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Products

Yamaha Robotics SMT Section YSUP-PG programming module now features automated programming capabilities said to streamline program generation for all surface-mount processes, including dispensing, printing, placement and inspection.

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BEST StencilQuik is a custom stencil designed for ball grid array (BGA) and chipscale package (CSP) placement.

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AGC Multi Material Reusable Silicone Tape is for temporary fixation during SMT processes.

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Cetec ERP versions 4.16, 4.17, and 4.18 include new features to streamline production, optimize inventory management, and improve communication.

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Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.

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Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.

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