Hirose has expanded its DF22 Series of power connectors with the DF22B branch adapter, designed to simplify wiring and reduce cabling and installation time. The adapter enables branch wiring and supports up to 30A per contact at 1000V AC/DC with a four-point contact design and highly conductive materials. The series offers multiple configurations, straight, right-angle, and in-line wire-to-board, with three housing types featuring different guide keys and color variations to prevent mis-mating in systems using multiple connectors. For harsh environments, the DF22 Series straight header variant supports potting up to 10mm. The new DF22B branch adapter is designed for compact, high-current branching applications such as semiconductor equipment, industrial robots, conveyors, mounting machines and service robots.

Henkel has introduced Loctite TCF 14001, a high thermal conductivity silicone liquid TIM designed to meet the thermal control requirements of 800G and 1.6T optical transceivers. A thermal conductivity of 14.5 W/m-K. The two-part silicone formulation features low volatility and minimal outgassing. Its filler technology allows for automated dispensing with stable flow, strong adhesion and tolerance for gap variations. Beyond AI data centers, Loctite TCF 14001 is also suitable for other high-power applications in telecom, automotive, power generation and industrial automation. 

Promation has unveiled the PANDA-460 Laser Marking System. Supports CO₂, YV04 and UV Keyence laser heads within a standard work envelope, enabling high-speed marking on a wide range of substrates. The PANDA-460 leverages Promation’s proprietary software to provide remote access for programming, data transmission, diagnostics and maintenance. Built-in vision alignment, orientation validation, code verification and double-sided PCB marking capabilities. Designed for Smart Factory integration, the PANDA-460 is fully compatible with Promation’s broader automation ecosystem, including robotic soldering, PCB handling, AMRs and inline process equipment.

ASMPT has launched the Siplace Placement Platform, a newly developed SMT solution engineered to deliver up to 30% higher productivity for automotive, IT and network infrastructure sectors. The platform offers floor space performance while maintaining compatibility with existing feeders and SIPLACE software. It fits into ASMPT’s intelligent factory framework to support scalable, high-volume electronics manufacturing.