REDDITCH, UK — Altus Group, a leading distributor of capital equipment for electronics assembly in the UK and Ireland, will once again exhibit the most innovative machines available in the marketplace at the Southern Manufacturing and Electronics 2023, taking place from 7 – 9th February 2023, at Farnborough International Exhibition Centre.

Highlights will include demonstrations of best-in-class equipment from leading suppliers in the industry. The team of experts from Altus will present emerging technology within the electronics sector and the processes that will help to improve production.

Joe Booth, Altus CEO said: “Southern Manufacturing and Electronics is an important date in our exhibition diary as it brings the electronics community together in one space. This gives Altus the ideal platform in which to introduce some of the world’s most innovative capital equipment.

“Following a year full of new partnerships and additions in 2022, we are looking forward to introducing visitors to the very best products including inspection systems, production equipment, component management solutions and consumables.

“We have also welcomed several new staff including Jiri Kucera, Altus’ new Operations Director. He is looking forward to meeting our current customers, and prospective clients at the show, and, together with our team of experts, will demonstrate the capabilities of the varied products in our portfolio.”

Highlights on the Altus stand will include equipment from Koh Young, including the Zenith Alpha HS+ 3D AOI inspection platform. Combining the best hardware and 3D algorithm technologies, and teamed with artificial intelligence, it delivers the first class accuracy for any inspection application.

Essemtec Fox smart sized modular pick-and-place machine will also be displayed which is dedicated to high-mix production. Another highlight will be Asscon Vapour Phase system. As the demand to produce complex PCBA technology grows, this market-leading flexible system includes adjustable temperature gradients to assure each product has the optimal, reproducible temperature profile.

With traceability and process control of the upmost importance in electronics production, Altus will also demonstrate Promation USA Robotic Soldering platform. Visitors can see first-hand how these systems can support their high-tech, high value production requirements. Building on the foundation of proven robotic soldering performance and know-how, and with the addition of an impressive suite of software functionality, this robotic soldering process fits seamlessly within Industry 4.0 ideals.

To view the most innovative technology for electronics production, and speak to our knowledgeable team, visit Altus on stand J130.

www.altusgroup.co.uk

NEWMAN LAKE, – Hentec Industries/RPS Automation is pleased to announce that Tyvak Nano Satellite has completed the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.

The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re- conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF- 38524E and ANSI-J-STD-002 standards.

MENTOR, OH ― Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, today announced the appointment of its new Vice President of Sales. Nathan Whipple brings business development experience spanning more than 37 years in multifaceted manufacturing environments.

A hands-on decision maker, Whipple is armed with a rich mixture of operations management and strategic sourcing experience. He is a proven leader with a demonstrated ability to maintain focus on strategic goals, while at the same time effectively leading the tactical activities to achieve those goals.

In his previous role as Director of Channel Partnerships, he established a network of 22 active representative organizations. His responsibilities included creating, leading and managing key strategic partnership programs with manufacturers’ representatives and key suppliers. Whipple brings his strong leadership, operations liaison and strategic account support skills to Libra.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com.

SAN JOSE, CA — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.

Project Call 7.0’s awarded projects represent a diverse and innovative set of companies and universities that are jointly focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Several projects in this latest round of funded projects focus on advancing additive manufacturing approaches for hybrid electronics and addressing critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with the needs described in the recently passed Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act.

Project Call 7.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include using water-based inks and lower temperature processing, as well as assessing the manufacturing reshoring of low-cost single use medical devices that utilize more environmentally sustainable manufacturing approaches and materials.

This latest round of funding brings the total amount invested in FHE developments to more than $124M, including cost share contributions from Project Call participants.

“I am pleased to announce these important new projects, which will enhance the state of the art in hybrid electronics, support national efforts for semiconductor package manufacturing, and help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry,” said Malcolm J. Thompson, PhD, Executive Director. “The NextFlex member community is accelerating FHE and additively manufactured electronics toward commercialization in a number of critical application areas addressed in these projects.”

Project Call 7.0’s awarded funding will go to:

• Development led by Lockheed Martin Advanced Technologies Laboratories for creation of FHE interposers for heterogeneous integration of a high-density fiber optic Multi-chip Module (MCM) for thinner interposers with finer feature capabilities.
• Development led by GE Research and Binghamton University for Radio Frequency (RF) Multi-chip Module (MCM) with embedded die, printed substrates, antennas, and interconnects for fast turn low loss, high thermal conductivity.
• Development led by Raytheon Missiles & Defense for printed interconnect solutions for microwave multichip packaging for improved die density.
• Development led by General Dynamics Mission Systems for additively manufactured, doubly curved multilayer circuits with active and passive components for embedded RF functionality in complex structures.
• Development led by Auburn University for sustainable, additively printed electronics through water-solvent inks, FHE repairability, and low temperature processing with high reliability.
• Development led by Auburn University for in-mold electronics interconnection and thermoforming for 3D-integrated applications including automotive, aerospace, and medical components and devices.
• Development led by GE Research and Binghamton University for manufacturing approaches for low-cost, sustainable single-use medical devices with cost and environmental life cycle assessment.
• Development led by UES, Inc. for creation of scalable manufacturing systems for ELMNT liquid metal inks for highly stretchable electronics applications.
• Development led by Sentinel Occupational Safety, Inc. for safety assessments of FHE wearable chemical and voltage sensors for risk-reduced industry adoption.

For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/