Press Releases
October 2018 — optical control GmbH is pleased to announce plans to exhibit at electronica 2018, scheduled to take place Nov. 13-16, 2018 at the Messe Munchen in Munich, Germany. The company will demonstrate the OC-SCAN®CCX.3 component counter with automatic loading and offline station in the joint pavilion “Cluster Mechatronik & Automation Management GmbH,” Hall A2 Booth 337.
EAST HANOVER, NJ – At the IPC’s APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability (BLR) of low temperature solder (LTS) assemblie.
Heraeus Electronics has opened a new Innovation Center in Shanghai to develop and test material systems.
Irvine California, USA – TopLine will exhibit its unique CCGA Column Grid Array technology in the USA Pavilion at the Electronica trade fair and conference in Munich, Germany, Nov 13-16, 2018.
ARLINGTON, Va.--(BUSINESS WIRE)--Oct 29, 2018--Cobham Advanced Electronic Solutions (CAES), a leading defense and aerospace electronics manufacturer, announced today that Shawn Black will join CAES as Chief Operating Officer.
Circuitsify, a full-service electronics contract manufacturing, expands their reach, from Los Angeles, California to “Hardware Silicon Valley” Shenzhen, China.
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System