Circuits Assembly Online Magazine - Current

Press Releases

BROMONT, CANADA, January 2018 — Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, is pleased to announce the appointment of Ming-Ming Chang.

Irvine California, USA – TopLine will exhibit at the IC & Sensor Packaging Technology Expo, one of the seven shows concurrently hosted under one roof at the Tokyo Big Sight during the 47th Nepcon, January 17-19, 2018. At the expo, TopLine will introduce CCGA Column Grid Array technology as well as Vibration Damping for extending the life of Printed Circuit Boards.

HORSHAM, Pa.--(BUSINESS WIRE)--Aegis Software, a global provider of Manufacturing Execution Software (MES), today announced that it has been cited as a Notable Vendor in the Gartner report, Aerospace and Defense Context: ‘Magic Quadrant for Manufacturing Execution Systems’¹, and in the Industrial and High-Tech/Electronics Manufacturing Context: ‘Magic Quadrant for Manufacturing Execution Systems’ report².’

Plymouth, WI — January 2018 — Kurtz Ersa North America, a leading supplier of electronics production equipment, announces the appointment of SANTEC Marketing as its manufacturers’ representative in AZ, New Mexico and Sonora. SANTEC will be responsible for the sales of Ersa’s entire range of products.

Haverhill, MA January, 2018. Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.

Chelmsford, Essex, UK – 09 January 2018 – Pillarhouse International today announced: For a number of years there have been many discussions regarding the advantages and disadvantages of mechanical versus magnetic pumps on the selective soldering process, with about 50% of selective machine manufacturers opting for each method.