Kennesaw, Georgia, USA – The sharp, custom performance motorcycle in the center of the booth led the theme for YAMAHA’s IPC/APEX EXPO 2018 exhibit, “Revs Your Heart”, and there was much to quicken the pulse at the booth this year, judging from the many attendees swarming around the performance assembly technology arrayed around the perimeter of the exhibit.
Chicago, Illinois, USA – Flextron Circuit Assembly, a full-service contract electronics manufacturer, has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.
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By Phil Aponte, Siemens
With the majority of today’s consumer electronics being supplied from Asia, primarily through contract manufacturers which utilize a very high level of manual assembly labor, there is an increasing trend towards automation. For example, as Chinese labor rates continue to escalate, in an instant replay of the Japan scenario of the 70’s and 80’s, more offshoring is being transferred to lower cost labor markets in Southeast Asia, particularly India, Malaysia, Indonesia and Vietnam. However, as these countries also seek experience a similar increase in labor cost, the need for higher level automation and use of collaborative robots will accelerate.
[January 12, 2018 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces its participation in Fuji’s ELF Standard for M2M in SMT Assembly.