ATLANTA – The ECIA Executive Conference Committee is pleased to announce the name of the opening keynote session title, “FEAR(LESS)™ Mindset What's Your Story,” presented by Rebecca Heiss. Our brains aren’t built for this rapidly changing world… But they are adaptable. By consciously crafting a mindset that helps us lean into these challenges rather than treat them as threats, we’ll be able to avoid the burnout, frustration, and turnover that might otherwise plague us and our clients. And, perhaps most importantly, we can deepen the connections we had to the purpose and people that drew us into this industry we love to begin with. This session will provide tools to:
“The 2023 conference speaker line up is one for the books!” noted ECIA Director of Member Engagement, Stephanie Tierney. “The topic fits in very well with our theme, ‘Making Waves, the Power of You.’ Our committee has chosen the other two keynote speakers and will be finalizing the rest of the program in the coming weeks, so stay tuned,” she added.
Registration is open now. The Executive Conference runs October 22-24, 2023 at the Loews Chicago O'Hare.
The Executive Conference is an opportunity for senior management teams from the electronics industry's leading companies - representing the entire supply chain - to gather and address cross-enterprise challenges. Gain access to industry experts and knowledge, forge relationships that can make a real difference, and learn how to remove roadblocks to success. Plan to join this must-attend event - there is no other that offers an in-depth look at the electronics components industry and is as geared towards industry-specific education and fostering meaningful relationships across this section of the supply chain network. It's the one conference you can't afford to miss.
NAMPA, ID – Silicon Mountain, a leading electronic manufacturing company, has upgraded its selective soldering department with four new selective solder systems from Pillarhouse International. The company continues to invest to maintain the flexibility, quality, and turnaround necessary to meet each customer’s unique needs.
Silicon Mountain’s selective solder through-hole systems position its clients for success. The company reduces the risks of thermal shock and excessive flux contamination inherent to traditional systems. Silicon Mountain’s through- hole systems handle fragile displays easily. They allow components to be placed onto PCBs, panels, or other assemblies without disturbing nearby surface-mount technology (SMT) components. Silicon Mountain offers clients the speed and flexibility of its systems to help achieve repeatable success in their competitive markets.
“With this investment, we are enhancing our selective soldering capabilities and reinforcing our commitment to delivering the highest-quality electronic components to our customers,” Clint Roehr, Project Manager at Silicon Mountain. “This acquisition is a significant step forward for Silicon Mountain, and we are excited about the opportunities it will bring.”
The Pillarhouse International Orissa Synchrodex is a modular selective soldering system designed to eliminate the need for hand soldering. The first module in the line is equipped with a precision drop jet fluxer and upper and lower preheat modules. The next two modules have bottom side preheat, a drop jet fluxer, and solder pot/pump/nozzle setups.
The preheat helps with flux activation and raises the board temperature for better solder flow and reduced dwell time on the solder joints. All machines incorporate fiducial correction for increased accuracy. Having two soldering modules allows the soldering program to be split for increased flexibility and efficiency.
Silicon Mountain provides a wide range of services, whether it is prototyping for startups or high-volume manufacturing. Regardless of the service, the company aims for high quality and quick turnaround.
For more information about Silicon Mountain, visit https://siliconmtn.net/
SHINGLE SPRINGS, CA – PDR, founded in 1985, and today a leading manufacturer of BGA rework systems and X-ray systems, is pleased to announce a new partnership with Process Automation & Tool, llc (PAT) as its manufacturers’ representative in the southeastern United States.
With over 20 years of experience in the electronics industry, Process Automation is a trusted supplier of high-quality process automation and tooling solutions. As PDR’s new representative in Georgia, Tennessee, Alabama, and Mississippi, Process Automation will help expand the availability of PDR's advanced rework, test and inspection systems to customers throughout the region.
"We are excited to partner with Process Automation to increase our reach in the southeastern US," said Dave White, CEO of White Industrial Corporation, parent company of PDR Americas. "Process Automation's deep knowledge of the electronics industry, along with their commitment to customer service, makes them an ideal partner for PDR. Together, we will help more customers achieve greater productivity and quality in their electronic assembly processes."
Through this partnership, Process Automation will offer PDR's full range of products, including the award-winning IR Rework Systems X-ray Systems. "PDR's innovative solutions are a perfect fit for our customers' needs," said Andy Tressler, Partner of Process Automation. "We are proud to represent a company with such a strong reputation for excellence in the electronics industry. We look forward to working with PDR to provide top-of-the-line solutions and support to our customers."
PDR's partnership with Process Automation is an important step in expanding its distribution network in the southeastern US. With Process Automation's expertise and PDR's advanced technology solutions, customers throughout the region will have greater access to high-quality electronic assembly tools and services.
For more information about Process Automation & Tool, visit www.processauto.us
TUCKER, GA – TAGARNO announced that its representative, Gardner & Meredith Inc., will exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, May 23, 2023 at Johns Hopkins University. Rick Richardson from Gardner & Meredith will showcase the TAGARNO ZAP Flexible Digital Microscope and TAGARNO TREND Digital USB + HDMI Microscope.
Install TAGARNO ZAP any way you want: On a flex arm, a focus tracker or in a third- party ø76 mm yoke. With TAGARNO ZAP, you choose the setup that matches your needs – and if they change, so can your setup. You can even activate more features by purchasing an Upgrade kit to make the most out of your investment.
TAGARNO TREND is a powerful tool for demanding professionals in need of a documentation microscope, precision microscope, or automation microscope. TAGARNO delivers intelligent and smart digital microscopes – also known as a computer microscope or digital camera microscope. The HD video microscope features built-in software, optical zoom, high frame rates and 1080p image quality.
With more than 250X, the TREND takes quality control to the next level. Customize the digital microscope with powerful and specialized software apps. Optimize processes for your specific tasks and use the camera to maximize efficiency, enhance quality of work, and make routines faster.
Meet with Rick Richardson at the SMTA Capital Expo to learn more. For more information about TAGARNO, visit www.tagarno.com
TUCKER, GA – TAGARNO announced that its representative, Brook Anco Corporation, will exhibit at Design-2-Part Florida, scheduled to take place May 2-3, 2023 at the Orlando Convention Center. Brook Anco will showcase the TAGARNO FRONT and TAGARNO ZIP Digital USB Microscopes, along with the TAGARNO TREND Digital USB + HDMI Microscope in Booth #406.
TAGARNO FRONT is a smart and user-friendly digital microscope with an extensive range of intelligent and intuitive software applications. What sets it apart is its unique design. Regardless of your working depth or magnification level of choice, the microscope will create ultra sharp and sturdy images, allowing operators to perform accurate and high quality analyses with little interference from nearby movements.
TAGARNO TREND is a powerful tool for demanding professionals in need of a documentation microscope, precision microscope, or automation microscope. TAGARNO delivers intelligent and smart digital microscopes – also known as a computer microscope or digital camera microscope. The HD video microscope features built-in software, optical zoom, high frame rates and 1080p image quality.
With more than 250X, the TREND takes quality control to the next level. Customize the digital microscope with powerful and specialized software apps. Optimize processes for your specific tasks and use the camera to maximize efficiency, enhance quality of work, and make routines faster.
The TAGARNO ZIP is a great entry product for those new to the world of digital microscopy. The microscope is small and simple with more than 50X magnification and USB 3.0. Its user- friendly design makes it ideal for magnification tasks that do not require advanced features or software. With a reduced set of features, ZIP comes with lower buy-in costs without affecting the image quality.
Meet with the Brook Anco team at Design-2-Part Florida to learn more. For more information about TAGARNO, visit www.tagarno.com
PRAGUE – Celestica Inc. (TSX: CL) (NYSE: CLS), a leader in design, manufacturing, and supply chain solutions for the world's most innovative companies, today announced a new design specification will be revealed at the Open Compute Project (OCP) Regional Summit in Prague, Czech Republic. This specification will be open and is expected to be approved as an official OCP contribution in May 2023. The design specification is compliant with the Enterprise Edge Gateway base specification contributed to OCP by Amazon Web Services (AWS). The Celestica Enterprise Edge Gateway product will pursue OCP Inspired™ recognition and will consist of the latest in enterprise edge gateway technology.
"Celestica continues to work with the OCP Community to enable the adoption of open networking at the enterprise edge," said Gavin Cato, Head and CTO, Hardware Platform Solutions, Celestica. "Our Enterprise Edge Gateway design submission to OCP is another example of this collaboration as Celestica leverages our world-class design capabilities to innovate, develop and support solutions for the enterprise."
The Enterprise Edge Gateway specification uses a Broadcom Trident-3 chipset with an 8-core Intel CPU module and is developed for both flexibility and performance in data center and enterprise-class edge deployments. Its 1U footprint delivers 48 multi-gig RJ45 ports (32 x 10/100/1000Mbps + 16 x 2.5GBase-T), 4 x 10G/25G SFP28 ports, along with unique features such as 20G service processing, 802.3bt (Type4) on all ports, MACSec, PTP and built-in Wi-Fi and LTE.
The Celstica Enterprise Edge Gateway is optimized for:
AWS supporting quote:
"AWS continues to execute on its strategy to create a vendor agnostic reliable supply chain for enterprise edge deployed equipment to support our internal services," said Michael Lane, Principal Technical Program Manager, AWS. "We are pleased to collaborate with innovative companies such as Celestica to empower a more open-sourced community."
OCP supporting quote:
"We welcome Celestica's continued participation in the OCP Community and recognize it as a driving force in building out the OCP's open edge computing strategy, by being part of a developing open multi-vendor supply chain for the enterprise. Celestica continues to make important contributions to the OCP and the open-source network community, to drive innovation and open networking," said George Tchaparian, CEO at the Open Compute Project Foundation. "We are excited to see Celestica's latest design specification of their Enterprise Edge Gateway as it is an important addition to the OCP open edge ecosystem carrying forward AWS's base specification contribution to design and then on to product."
Visit Celestica during the OCP Regional Summit in Prague in the main expo hall to meet its engineers and industry experts and see the company's latest advancements in open networking technologies.