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BuGang's M/C Nozzle Cleaner series offers simultaneous cleaning of up to 24 nozzles at a speed of 12 seconds per nozzle.

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AIM Solder's H10 is a halogen-free no clean solder paste capable of transfer efficiency greater than 90% on area ratios of 0.50 and a stencil life of more than 8 hours.

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Rohm Semiconductor's BD7xxL05G-C series of primary LDO regulators features a rated input voltage of 45V and 50mA output current optimized for redundant power supplies.

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Heraeus Electronics' Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste is a  high reliability, high performance solder paste that provides a competitive TCO offering.

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Shenmao's PF735-PQ10-10L is a low melting point lead-free solder paste that has been designed for the SMT process and is meant to increase production capacity in the high-speed printing process.

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Kyocera AVX's new range of radial-leaded aluminum electrolytic capacitors are engineered for use in industrial, communications, and consumer electronics applications. Comprised of REH, REF, and REH Series wet aluminum electrolytic capacitors, RPA and RPF Series conductive polymer aluminum electrolytic capacitors, and RHA and RHD Series hybrid aluminum electrolytic capacitors.

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