X-Plane x-ray inspection system views individual 2D slices within a sample from top-to-bottom, front-to-back, left-to-right, and any plane in between. Can use anywhere in an 18" x 16" inspection area. No need to cut or destroy the board. Works at high magnifications. Available on Diamond FP, Diamond, Ruby FP, and Ruby x-ray systems. Shows position and size of voids at joint interfaces and other locations within BGA, CSP, QFN, LGA, etc.; identifies Head in Pillow and open joints; inspects different layers within package on package or MCM; identifies tilted components and board warpage.

Nordson Dage, www.nordsondage.com

MUNICH – Initial thoughts from Productronica, where the weather was brisk outside, but starting to heat up inside.

Traffic was a bit slow relative to past years. The show itself seems smaller – and again, this is relative, as it remains bigger than almost all the other major electronics assembly trade shows combined – with traditional powerhouses like Siemens, Universal Instruments and other placement companies occupying booths that, while they would still qualify as monstrous at any other show, no longer fill entire halls on their own. (This is a good thing.)

Read more ...

iFlex SMT solution is designed to increase productivity in high product mix environments by more than 30%. Uses single‐pick/single‐place technology; reportedly has defect levels of less than 10 DPM. Features dual transport lanes, dual-sided feeding, internal buffer positions, and feeder and trolley exchanges during production. Is designed for high throughput. Uses ‘Independent Dual Lane’ concept to provide volume on one lane, while frequently changing jobs on the second. Can be configured to tailor assembly lines from one to more than eight modules. iFlex T4 suits chip and small IC shooting (4 placement robots, placement speed of 51,000 cph, 128 twin tape feeder positions); iFlex T2 is aimed at flexible placements (2 placement robots, placement speeds of 24,000 cph, 128 twin tape feeder positions); iFlex H1 is for ICs and fine pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions).

Assembléon, www.assembleon.com

iFlex SMT solution is designed to increase productivity in high product mix environments by more than 30%. Uses single‐pick/single‐place technology; reportedly has defect levels of less than 10 DPM. Features dual transport lanes, dual-sided feeding, internal buffer positions, and feeder and trolley exchanges during production. Is designed for high throughput. Uses ‘Independent Dual Lane’ concept to provide volume on one lane, while frequently changing jobs on the second. Can be configured to tailor assembly lines from one to more than eight modules. iFlex T4 suits chip and small IC shooting (4 placement robots, placement speed of 51,000 cph, 128 twin tape feeder positions); iFlex T2 is aimed at flexible placements (2 placement robots, placement speeds of 24,000 cph, 128 twin tape feeder positions); iFlex H1 is for ICs and fine pitch placements (1 placement robot, placement speed of 7,100 cph, max 146 twin tape feeder positions/max 30 tray positions).

Assembléon, www.assembleon.com