Seoul, South Korea – Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at APEX show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.

Europlacer Americas announces that it will exhibit two SMT assembly lines in Booth #2511 at the upcoming 2019 IPC APEX Expo. The high-speed line will feature the company’s award-winning, ultra-flexible atom3 placement machine downstream from the advanced EP710 AVi Screen Printer. The mid-range, very-large-board manufacturing solution consists of the company’s flagship iineo+ Multi-Functional Placement System with advanced LED binning in line with its EP1220 Long Board Screen Printer.

Company will conduct live demonstrations of their complete line of AOI and Conformal Coat systems in booth #2109

Kennesaw, Georgia, USA – Yamaha Motor Corporation USA‘s Intelligent Machinery (IM) Division is pleased to announce the addition of Miguel Colomer as an Applications Engineer for Solder Paste Printing in the Americas.