Products
Shenmao's SMBF-08 Visible No-Clean BGA Flux is designed to meet the demands of SMT assembly and BGA ball mount processes.
Henkel's Bergquist Hi Flow THF 5000UT phase change film TIM allows for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface.
Ersa's i-CON Mark 2 soldering station series features soldering tip technology known from the IoT soldering station i-CON TRACE with extremely fast heat-up and reheat characteristics and a precise temperature control of +/- 2°C.
ViTrox's Smart Reel Changer 2.0 for its TR3000i Inspection Handler is designed to improve throughput and reduce operator dependency.
Indium8.9HFRV is an air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys.
Rohm Semiconductor's GNP1070TC-Z and GNP1150TCA-Z are 650V GaN (Gallium Nitride) HEMTs optimized for a wide range of power supply systems applications.
Press Releases
- Indium Corporation to Showcase Innovative Electronics Assembly Products at International Symposium on Microelectronics
- Cirtronics Welcomes Patrick Moody as New CEO to Lead Next Era of Growth
- Kurtz Ersa: New Factory Launched in Ciudad Juárez
- Bright Machines Appoints Seasoned Enterprise Technology Executive Chris Stori as CEO to Drive Next Phase of Growth