NEW YORK--(BUSINESS WIRE)--Oct 31, 2018--In honor of the 12 th anniversary of the Green Electronics Council’s flagship EPEAT program, John Shegerian, Co-Founder and Executive Chairman of ERI, the largest fully integrated IT and electronics asset disposition provider and cybersecurity-focused hardware destruction company in the United States, has called the EPEAT standard an “essential indication of excellence” and has pointed to ERI’s manufacturing partners who have achieved EPEAT status as “genuine leaders in sustainability and the circular economy.”
BANNOCKBURN, Ill., USA, October 31, 2018 – Leaders of the U.S. electronics industry today unveiled the IPC Workforce Champions program and pledged to create at least 1 million new skilled workforce opportunities over the next five years.
October 30, 2018 – Chandler, Arizona – Koh Young Technology, the leading global manufacturer of 3D-based inspection solutions for the electronics industry, is pleased to announce that Mr. David Suh, Applications Team Leader, will present the white paper “Using Analytics to Overcome Production Challenges and Enable a Smart Factory” at the i4.0 Connect Forum, organized in cooperation with IPC and i4.0, scheduled to take place November 6-7, 2018 in Silicon Valley, California.
SAN JOSE, CA ― October 2018 ― Naprotek, Inc., a provider of electronic manufacturing services, today announced that it has installed its second Automated Production Engineering (APE) system from Cluso Vision Systems. The production tool provides 100 percent inspection of first article boards without time consuming programming.
Data I/O brings IoT ecosystem partners together to secure IoT devices for OEMs of all size and volume
ROSEMONT, IL – This month, the SMTAi 2018 conference was held at the Rosemont Convention Center, Rosemont, IL. One notable topic pertained to the board level reliability of low temperature or “lower-temperature” alloys. LTS assembly is of interest for multiple reasons including lower power consumption, less warpage and higher assembly yields, and a possible path to more complex assemblies. Much work is being performed to compare the reliability of LTS with conventional SAC alloy and some of that work was presented at the conference.