Circuits Assembly Online Magazine - Current

Products

The X7056 features parallel AOI and automatic 3-D x-ray inspection with top and bottom optical views. Microfocus x-ray tube has a reported resolution of 15 µm per pixel. Iterative Easy3D software yields highly accurate image quality. Includes 6 MP sensors, and can be equipped with AOI cameras for simultaneous top- and bottom-side PCB inspection. Simultaneous inspection and double-track loading lower handling times. Is fully modular, and can be used as a combination AOI/AXI or pure AXI system.

Viscom, www.viscomusa.com

HumiSeal UV40 reportedly won’t crack under thermal cycling. The polyurethane-polyacrylate hybrid, UV-curable polymer structure coating is said to have low viscosity. Said to be physically flexible, particularly in response to thermal cycling duress. Has reported low solvents (less than 3% content); meets all ISO 14001 and major health and safety and hazardous chemical regulatory requirements.

HumiSeal, www.humiseal.com

Medalist 5DX automated x-ray inspection’s 8.4 software release reportedly contains specialized algorithms that permit inspection of quad-flat, no-lead (QFN) components with reduced false call rates; defect characterization on non-wetted direct FET (field-effect transistor) by using an open slope paste test; and a threshold enabling inspection for solder presence along side edges of capacitors.

Agilent Technologies, www.agilent.com

The LNC 60 is used to simultaneously align components on six nozzles on each placement head inside JUKI’s newest pick-and-place machines. The LaserAlign sensor reportedly allows the component alignment process to perform rapidly on the fly. Will be used in KE-2070 series of high-speed chip shooters and KE-2080 series of high-speed flexible mounters, reportedly capable of placing down to 01005 components.

CyberOptics, www.cyberoptics.com

The BondJet BJ915 heavy wire bonder reportedly offers the highest speed and accuracy, and the largest work area available. Highlights are said to include a 10% speed increase over BJ910 with bonding speeds reported as fast as 450 ms/wire (300Âµm diameter 8 mm loop length wire) and 10 µm at 3 sigma placement accuracy. Said to be the only heavy wire bonder with both integrated pull test and nondestructive shear test capability. A process-integrated quality control (PIQC) system is said to provide wire deformation graphs for multiple or single wires, data logging of all error messages and tolerance limits, storage and printing of deformation curves for analysis, statistics, and process control.

Hesse & Knipps, www.hesse-knipps.com

The BluePrint-PCB Viewer application is available as a free Web download. Reportedly allows users to create a comprehensive PCB release package. Supports three viewers, including a standard viewer; one that supports html and can be viewed using an Active X component, and the Pack and Release Viewer, which is said to allow users to control the amount of time a document release package may be viewed by a third party. All versions support hyperlinking functions that link details to notes and callouts as well as URLs, e-mail addresses, audio, video and other electronic files. Reportedly can view and query the native CAD data. Contains search function.

DownStream Technologies, www.downstreamtech.com