Milwaukee, WI – Milwaukee Electronics Company, today announced that Rick McClain had been promoted to president. McClain has served as the Company’s chief operating officer (COO) since 2016. P. Michael Stoehr, who previously served as president and chief executive officer (CEO), will continue as CEO.

Irvine, California, USA – TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.

March 12th, 2018 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces their participation at the SMTA West Penn Expo & Tech Forum, scheduled to take place March 28th, 2018 at the DoubleTree Monroeville Hotel in Monroeville, PA.