MANASSAS, VA — ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that ZESTRON’s Senior Application Engineer, Ravi Parthasarathy will be presenting, “Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs”, at IPC APEX 2023 taking place in San Diego, California.

CoW (Chip on Wafer) is the next generation of CoS (Chip on Substrate) that first combines the chips to the interposer, adds wafer-level molding, and finally, they are connected to the flip chip (FC) substrate. This technology makes a better physical structure for accommodating very large die and larger overall interposer dimensions.

A continuation from the technical paper presented at APEX 2022 and titled “Defluxing of Copper Pillar Bumped Flip Chips,” this new study concentrates on cleaning under the next level of ultra-fine pitch CoW devices down to less than 25μm bump pitch and bump counts of more than 150K. This study focuses on the impact of wash temperatures and conveyor belt speed utilizing analytical/functional testing, including Visual Inspection, FTIR with color mapping, and SEM/EDX to assess cleanliness.

To download the APEX 2022 technical paper, “Defluxing of Copper Pillar Bumped Flip Chips” visit the ZESTRON Technical Articles page.

REDDITCH, UK — Lean manufacturing goals are still top of the agenda for companies producing electronic devices. Maximising productivity while minimising waste within a manufacturing operation is the main objective, and an important part of this principle is automation. Altus Group, a leading distributor of capital equipment, is assisting its customers with assembly solutions, including platforms designed to improve and automate high volume, high mix placement processes.

Labour intensive THT (Through Hole Technology) is still used in the assembly of PCBAs. This process is not only expensive, but also requires highly-skilled operators with the added challenge of human-error reducing quality. To automate the process and improve productivity Altus advises using Cencorp odd-form solutions.

Joe Booth, Altus CEO said: “Odd-form process automation is an efficient way to improve profitability significantly by increasing the throughput and assembly quality. They come into their own with the most complex and varied components, with flexible and sometimes bespoke gripper fingers to meet the requirements of picking and placing conventional parts.

“It is the ideal solution when production control is a high priority. Cencorp's platforms include traceability software, increased assembly reliability, accuracy, labour savings, assembly yield improvements and even floor space savings. Cencorp’s odd-form range meets the demands of the toughest quality requirements and works in harmony with lean manufacturing and automation solution principles.”

To find out more about Cencorp odd-form solutions, or methods to improve automation within your facility contact Altus, www.altusgroup.co.uk

PENANG, MALAYSIA — X-ray Inspection (AXI) equipment has become increasingly prominent in the circuit board industry with the emergence of intelligent terminal equipment and intelligent automotive electronic products. Electronic components are developing towards miniaturisation, refinement, and complexity. Therefore, manufacturers use AXI equipment for their production inspections to ensure reliable detection ability to pursue high product yields with high-quality final products.

To address these needs, ViTrox’s V810i Advanced 3D X-Ray Inspection (AXI) solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. With the V810i AXI solution, manufacturers can optimise production throughput and enjoy speedy and precise inspection capabilities.

Our smart V810i AXI solution offers world-class board inspection capabilities and Industry 4.0- compliant software for quality-assured inspection results. The V810i AXI solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. Besides, it is capable of handling the largest and heaviest PCB (size up to 52"x52" and weighing up to 25kg) in the market.

The latest V810i Series 3 (S3) AXI comes with a new ergonomic outlook that saves space capacity for users. By embedding its RRS Server (3DCT) and Supermicro (System Server) in the machine while eliminating the location of the external servers at the system’s exterior, the new design allows users to easily incorporate the solution into production lines while saving up more floor space. Additionally, equipped with an in-house developed Algebraic Reconstruction Technique (ART) with a model of sharp geometric 3D computed tomography, the V810i S3 AXI simplifies the process of performing accurate defect failure analysis results for further improvement.

The V810i AXI solution is equipped with a powerful test algorithm that provides automated and full-board 100% test coverage for PCB assemblies, hidden joint-related components, and more:
• Integrated power electronic components (i.e. IGBT) for high-power applications,
• Discrete components (i.e. transistor, resistor, capacitor),
• Connectors (i.e. SMT connector, variable height BGA connector, etc),
• RNet, SMT Connector, Gullwing,
• BGA (collapsible, non-collapsible, etc)
• PTH, Single Pad,
• Backdrill, and many more.

Furthermore, the V810i AXI solution integrates artificial intelligence (A.I.) capabilities to expand the opportunity for AXI inspection, enabling our unique A.I. inspection model to detect defects/abnormalities of specific joint types and further improve the inspection accuracy for both challenging and common pads, including pads consisting of multiple grayscales or unique profiles and characteristics.

JENA, GERMANY — GOEPEL electronic extends its strategic partnership program GATE (GOEPEL Associated Technical Experts) by adding OiTec, finnish expert in electronics testing, as a new member. Focus of the cooperation is on the development and practical implementation of new solutions, products and modules based on JTAG/Boundary Scan instrumentation as well as enhancements in the local support. Furthermore, an important component of the partnership is the integration of GOEPEL electronic’s JTAG/Boundary Scan hardware and software components into OiTec’ systems.

“The cooperation with OiTec has added another highly specialized technology enterprise into our GATE program”, says Frank Amm, Corporate GATE Program Manager with GOEPEL electronic. “Our new cooperation meets the needs of our customers to provide them with access to the latest options for Embedded JTAG Solutions, complete with extensive application support. By OiTec’ excellent know how and long-term experience we find us optimally positioned in this segment in the future.”

“At OiTec, we are constantly trying to expand our range of services. Through our service expansion in the area of test development and through the partnership with GOEPEL electronic, we can offer our customers even more efficient solutions”, says Pekka Oinonen, CEO at OiTec. “The Embedded System Access (ESA)-based technologies of GOEPEL electronic enable us to design future test solutions even more economically, and to offer even better fault diagnosis “, he adds.

“We are very happy to welcome OiTec Oy as new member of the Nordic/Baltic GOEPEL GATE Partner team” says Lars Kongsted-Jensen, Director, at GOEPEL electronic distributor EP-TEQ. “With their broad experience in both functional test, advanced adaptors and fixtures as well as GOPEL Embedded JTAG Solutions for, they are a true asset for our joint applications team”.