With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight. With assembly of EFB at an OSAT, the development
highlights the ability of OSATs to have a strong play in the high-performance packaging market. TechSearch International discusses the advantages of fan-out on substrate and embedded bridge structures
with an emphasis on packaging for advanced nodes. The adoption of chiplets is expected to remain one of the most important advances in this decade. Advanced packaging options from foundries, IDMs, and OSATs are highlighted including developments in 3D. Challenges such as test and thermal issues are presented with some potential solutions. A market forecast for silicon interposer and high-density FO
packages is provided. Trends in high bandwidth memory (HBM) are discussed and a market forecast is included.

Expanding Saki’s business development activities for automated inspection and measurement systems in Germany

SAN JOSE, Calif., Nov. 8, 2021 /PRNewswire/ -- Flex (NASDAQ: FLEX) today announced that Cameron Carr has joined the company as chief strategy officer (CSO). Mr. Carr will report directly to Flex CEO, Revathi Advaithi.

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies (NYSE: KEYS):

What:

Keysight will be attending Productronica, the leading trade fair for electronics development and production. At this year’s event, Keysight’s technical experts will highlight complete, customized solutions, including advanced software support and a comprehensive service offering designed to accelerate innovation in electronic design, manufacturing and compliance testing across key industries.