpage induced defects and enhance product reliability compared to existing low temperature solutions. At the SMTA Chihuahua Expo, Francisco Gallegos, Customer Technical Support Engineer – Mexico, will present a paper on this topic with ‘Low Temperature Soldering: Traditional Sn-Bi alloys and Latest Developments in High Reliability Alloys for SMT and PTH Applications’.

Additionally, MacDermid Alpha will promote the ALPHA HiTech range of adhesives, underfills, edgebonds and encapsulants. These epoxy-based materials provide reinforcement and protection for soldered assembled components, enhancing reliability. Sustainability initiatives will also be a key focus, with emphasis on MacDermid Alpha’s Reclaim and Recycling Services. Offering safe and efficient recycling services, this service helps companies meet their environmental and legislative requirements, and at the same time, maximize the value of their waste streams.

2022 is an important milestone for MacDermid Alpha with the business celebrating 250 years of combined innovation. The MacDermid brand is celebrating 100 years of supplying specialty chemical solutions for the most complex printed circuit board and IC substrate designs. The Alpha brand is celebrating 150 years of providing high performance component attachment materials for the electronics assembly industry.

For more information on the SMTA Expos please visit: Events - SMTA

To learn more about MacDermid Alpha’s circuit board assembly solutions please visit: macdermidalpha.com

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Assembly Solutions, Semiconductor Solutions, and Circuitry Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Minneapolis, MN - The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 31 - November 3, 2022 at the Minneapolis Convention Center in Minneapolis, MN, USA.

The four-day conference includes the latest electronics manufacturing research and technology from major manufacturers such as AMD, Cisco Systems, Collins Aerospace, Honeywell FM&T, IBM Corporation, Intel Corporation, John Deere Intelligent Solutions Group, L3Harris, Nokia Bell Labs, NXP Semiconductors, Raytheon Technologies, Robert Bosch GmbH, Safran Electronics, Sandia National Laboratories, several universities, and more.

Over 100 presentations are organized into the following technical tracks:

Advanced Packaging (APT)
High Performance and Reliability (HPR)
Interconnect Research and Reliability (IRR)
Low Temperature Solder (LTS)
Manufacturing Excellence (MFX)
Materials for Electronics (MAT)
Medical & Defense Symposium (MD)
Technical Innovations (TI)
Test and Inspection (INS)

The annual Women’s Leadership Program is planned for Tuesday, November 1. This complimentary program features career development presentations and speed mentoring sessions, closing with a Connection Reception.

On November 2 and 3, the SMTA International Exposition will showcase equipment and materials from electronics manufacturing technology solutions providers. In addition to SMTAI, attendees to the expo will is one of six shows co-located with Medical Design & Manufacturing (MD&M) Minneapolis at the convention center. More than 500 exhibiting companies and over 4000 attendees are expected to participate across the six design and manufacturing shows combined, bringing together one of the largest audiences of engineering and manufacturing professionals in the Midwest.

Registration to attend the conference and expo is now available online at: https://smta.org/mpage/smtai-registration

For more information on SMTA International please contact Karlie Severinson: (smtai@smta.org) or +1-952-920-7682 or visit: https://smta.org/smtai/

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

FREMONT, CA — August 2022 — Datest, a leading provider of advanced, efficient and mission-critical in-circuit testing, test engineering, X-ray inspection and nondestructive failure analysis solutions, is pleased to announce that it has successfully completed its AS9100D recertification. The intent of the standard is to establish a single quality management system for use within the aerospace industry. Based on the ISO 9001 quality system requirements, AS9100D adds more stringent requirements specific to the aviation, space and defense industries.

“With this successful recertification, on our 13th consecutive successful AS9100 audit, Datest has now been certified to both the ISO9001 and AS9100 standards since 2010,” stated Robert Boguski, President of Datest. “Once again, our team successfully demonstrated its well-functioning Quality Management System (QMS) to the satisfaction of a third-party auditor. This time, in fact, we had no violations of the standard at all (no majors, minors or observations). This status doesn’t come easily, and should never be taken for granted.”

With this certification, together with the ISO9001:2015 certification, Datest continues to maintain the appropriate, consensus-driven quality benchmarks to serve the aviation, space and defense industries. The standard takes the requirements of ISO 9001 and supplements them with additional quality system requirements, which are established by the aerospace industry in order to satisfy DOD, NASA and FAA quality requirements.

The current AS9100D revision to the standard adds additional requirements addressing detailed process descriptions and the risks and opportunities associated with their operation; outside interested third party influences; human factors; and professional ethics.

Boguski added, “AS9100D certification enables Datest to participate seamlessly in many varied aerospace projects and programs, often on a tight timeline demanding swift supplier qualification. Prior certification smooths that path to supplier qualification. Those skills and our background make us much more than a vendor to our clients; we are, we hope, a true partner. We are grateful for this recognition, as we use it to grow and diversify our business.”

With more than 38 years of expertise, Datest offers in-circuit testing (ICT), flying probe testing, X-ray inspection, boundary scan/JTAG testing, functional testing, failure analysis and other related analytical and laboratory services. Datest is an ISO9001:2015, ITAR and AS9100D-certified company, and a member of IPC, IEEE, EIPC and ASNT. Datest is a proud and active member of SMTA.

For more information about Datest or to view the company’s complete service lineup, visit www.datest.com, or call (510) 490-4600.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

August 2022  EVS International, the leader in solder recovery, today announced plans to exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Wednesday, Aug. 24, 2022 at the Best Western Plus Strongsville in Ohio. The Murray Percival Company will showcase the EVS 500LF Solder Recovery System at Table 42.

EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer. The EVS500LF is designed to ensure that the maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.

The EVS 500LF has the same footprint as a printer and is aimed at multiple markets. The customer with one lead wave and one lead-free wave, the customer who uses Nitrogen or wants to reduce their Nitrogen usage, the customer with selective solder pots who only removes small amounts of dross every hour or the customer with multiple waves where one EVS 500LF is connected to each wave.

The Murray Percival Company represents EVS solder recovery systems in the Midwest. To learn more, visit www.murraypercival.com.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

WASHINGTON D.C. — August 9, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the signing of the CHIPS and Science Act of 2022 by U.S. President Joe Biden. The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to chip manufacturers as well as semiconductor equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“The CHIPS and Science Act secures landmark investments to bolster semiconductor manufacturing and R&D infrastructure as well as a wide range of ancillary industries in the United States,” said Ajit Manocha, SEMI president and CEO, who attended the signing ceremony. “We thank President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction for their support in enacting the investment tax credit and funding for CHIPS Act programs.”

“SEMI looks forward to continuing collaboration with the U.S. government and our member companies to ensure timely implementation of these programs to strengthen the U.S. semiconductor supply chain,” said Manocha. “The CHIPS and Science Act funding will also be instrumental in buttressing the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program and related programs in order to drive chip industry innovations that will better the lives of people around the world.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

PCB West: The leading technical conference and exhibition for electronics engineers. Coming Oct. 4-7 to the Santa Clara (CA) Convention Center. pcbwest.com

Irvine, CA and Nijmegen, the Netherlands – Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s thermal high-performance packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner for innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride and silicon carbide power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

For more information, visit www.henkel-adhesives.com/electronics and www.citc.org.