Products
Kester 295 No-Clean Flux is free of halides and bromides. Designed for cored solder wire. Tested to conform to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01, with no chlorine and bromine detected. Designed with blend of rosin and proprietary activator system. Reportedly eliminates splattering and the need for cleaning. Residues are non-conductive and non-corrosive. Is available in a variety of alloys, wire diameters and flux percentages. Is classified as type ROLO flux. Can be used for both lead and Pb-free soldering. Recommended solder iron tip temperature: 260°C to 370°C for Sn63Pb37 and 350°C to 400°C for Pb-free SnAgCu alloys.
Kester, www.kester.com
A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.
RMD Instruments LLC, www.rmd-leadtracer.com
SchmartSolder is said to make hand-soldering through-hole components simple. Is loops of solder produced to fit over component leads. Reportedly melts and flows into the hole quickly.
SchmartBoard, www.schmartboard.com
The scanner-based FA-Inspector optical inspection system uses a high-res scanner and computer-based image processor to provide image acquisition, fault identification and SPC reporting. Incorporates proprietary optics, custom illumination and AOI Software. Board handling is said to be up to 19" x 24" with area of inspection of 11" x 16" in a single scan. Defect coverage includes SMT and PTH parts down to 0402, part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences. Two modes of operation: AOI and Comparator.
FocalSpot Inc., www.focalspot.com
Turbo-Coat Acrylic Conformal Coating is designed to speed up board production throughput without additional UV systems or other capital equipment. Is said to dry tack-free in three min.; full cure achieved as quickly as 10 min. with elevated temperatures. Can be sprayed or brushed; boards can be dipped directly. One-pass application; IPC-CC-830 and MIL-I-46058C tested; UL94 V-0 rated; UV indicator for black light QC inspection; MEK, Toluene and Xylene-Free; adjustable spray head.
Techspray, www.techspray.com
Alpha POP-959 Pb-Free, no-clean solder paste is designed to deliver repeatable paste volumes for PoP assembly. Provides flux and solder powder. Designed to minimize expensive rework and scrap. Is said to offer resistance to shear forces associated with PoP dip application equipment. Reportedly maintains rheology for at least 24 hrs. Is said to be ideal for 150 to 300 µ offset chip scale packages, while leaving a clear, colorless, residue with high electrical resistivity.
Cookson Electronics Assembly Materials, www.cooksonelectronics.com
Press Releases
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