Multicore DA100 is a dispensing grade die attach solder paste. Is said to offer thermal management, while providing ease of removal during cleaning. Is comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C; has been optimized for higher temperature processes, typically in excess of 350°C. Has been designed so that the flux residues are easily cleaned with various solvents. Reportedly no incompatibility issues with flux residues and mold compounds. Is said to maintain integrity of copper leadframe. Has been developed to provide low voids, averaging less than 5%.
The Trident Automatic Defluxing and Cleanliness Testing System E-Learning presentation is 17 minutes and covers control and cleaning technology; cleanliness testing and drying technology; discharge configurations; throughput configurations and general features. The presentation can be viewed, paused and navigated at any time.
The M1 AOI offers 3 MP resolution, telecentric optics and proprietary lighting, for inspecting bond wires, die placement, SMT components and substrates. Footprint is smaller than 1 sq. meter. Works in- or offline. Options include magazine loader and unloader, top and bottom laser and ink markers, and remote location recipe development. Uses a standard SMT package library to simplify training and portability.
“How to Optimize Your Assembly Operations” is a free, 12-page guide comparing synchronous and non-synchronous flexible assembly conveyors, complete with supporting illustrations and charts. Includes a detailed diagram of a non-synchronous pallet-based modular conveyor with callouts of all major components. Features tips on when to consider modular conveyors, and a listing of benefits of modularity, including phased implementation; integration of automated processes; line balance flexibility; integration of test functions; implementation of process controls; material flow options; reduced work-in-progress; improved ergonomics; reduced footprint and reusability. Also offers illustrations of how the modular conveyor line can be reconfigured or expanded over time, as well as system configurations.
Siplace Fast System Recovery v. 1.0 software ensures line computers can be made operational again after such problems as hard drive disk errors and accidental file deletions. Creates fast and highly configurable data backups on local media or servers over the Siplace network. Provides reliable data restoration by identifying the data’s source and target locations. Backs up specific directories and files or the entire hard disk in the form of an image. This backup can be written to a local USB stick or DVD writer, or to a central server on the Siplace network. Is administrator-controllable.
System 120 benchtop wave solder system is for single-point or single-edge soldering and removal of ICs, including DIPs, QFPs, PGAs, connectors and odd forms. Is said to be ideal for short runs requiring selective soldering of single components. Has adjustable temperature range to 399ºC. Is for Pb-free or SnPb processing. Includes three processing nozzles.