EZReball solder ball preform is said to simplify the reballing process. Permits reliable replacement of solder balls on a BGA device. Alignment is reportedly simple with the edges being “squared up” with the sides of the package; is said to eliminate the need for custom frames or fixtures. Adhesive holds balls firmly in place until after reflow. After reflow, the stencil is peeled off. Comes in packages of 15. Stencils are custom made, including SnPb and Pb-free alloys.

BEST Inc., www.solder.net

EnviroMark 923 is a halogen-free, Pb-free and no-clean paste. Is said to have excellent wetting, low voiding and soft pin probeable residues. Reportedly has consistent solder paste volume deposits regardless of idle time, stencil life and print speed. Offers 0201 print and reflow capabilities with standard Type 3 powder. Capable up to 200 mm/sec print speed and bridge resistant.

Kester Inc., www.kester.com

EnviroMark 828 is a Pb-free water-soluble paste with ultra low BGA voiding. Is said to create no foam in inline washers and has excellent solderability. Has non-slumping chemistry.

Kester Inc., www.kester.com

The DXBG bench dispenser is for two-component reactive resins of a variety of ratios. Permits A and B components of flowable adhesives to be gravity-fed from separate, refillable two-gal. containers. Components are forced by metering rods directly into a disposable static mixer. Comes with a foot pedal actuator. Permits hands-free operation. Stand is adjustable over three axes.

Mixpac Equipment Inc., www.mixpacequipment.com