DB-1580 series conductive stringer attach adhesives are for back contact applications in crystalline silicon solar modules. Are designed to make contact from vias or other conductors in the solar cells to the back contact sheet. Are stress absorbing and have excellent conductive stability to back contact metallizations during damp heat exposure. Are designed to cure through the encapsulant lamination and cure process. Fast cure versions are available for co-curing with fast laminating encapsulants.
Engineered Conductive Materials, www.conductives.com
A-Series Hybrid targets manufacturers in the semiconductor backend industry. Introduces parallel placement technology to applications like SiP, MCM manufacturing, and flip chip bonding. Includes programmable placement force control. Has fluxer dip station and high-accuracy cameras. Can bond flip chips at a repeatability of 10 µm, while placing at 2,500 components per hr. per single placement head. Die bonding speeds are 3,500 cph per head at 25 µm, while passives are placed at 8,000 cph at 40 µm. Can carry up to three specialized twin placement robots, holding two heads per robot, for a total flip chip bonding speed of 15,000 placements per hr. per machine. Can also carry conventional placement robots for chip shooting for passives as small as 01005.
Assembléon, www.assembleon.com
Screwdriver System is a series of high-precision electronic and mechanical torque control screwdrivers for electronics assembly applications. Uses scalable current reference to run entire torque range of the tool. Controllers feature digital and analog hardware for application flexibility. Small controller footprint; weighs less than 4 lb. Auto-sensing input voltage; quick-change connections. ESD-safe and clean room ready.
Weller, www.weller-tools.com
Vir-Stat air ionizers (VS-100) eliminate static charges in ESD-sensitive assembly areas. Are available in various configurations. Two bench-top units direct ionized air to the workspace directly in front of an assembler. One unit has an RS485 port for data collection; the other does not. Overhead ionizing units are available for controlling larger areas. Reduce "stiction" when handling extremely small insulative components.
Virtual Industries, www.virtual-ii.com
Positive Cavity Displacement ‘H’ Series high-resolution pumps are compatible with epoxies, thermal greases, underfills, oils, silicones and UV encapsulants. Are designed for GPD platforms and may be used with other robots or tabletop operations with a tabletop controller. Viscous fluids are delivered to the substrate via luer nozzles; performance excels when using ‘S’ Taper tips. Metering technique is not affected by variations in temperature or reservoir pressure. Luer dispense tips offer higher flow rates than standard luer nozzles with a lower pressure buildup.
GPD Global, www.gpd-global.com
CM-series ionic tester uses a solid gold test-cell, ballistic amplifiers, and high-volume pumping systems. Produces complete test solution change more than 6x per min. PC-based software is used to produce graphical test data, a pass/fail analysis, and automatic hard copy print-out using test methods according to MIL and DEF standards. Features include solid gold measuring cell and ballistic amplifier, providing a test accuracy of < 0.005mS/cm; curve-fitting analysis algorithm (merit of fit); complete testing within 3 min.; full regeneration in < 6 min.; accurate measurement, and automatic temperature compensation. Measures in accordance with all international and MIL specifications, and complies with J-STD 001, IPC-TM-650, and DEF Standard 00-100/3.
GEN3 Systems, www.gen3systems.com