Alpha OM-377 no-clean solder paste is designed for ultra-fine feature printing in advanced electronics assemblies. The formulation supports component sizes down to 008004 and provides consistent transfer efficiency across fine-pitch designs. It is engineered to improve first-pass yield by reducing head-in-pillow and non-wet open defects while delivering electrochemical reliability for long-term performance. The halogen-free solder paste offers reliable wetting on brass and nickel surfaces and produces low post-reflow residue suitable for dense assemblies. Designed for high-volume manufacturing, Alpha OM-377 supports stable printing and reflow performance in high-density, low-standoff applications used in consumer, wearable and miniaturized electronics.

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Silicone-based thermal interface material supports heat dissipation in optical modules, dense electronics and high-speed data applications. DOWSIL TC-3120 Thermal Gel provides thermal conductivity of approximately 12W/m·K and is designed to minimize oil bleeding and condensed outgassing to help maintain optical-grade cleanliness. Flowable, one-part material supports minimum bondline thicknesses of 200µm, fills large gaps and can be reworked after curing. Designed for 800G and 1.6T optical modules, telecommunications equipment, electronic module assemblies, autonomous vehicles and automotive electronic controllers. Material resists thermal cycling, shock, vibration and slumping in vertically oriented assemblies while supporting module-to-heatsink interfaces with uneven surfaces or tolerance stackups.

TNC Series thick-film NTC thermistors provide temperature sensing and monitoring for automotive, industrial, battery management and medical electronics applications. Available in 0402, 0603 and 0805 case sizes, the series offers resistance values from 50Ω to 500kΩ, B values from 2410K to 4700K, and operating temperatures up to 150°C. Devices use thick-film technology to improve mechanical strength, maintain consistent thickness across resistance values and enhance resistance to cracking compared with multilayer thermistors. Components feature strong solderability, fast thermal response, heat resistance and AEC-Q200 qualification for demanding environments.

Stackpole Electronics introduced the HCC series high-current busbar shunts for battery electric and hybrid vehicle current sensing applications. Designed for battery management systems, DC bus measurement and inverter output current monitoring, the series supports current handling above 1400A with resistance values of 100, 50 and 25µOhm. Features all-welded construction for mechanical durability and linear current measurement output across high-current EV subsystems. Available in multiple package sizes and resistance values, the shunts are intended for scalable EV and hybrid power system designs. Stackpole also offers custom sizes, shapes and resistance values through its vertically integrated manufacturing operations.