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Press Releases

Täby, 30 May, 2018 – Mycronic AB (publ) will showcase its growing range of next-generation jet printing, inspection, pick-and-place, dispensing and storage solutions for automated just-in-time electronics assembly at SMT Hybrid Packaging 2018 in Nuremberg (Booth 4-349, June 5-7).

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May 2018 — The Balver Zinn Group announces that it will exhibit in Hall 4, Booth #231 at SMT Hybrid Packaging scheduled to take place June 5-7 in Nuremberg, Germany.

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Pasadena, California, USA – Members of the NASA Technology Licensing and Commercialization Team visited the TopLine exhibit at the recent 2018 Space Tech Expo show in Pasadena, California, USA, where they awarded a NASA lapel pin to TopLine CEO Martin Hart in appreciation of TopLine’s efforts to develop a business model around PID (Particle Impact Damper) technology.

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Fontana, California, May 2018: Everett Charles Technologies’ (ECT’s) LFRE plated probes successfully passed extensive qualification testing verses an incumbent probe at a major US based OEM for power infrastructure equipment.

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Seoul, South Korea – Koh Young Technology will exhibit “True 3D Smart Factory solutions powered by the AI platform” in booth 4C-20 at the upcoming JPCA show scheduled for June 6-8, 2018 at the Tokyo Big Sight in Japan.

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Leading distributor of capital equipment for the electronics assembly industry in the UK and Ireland, Altus, is further strengthening its team in the UK with the announcement of a new spare parts and logistics co-ordinator to support the company in an operational capacity.

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