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MILPITAS, CA -- Marc Onetto, executive vice president for worldwide operations of Solectron Corp., has resigned to pursue other interests.

His duties will be assumed by chief executive and president Mike Cannon on a temporary basis.

SALT LAKE CITY -- CirTran Corp., an electronics contract manufacturer, today announced that a $1 million investment in the company has been made by a private California company.

ANAHOP, an Anaheim, CA-based company, has contracted to purchase 14,285,715 shares of CirTran's restricted common stock for $.07 per share without any registration rights.

The initial payment of $500,000 was made on May 24, and additional payments of $250,000 each scheduled to be completed on or before June 2 and June 30, 2006, respectively.

ANAHOP's principals will receive warrants to purchase additional shares of CirTran common stock, up to 15 million shares, at an exercise price of $0.15 per share, up to 5 million shares at $0.25 per share, and up to 10 million shares at an exercise price of $0.50 per share.

Solderite, a provider of Pb-free soldering solutions, introduces the Solderite 3500 Lead-free Soldering Station. The patents incorporated in the station were filed and granted to design a superior lead-free soldering station.

Features remote-controlled temperature programming; pre-set temperature settings can be varied for specific temperatures. Comes standard with automatic tip temperature compensation, standby mode and automatic off functions. Includes a quick calibration mode that allows operators to test the true soldering tip temperature and calibrate temperature, if needed.

The company’s "power on demand per demand" technology reportedly ensures that the specially designed electroplated tips deliver an outstanding life cycle.

Solderite, solderite.com

SAN FRANCISCO - Inventories throughout the high-tech food chain are under control and look unlikely to balloon out of control over the sluggish summer months ahead of the key year-end holiday season, industry executives reported at the JPMorgan Technology Conference this week.

The comments made by chief executives and CFOs come amid growing concerns that an inventory glut in the face of potentially flagging demand will weigh on profits.

While the fourth quarter is great for electronic gadget sales because of Christmas, and firms often spend more on technology toward the end of the year to pad out annual budgets, unsold output can pile up in the intervening months.

March Plasma Systems has release of an improved version of its AP-1000 plasma system for high-volume plasma processing of semiconductor and microelectronics devices. The current system has a large installed base at customer sites worldwide, with over 200 systems currently in the field. The redesigned version provides the same production-proven plasma technology and performance in a smaller, more compact and easier-to-service design.

"Every square inch of clean room and manufacturing space is valuable," said Peter Bierhuis, president. "We have improved the new AP-1000 system to consume 24% less actual floor space than before, and 45% less effective floor space when you include all of the required maintenance areas. We have also moved key components to make them more accessible and easier to service. An added benefit for large-scale manufacturing facilities is that more AP-1000 systems can be placed side-by-side in a smaller area because now the chassis is smaller, there are no required maintenance areas at the sides of the system, and the plasma chamber door has been redesigned."

The system is capable of a variety of plasma modes and can handle a range of plasma gasses. March specifically designed the new system with existing customers in mind so that process re-qualification is not required when switching to the improved system. Accordingly, new system process performance is guaranteed for customers with copy-exact requirements.

March Plasma Systems, marchplasma.com

MINNEAPOLIS, MN – As part of SMTA International – co-located with ATExpo in September in Rosemont, IL – the SMTA has organized its Emerging Technologies Summit to address the latest trends in electronics manufacturing and assembly. The ET Summit, which consists of three paper sessions and a concluding panel discussion, will take place on Sept. 25.

The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip-Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.

The next session, Wireless Technology, will feature papers on Emerging Opportunities and Challenges for High Frequency Broadband Communications, Connecting the Unconnected – Broadband Wireless Access Technologies, and Network, WiFi, WiMax, WiMedia, WiMe? What Wireless Standards Can Bring to Sensing and Controls.

The last session, Using RFID to Add Value to Your Products and Services, will feature a presentation and demonstration of high frequency and ultra high frequency technology and their application in PCB product environments.

Moderated by Reza Ghaffarian, Ph.D., of Jet Propulsion Laboratory, the panel discussion will feature key industry participants who will respond to audience and moderator questions.

For event registration, visit smta.org/smtai.