MARKETHILL, UNITED KINGDOM – Just a week before Christmas, the team at Lenalea Electronics received an early festive present in the form of a brand new 3D AOI system delivered by Europlacer on 19th December 2022 directly to its factory in Markethill, Co. Armagh. The new system went straight into production.
Having been delighted with more than eight years of use from its 2D AOI system, and with the business expanding, the Lenelea production engineering team decided to invest in the latest 3D AOI solution from Europlacer. The objective was to boost productivity by reducing programming time. The latest AOI software enables a much higher level of automatic programming, which reduces operator decisions and consequently reduces false calls. This investment was imperative due to the increasing volume of new customer business coming through the company’s doors.
3D AOI substantially reduces the effects of component shadowing that can sometimes be flagged up as possible errors, requiring an operator to make a fault or no-fault assessment. In addition, 3D technology distinguishes solder on a pad more effectively, providing a greater level of post-reflow assembly confidence.
“False calls are now very infrequent,” claims Lenalea director David Foster. Where potential errors are highlighted, the Lenalea operators benefit from a clearer perspective of the board thanks to a built-in microscope function with next level resolution graphics.
Lenalea wisely involved its assembly operators in the AOI evaluation and purchase decision, with the Europlacer solution favoured due to the company’s multi-award-winning customer support and AOI expertise. “The transition from 2D to 3D proved straightforward thanks to Europlacer’s applications support, with our team getting up to speed quickly,” Foster says. “We are very pleased with our investment and the new AOI is already making a positive impact on our productivity and helping to drive our expansion.”
NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano Event Center in Plano, TX, and the SMTA Houston Expo & Tech on Thursday, March, 30, 2023, at the Stafford Centre in Stafford, TX.
The KYZEN team will highlight the KYZEN Process Control System (PCS), the first and only concentration monitoring and control system in the world, and the newest addition to the award-winning AQUANOX product line: AQUANOX A4626.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst will complete the optimization and provide you with a worry- free process.
The KYZEN PCS monitors and automatically reacts to the dynamic changes in the wash bath concentration. More than 20 years ago, KYZEN PCS was designed to maximize high-quality output from inline cleaning systems, and its capabilities have continuously improved and advanced.
The environmentally friendly AQUANOX A4626 is designed to quickly remove the latest polymeric no-clean flux residues while providing superior results on traditional lead-free and eutectic tin lead residues as well. It has a long tank life and is safe for multi-pass applications.
For more information, visit www.kyzen.com
BLAUBEUREN, GERMANY – When productronica China opens its doors once more in Shanghai from 13 to 15 April 2023, Rehm Thermal Systems – an expert in thermal system solutions and active on the Chinese market for over 15 years – will also be presenting the highlights of its latest product portfolio. As the leading platform for innovative electronics production, the international trade fair is one of the most important events of its kind throughout the entire Asian region.
At the company stand in Hall N4, Stand Number 4518 of the Shanghai New International Expo Centre (SNIEC), Rehm will be presenting the VisionXP+ convection soldering system with vacuum chamber, the Condenso condensation soldering system, the Nexus contact soldering system and the Protecto dispensing and coating system this year.
The convection soldering systems belonging to the Vision series are efficient, powerful and – depending on the respective version – suitable for different batch sizes in the automotive, consumer electronics or power electronics sectors. The VXP+ with vacuum chamber, which Rehm will be exhibiting at productronica, is the “best-in-class” reflow convection soldering system from the manufacturer based in the southern German town of Blaubeuren, and is not only characterised by increased process stability, but also greater energy efficiency, reduced emissions and operating costs, all thanks to integrated EC motors. A separate vacuum module enables convection soldering processes with negative pressure in just one process: Pores, gas pockets and voids are reliably removed directly after the soldering process. There is no need for the assembly’s time-consuming processing by an external vacuum system; instead, the workpieces are transferred from the peak zones directly into the vacuum process. The high- end system also offers effective residue management by means of pyrolysis in the preheating zone, as well as minimal downtimes, low maintenance and intelligent traceability solutions.
In reflow condensation soldering or vapour phase soldering, the soldering process is carried out with the aid of hot steam. As the heat transfer is up to ten times higher than with convection soldering, the Condenso systems brought to you by Rehm are particularly suitable for large or high-mass boards. The systems of the Condenso series can be integrated into the most diverse production environments with the highest degree of process reliability – be it batch operation, inline connection or soldering in a continuous process. A vacuum option for void-free soldering also enables series production in power electronics. The system series highlights also include the patented injection process, which makes the soldering process individually controllable, or the control of the reflow profile reproducible – and thus ensures better control of the condensation phase.
With the Nexus contact soldering system, Rehm, in turn, promises the best results through reflow soldering processes with contact heat under vacuum. Suitable areas of application can be found in advanced packaging, and especially in the fields of power electronics, semiconductors and wafer technology, which are increasingly being used for railway operations, wind turbines, battery storage and, last but not least, in the automotive industry. Due to its minimal dimensions and high degree of user- friendliness, the system is particularly suitable for use in small to medium series production, and in the laboratory sector.
Optimal coating processes for high-quality electronics are available with the Protecto series from Rehm. The dispensing and coating systems protect electronic assemblies from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration, and deliver safe, automated processes, as well as precise results in the application of a wide range of materials. Up to four simultaneously usable applicators give their users numerous options: In addition to dispensing, these include the ability to create freely definable, three-dimensional housing shapes by simple application, the immediate curing of UV varnishes and the casting or bonding of different materials.
With ViCON, Rehm offers a software solution for all systems being presented at productronica China. Tailored to a wide range of manufacturing processes, the plant software delivers an impressive performance with its intuitive operation, optimal process control, convenient product management and smooth connection to higher-level manufacturing management systems (MES).
NEWMAN LAKE, WA – Hentec Industries/RPS Automation announces that it is pleased to exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Dallas Expo & Tech Forum to be held at the Plano Event Center, in Plano, Texas on March 28, 2023, and the SMTA Houston Expo & Tech Forum to be held at the Stafford Centre in Stafford, Texas on March 30, 2023.
At both SMTA events, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation. The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector and Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.
Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling. The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.
DERRY, NH – StenTech® Inc., the leading multinational SMT Printing Solutions company, today announced the promotion of Raza Khan to Central Area Sales Manager. Khan has been managing StenTech’s Chicago facility for the past 14 years. He embodies a unique knowledge of the company and products that he will utilize in his technical sales role.
Khan graduated with a Bachelor of Science in Electronics and then began his career with StenTech in 2005. He initially joined StenTech as a machine operator and was soon promoted to CAD Designer. Backed by the insight of these roles, he was the natural choice to transition into management where he has excelled in supporting StenTech’s customers.
StenTech has been leading the way in stencil technology, being the first company to introduce Fiber Diode lasers into North America. With more than 30 experienced CAD designers, their strength is the support they provide in stencil modifications, materials and thickness recommendations. StenTech, incorporates sub-brands, PhotoStencil and ADT and offers a complete array of stencil technology, custom-tailored to suit your manufacturing requirements. They manufacture all types of stencils for the SMT industry.
To learn more, visit www.StenTech.com
Minneapolis, MN – The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.
The following four papers were selected for the “Best of Proceedings” award:
Andrew Mawer, NXP Semiconductors, for the paper “Assembly and Reliability of a Novel High Density Dual Row MaxQFP." Co-authors include Mollie Benson, X.S. Pang, Stephen Lee, J.Z. Yao, Alvin Youngblood, NXP Semiconductors.
Keith Sweatman, Nihon Superior Co., Ltd., for the paper “Effect of Strain Rate on the Ductility of Bismuth-Containing Solders." Co-authors include Tetsuro Nishimura, Nihon Superior Co., Ltd.; Stuart McDonald, Xiaozhou Ye, Qichao Hao, Beatrice Negura, Xin Fu Tan, Kazuhiro Nogita, The University of Queensland.
Richard Coyle, Ph.D., Nokia Bell Labs, for the paper “Thermal Fatigue of QFN and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders." Co-authors include Faramarz Hadian, Eric Cotts, Binghamton University; Xinzhi Feng, Martin Anselm, Ph.D., Rochester Institute of Technology; Richard Popowich, Nokia; Lenora Clark, ESI Automotive.
Tim Pearson, Collins Aerospace, for the paper “Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-Free Solder Alloys." The work was a joint effort by a large group of co-authors as part of the iNEMI Alternative Alloys Program and the High Density Package (HDP) User Group.
The following five papers received honorable mention:
Aileen Allen, HP Inc., for the paper “A Review of the Impact of Dopants in Sn-Bi Solder Alloys." Co-authors include Helen Holder, Elizabeth Benedetto, HP Inc.
Jean-Paul Clech, EPSI Inc., for the paper “Predicting the Saturation of Solder Joint Cycles to Failure with Thermal Cycling Dwell Times."
Richard Coyle, Ph.D., Nokia Bell Labs, for the paper “Improved Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly with a High-Performance Bi-Bearing Solder Paste." The work was a joint effort by a large group of co-authors as part of an iNEMI Project.
Tae-Kyu Lee, Ph.D., Cisco Systems, for the paper “Low Melting Temperature Solder Interconnect Thermal Cycling Performance Enhancement using Elemental Tuning." Co-authors include Kendra Young, Portland State University; Nilesh Badwe, Raiyo Aspandiar, Satyajit Walwadkar, Intel Corporation; Young-Woo Lee, Hui-Joong Kim, Junk-Tak Moon, MK Electron Co., Ltd.
Kevin Byrd, Intel Corporation, for the paper “Functional System Observations of Tin-Bismuth Low Temperature Solder Electromigration Behavior." Co-authors include Brian Franco, Intel Corporation.
The authors will receive their awards during a ceremony at SMTA International 2023. The SMTA International Conference and Exhibition (SMTAI) 2023 will be held October 9-12, 2023 at the Minneapolis Convention Center in Minneapolis, MN, USA. Details on participating in the 2023 SMTA International Conference are posted on the event website: https://smta.org/mpage/smtai-cfa
Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.