Products
Polymer System Supreme 10HTFL is a one-component, flexible, high-performance, epoxy resin-based adhesive/sealant with a service temperature range of -300° to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250° to 300°F and above. Features extended ambient temperature storage capability and does not require refrigeration for extended storage before use. Said to exhibit high physical strength properties and excellent adhesion to a wide range of metallic and nonmetallic substrates even upon prolonged exposure to hostile environmental conditions.
Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding.
Has high resistance to severe thermal and mechanical shock and vibration. Pertinent physical strength properties including flexibility are retained when bonded assemblies are subjected to demanding service conditions. Performance properties are impressive when bonding substrates with wide differences in their thermal expansion coefficients. Reportedly has superior chemical resistance to water, salts, oils, fuels and many organic solvents. Is an excellent electrical insulator. Does not require mixing prior to use.
Master Bond Inc., masterbond.com
Adhesive and sealing properties to aluminum, steel and other metals, as well as fiber reinforced composites, most plastics, ceramics, glass, wood, etc. are high. Tensile lap shear strengths of more than 2000 psi and T-peels in excess of 60 pli are obtained for aluminum bonding.
Has high resistance to severe thermal and mechanical shock and vibration. Pertinent physical strength properties including flexibility are retained when bonded assemblies are subjected to demanding service conditions. Performance properties are impressive when bonding substrates with wide differences in their thermal expansion coefficients. Reportedly has superior chemical resistance to water, salts, oils, fuels and many organic solvents. Is an excellent electrical insulator. Does not require mixing prior to use.
Master Bond Inc., masterbond.com
Pittsburgh, PA -- On Tuesday, June 6, Dr. Jonathan Cagan, chief technologist and co-founder of DesignAdvance and professor of Mechanical Engineering at Carnegie Mellon University, will give a keynote address at the Pittsburgh Technology Council’s “Innovation Day.” His topic will be “Pragmatic Innovation – Understanding Innovation in the 21st Century.”
Dr. Peter Boatwright, professor at the Tepper School of Business of Carnegie Mellon University, will also speak at the event. Dr. Cagan and Dr. Boatwright are co-authors of the book The Design of Things to Come.
The Drs. will then moderate a panel on the same topic. Participants include: Tom Bonnell, director of design at Repironics; Randy Eager, CEO of DesignAdvance; Eric Close, CEO of RedZone Robotics; and Todd Summe, manager of new product innovation at Alcoa.
The event will take place at the Westin Convention Center in Pittsburgh. For more info., visit pghtech.org/events/innovation.asp.
Dr. Peter Boatwright, professor at the Tepper School of Business of Carnegie Mellon University, will also speak at the event. Dr. Cagan and Dr. Boatwright are co-authors of the book The Design of Things to Come.
The Drs. will then moderate a panel on the same topic. Participants include: Tom Bonnell, director of design at Repironics; Randy Eager, CEO of DesignAdvance; Eric Close, CEO of RedZone Robotics; and Todd Summe, manager of new product innovation at Alcoa.
The event will take place at the Westin Convention Center in Pittsburgh. For more info., visit pghtech.org/events/innovation.asp.
El Segundo, CA – Spansion LLC in the first quarter retained its position as the world’s leading supplier of NOR-type flash memory, according to preliminary market-share data from iSuppli Corp.
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
The U.S.-based company achieved NOR sales of $562 million in the first quarter, down 6.5% sequentially. Intel held onto second place with revenue of $537 million, down 10.5% from $600M in the fourth quarter. Europe’s STMicroelectronics remained in third place with revenue of $327 million, a 2.4% decline from Q4.
Woodinville, WA – PCB manufacturer UMC (Universal Manufacturing Corp.) has acquired additional advanced technology processing equipment, including two Pluritec auto loading CNC drilling machines, a Lohr Herman CNC jump scoring machine, an X-ray registration/ verification system, a thin core/fine line copper etching system, an advanced fine line laser photo plotter and an RoHS-compliant immersion silver/gold plating line.
UMC also announced that Ken Stowers, former owner of Velie Circuits Inc. (Costa Mesa, CA), joined UMC as VP of marketing. Rob Newton and Shaun Salas, also formerly of Velie Circuits, joined as direct sales people.
PHOENIX, AZ – FlipChip International and Engent have formed an alliance to accelerate the development and deployment of 3-D Wafer Level CSP (WLCSP) technologies for highly integrated stacked die packaging applications. This technology may enable packaging solutions that are quicker to market and lower cost than system-on-chip alternatives.
The partnership couples FCI’s high-volume, ultra-fine pitch wafer bumping capabilities and 2-D Wafer Level CSP package portfolio with Engent’s abilities in advanced surface-mount and flip-chip assembly technology. The flexible technology platform emerging from this partnership supports a range of ultra-high volume IC packaging applications including Silicon on Silicon, GaAs on Silicon and SiGe on Silicon as well as 3-D integration of emerging integrated passive device technologies and MEMS devices for System in a Stack solutions.
SUZHOU, CHINA -- Kemet will add a third tantalum capacitor manufacturing facility in the Suzhou area within the next two years, the company said.
The company has already invested a total of $70 million on two plants in the area, and its two factories total 20,000 sq. m. and employ 940 workers.
Kemet's customer base in Asia accounted for 37.9% of sales in fiscal 2006.
The company has already invested a total of $70 million on two plants in the area, and its two factories total 20,000 sq. m. and employ 940 workers.
Kemet's customer base in Asia accounted for 37.9% of sales in fiscal 2006.
Press Releases
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- APE, Automated Production Equipment, Marks 56-year Milestone