BROMONT, CANADA – Cogiscan, factory digitalization experts for electronics manufacturers globally, is proud to announce new distribution partnerships with MacTech for technical sales support and representation in Argentina.

"Adding MacTech to our distribution network is truly exciting. They have an excellent reputation in a key geographic region for us, Argentina – plus, they’re passionate about our industry and take a technology forward approach to working with customers."
Nirav Jariwala, Sales Application Engineer at Cogiscan

MacTech re-sells a wide range of SMT solutions for electronics manufacturers within Argentina – covering all aspects of the production process from SMT machines to consumables to intelligent software. Focused on production efficiency, they collaborate closely with their customers.

"Our clients are increasingly concerned about the shortage of materials due to both global problems and particular conditions in our country. We believe that Cogiscan will help our industry to manage inventory control more efficiently, assigning the correct materials and updating stocks in real time. Cogiscan, with its complete line of solutions, will drive our clients towards industry 4.0 with the digitization of the production floor."
Emiliano Herrero, Sales Director at MacTech

HERTFORDSHIRE, UK – In a first of its kind for the sector, the International Tin Association (ITA) has launched its strategic report – TIN2030: A Vision for Tin. This thought-leading initiative has been compiled in collaboration with a broad range of stakeholders from across the sector. Identifying both opportunities and challenges, it highlights the crucial role of tin as a resource to enable the global energy transition and digitalisation. There will be new opportunities to work together on ESG issues to underpin supply.

“Looking into the next decade, the tin industry faces dramatic new market dynamics and ESG demands. It is important for us in the sector to understand what lies ahead so we can take advantage of the unprecedented opportunities and challenges”, said Helen Prins, CEO of ITA. “We foresee that the next decade will see a wakeup to tin with a new wave of efforts to secure a sustainably sourced supply.”

The report highlights the impact of global changes on the sector. Changes such as rising geopolitical tensions, climate change urgency and macroeconomic shocks. According to the ITA research, this will lead to increased competition for vital resources including tin. Tin supply chains will need to adapt rapidly to meet these challenges while also working together to manage increased ESG expectations and demonstrate how the tin sector is building a better future for everyone.

The report highlights the importance of tin to everyday life and its growing role as an essential enabler for the energy transition and digitalisation. As the glue that holds together almost all electronic and electrical infrastructure, its significance will increase. Another strong indication that the demand for tin will surge. ITA estimates that $1.4 billion is needed to deliver 50,000 tpa more tin by 2030.

Better communication and collaboration on ESG will be needed to develop a holistic understanding of risks and meaningful standards. Increased engagement with ASM will increase business opportunities and rewards. The market will differentiate companies who strive beyond minimum requirements, including those achieving UN 2030 SDG’s.

TIN2030 represents a landmark effort in terms of bringing the industry together to think about the future of the sector. A pioneering effort led by ITA in its unique position at the heart of the industry. Through this holistic approach, ITA has been able to integrate perspectives from across the sector to best understand what the future is likely to hold for this vital metal.

More information on tin use is available on the ITA website: www.internationaltin.org 

WASHINGTON DC – The recent partnership announced by the U.S. and Canada is a welcome acknowledgement of the urgent need to support the American printed circuit board industry. The Presidential determination of printed circuit boards as essential to national defense under section 303 of the Defense Production Act is welcome news, and achieves a 2023 goal of the Printed Circuit Board Association of America (PCBAA).

The $50 million identified is a downpayment on what must be a larger and sustained effort by the U.S. government to rebuild this critical manufacturing sector. The American printed circuit board industry was decimated by offshoring over the past 20 years, dropping from almost 30 percent of the world’s supply to only 4 percent today. The U.S. depends on other nations -- primarily in Asia, and more than half from China.

“We are eager to work with the Administration to make the best use of this and advocate for subsequent funding for this long-overlooked industry”, said Travis Kelly, Chairman of the Printed Circuit Board Association of America and President and CEO of the Isola Group. “The costs of creating new facilities or upgrading existing printed circuit board facilities can run into hundreds of millions. Just as legislation and policies were created to support semiconductors, the U.S. government needs to invest in our nation’s future by providing support for printed circuit boards.”

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the suggestion that electronic manufacturers should implement automated selective soldering as opposed to using manual soldering. This technical paper encompasses critically important information and is entitled “Achieving Greater Through-Hole Soldering Reliability Without Sacrificing Throughput.” This 5-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.

Topics covered within this publication include soldering methods, manual soldering, hand soldering reliability, process considerations, versatility vs. throughput, fluxing control, process repeatability, and selective soldering system flexibility.