KISS selective soldering machines now have a dual nozzle option. Two nozzles operate in tandem, each one individually programmable. A board with components of different sizes can be processed in a single pass. Both nozzles operate within a single soldering sequence program. Can process a small component using a 3 mm or 6 mm nozzle, as well as a larger multi-row connector on the same PCB using a 12 mm or 18 mm nozzle.

ACE Production Technologies Inc., www.ace-protech.com

CB-400 COBRA-4 features a dual-head blue and white light LED flashlight, which enables leak checking and internal component inspection into hard-to-reach areas. Blue-light LED is for fluorescent leak detection, while the white-light LED is for component inspection. Press-fit coupler permits quick and easy attachment of the flashlight to the borescope. Includes clip-on, angled inspection mirror for detecting flaws normally hidden from view.

Spectronics, www.spectroline.com

Cion ICT Adapter is a relay card for integration into fixture adapter systems for ICT. Enables switching of 32 test channels from the ICT to Scanflex. Prohibits a collision of both systems’ signals; minimizes dynamic effects because of multiple wiring at critical nets. Two LEDs indicate 5 V supply and activation state. Is available in different assembly variants: Relay Adapter SL is equipped with pin contact strips and suits bird nest wiring by wire wrap into adapter systems, as well as wiring a 50-pin ribbon cable, as used in DIO plug modules; Relay Adapter BU and Relay Adapter BU90 are single-sided, equipped with connector strips; enable direct pluggable connection to Cion Modules such as FXT96 in both horizontal and vertical directions. Can be used with plug-in card transceivers. Boundary scan TAP signals are switched with relay adapter similar to TIC02/SR modules. Switching 32 PIP signals is possible with one card.

Goepel electronic, www.goepel.com

S3X-BF70M and 200N series wafer bumping pastes exhibit a high definition over time at elevated temperatures. S3X-BF70M series is for 250 μm bump sizes. Offers superior cleaning performance in a SAC 305 powder with a 20~38 μm diameter. S3X-BF200M is for 100 μm bump sizes with a SAC 305 powder and 5~20 μm diameter.

Ko-ki, www.ko-ki.co.jp