Inspect-X 4.1 acquisition and analysis software for x-ray and CT systems provides improved real-time imaging and advanced BGA analysis. Real-time image enhancements provide easy-to-interpret images for fast online defect recognition. Image processing algorithms enable automated BGA analysis and reporting for stacked components and multilayer boards. Intelligently adapts to changing x-ray conditions and sample positions, automatically adjusting image controls, contrast and brightness to provide clear, sharp images to aid in defect recognition. Enhancements and filters can be chosen and stored as user profiles to suit different sample types or individual operator preferences. New BGA tool provides powerful image processing, fully automated analysis and detailed reporting to inspect complex packages such as package-on-package (PoP) or dual-layered boards. Features a user-friendly template creation GUI of each BGA package, detailing array dimensions, positions and geometries using a wizard or directly imported from file. Automatically inspects each ball using advanced void analysis featuring single and total void percentage per ball. Also checks ball count, circularity, under- or oversizing, bridging and misalignment defects. Built-in reporting features overlay the x-ray images with color-coded analysis for easy interpretation. Is for large batch inspection; can inspect multiple boards in one routine.

Nikon Metrology, www.nikonmetrology.com

3D sensing capabilities incorporate multi-reflection suppression technology and 3D algorithms. Enable high-quality 3D images at production speeds, using multi-view sensors. Multi-view 3D data are merged with algorithms and MRS that suppress reflection that can distort data. Sensor design captures and transmits data simultaneously and in parallel.

CyberOptics Corp., www.cyberoptics.com

XQuik combines x-ray imaging with AccuCount Technology image processing and inventory management to provide accurate counts of components stored in tape-and-reel. Is said to automatically completes the count of components as small as 01005 with better than 99% accuracy in seconds. Works without having to remove reels from moisture barrier or anti-static bags. Benchtop system with a footprint of 26 x 24" (66 x 62cm). Barcode reading, automatic label printing and MES system interface options available.

VJ Electronix, http://vjt.com/vje/vje/

TrueHeight Spacer Blocks non-collapse disc spacers are said to improve yields of assemblies with large BGA devices. Enables reflow soldering of some types of through-hole devices. Are said to mitigate corner solder bridging caused by BGA warping during SMT reflow. Come in tape-and-reel packaging for automatic placement. Aid in intrusive reflow applications where there is either no standoff function or inadequate clearance under through-hole components by raising the component off the PCB, permitting solder to reflow freely to achieve 100% hole fill.  Height control + 0.010mm.

Alpha, www.alpha.alent.com