Alpine OT2 solder paste contains a flux medium said to eliminate defects related to oxidation and miniaturization. Flux is halogen- and halide-free, and for use with SN100C, SCANGe-071 or SAC305. Is rosin-based and prints at high print speeds (>200 mm/sec). Paste is said to eliminates head-in-pillow defects, and shows no graping or defects.

Cobar Solder Products/Balver Zinn, www.cobar.com

Alpine OT2 solder paste contains a flux medium said to eliminate defects related to oxidation and miniaturization. Flux is halogen- and halide-free, and for use with SN100C, SCANGe-071 or SAC305. Is rosin-based and prints at high print speeds (>200 mm/sec). Paste is said to eliminates head-in-pillow defects, and shows no graping or defects.

Cobar Solder Products/Balver Zinn, www.cobar.com

The 34-gauge dispense tip has an inside diameter range of 0.003" - 0.0045". Is ideal for dispensing micro shots of low-viscosity fluids. Consists of electro-polished stainless steel cannula and double helix polypropylene hub. Is silicone- and chloride-free. Is available in bulk quantity and packs of 50 pieces.

Techcon Systems, www.techconsystems.com

Mini-Oven Reball/Solder Bumping unit 04 provides controlled air circulation; hot air continually flows around the component, heating it equally from all sides. Offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine-tune parameters. Reballing function is capable of handling diverse range of BGAs, as well as QFNs and CSPs. Rapid Technology soldering profiles apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain a safe temperature zone. Is ideal for the complete QFN solder bumping process. Uses Hotprint Technology; mask remains on the QFN during reflow.

Martin, www.bgarework.com