MultiWriter pps on-board gang programming system is said to use concurrent programming to program up to 24 parts each of up to 16 different types simultaneously (up to 384 chips). Reportedly speeds programming for microcontrollers and flash memories mounted on boards. Enables programming of data such as serial numbers and date codes. Includes integrated PC system console, Lambda 0-60V, 12.5A programmable power supply, MultiWriter controller and GenRad 227X fixture interface. A bed-of-nails fixture reportedly contains only probes necessary for powering the board and contacting the circuit nodes required for programming and verification.
 
CheckSum, www.checksum.com
 

CION Module/FXT114S JTAG/Boundary Scan module is controlled via a standard test access port. Provides 114 parallel I/O channels with IEEE-Std. 1149.1 compliant test resources. Can be integrated into test adapters. Provides 64 single-ended test channels. Channels independently controllable and I/O voltage can be programmed from 1.8V to 5.0V in groups of 32 channels. “Unstress” feature protects unit under test. Provides 50 differential (LVDS) channels. Said to be suitable for test of non-scannable circuit clusters, peripheral connectors, backplanes and AC-coupled networks.
Supported in the software platform System Cascon and can be used with ScanBooster and Scanflex boundary scan controller.
 
Goepel electronic, www.goepel.com

UniQuant XRF analysis tools come on the ARL QUANT'X energy dispersive x-ray fluorescence system for elemental analysis. A camera is integrated for sample imaging. Is designed for qualitative and quantitative nondestructive elemental analysis of any samples. Reportedly is capable of achieving accurate analysis of major, minor and trace elements in a variety of materials. Uses eight filters. Software corrects overlaps and background effects and enables analysts to specify properties, such as area, height or mass. Can be precalibrated.
 
Thermo Fisher Scientific Inc., www.thermofisher.com
 

Alpha SACX 0807 is said to offer performance similar to SAC 305 on complex, dual-sided assemblies where excellent wetting is required. Reportedly produces less dross and works well in the lower operating temperature processes associated with high-Ag SAC alloys. Comes in standard bar, feeder bar and wire forms.
 
Cookson Electronics Assembly Materials, www.cooksonelectronics.com