Valor’s TraceXpert solution now offers real-time performance monitoring and process verification for all machine brands and machine generations from Fuji, Panasonic, Siemens and Universal. Following the availability of these latest generation interfaces, TraceXpert provides machine vendor neutrality for line-monitoring, exact traceability, real-time materials management and optimized assembly line performance.
According to Henning Maerkedahl, executive VP at the development centre for TraceXpert, traceability is now the key driver in over 60% of new project implementations, and is one of the main reasons for introducing floor-level MES systems into a manufacturing environment.
Maerkedahl also noted, “Many customers either have SMT lines from multiple vendors or a mix of different machine generations across lines. TraceXpert is the only monitoring, verification and traceability solution that delivers proven integration for all machine vendor brands and their generations. This allows electronics manufacturers to achieve faster set-up time and reduce costly reworks; deliver higher quality and manufacturing yield - with one factory-wide solution. The multi-function, real-time control interfaces developed by Valor for the four leading machine vendors in the market are in addition to Valor’s general line-monitoring solution that covers all types of machines from all machine vendors.”
MicroMark precision spray marking system produces neat, consistent spots and stripes from 5 to 30 mm wide without overspray or clogging. Designed for reliability and low maintenance, it reportedly reduces downtime on automated and semi automated production lines. Applications include color-coding to differentiate between similar components, indicating pass/fail status and showing whether a specific process has been performed. Uses a precision spray valve and Low Volume Low Pressure (LVLP) air to make uniform spots and stripes without mist or overspray. The system’s high transfer efficiency and quick cutoff improve part appearance and keep work areas clean. A short microburst of air after each shot keeps the nozzle from clogging and reduces maintenance. The system includes a microprocessor-based controller that simplifies system setup and operation. The controller can be easily interfaced with a PLC if desired. Ink or paint is supplied from a fluid tank with a constant-bleed air regulator that prevents fluctuations in fluid pressure.
BP Win 4.58 offers support for very small package (VSP) devices.
Offered exclusively on BP Win Automated Programming Systems, support for VSP devices currently includes MSOP8, TSOC6, and the smallest device, SOT23, with dimensions of 1.63 x 2.95 mm. Other VSP devices may be supported by entering a device request through BP Micro’s web page.
Modifications to the software allowed the use of the existing CyberOptics laser alignment vision system to accurately pick and place VSP devices without degradations to system throughput.
Today’s highly flexible, fast SMT placement machines are designed for just-in-time manufacturing; they can run multiple jobs at once, have 300 or more ‘smart’ feeders loaded at any time with the entire range of components from 0201s up to 55 x 55 mm at high speeds. As feeders index components for pick up and placement, repeatable accuracy is critical. CeTaQ announces the availability of a machine Capability Analysis (MCA) service that verifies feeder and shuttle motion repeatability.
Michael Sivigny, general manager, said, “One of the consequences of the move to lead-free assembly is less tolerance for even slight variations in placement accuracy. Components do not self-center as easily during reflow with lead-free solders. Consequently, placement accuracy is more important than ever. While there are other aspects of pick and place machine accuracy addressed by our services, this approach specifically addresses issues with feeders. Our feeder calibration service is critical to ensure repeatability of pick location, feeder indexing, component location, and sprocket repeatability. This is of particular importance for handling components such as tiny 0201 and 01005 chips.”
CeTaQ’s service involves the use of a ‘smart’ camera that works in conjunction with its mobile metrology system. Additionally, the service dovetails with a feeder maintenance program designed to ensure continued accuracy once feeder accuracy and repeatability issues have been corrected. The service and methodology can also be applied to die feeders and picked die from cutting.
TREK StandAlone Wash Module is a SMEMA compatible module that can interface with any existing conveyorized inline washer, regardless of manufacturer.
The module provides chemistry cleaning capability to an existing cleaner that may not support a chemical wash process, or may have poor chemical isolation. Ideal for manufacturers faced with conversion to Pb-free soldering processes where chemistry cleaning is required, but not supported by the current washer. Provides a heated recirculated spray wash in addition to chemical isolation, turning any
washer into a chemistry compatible cleaning system. Can be optioned with Liquid Lock technology, which reportedly reduces consumption of cleaning solution and power. By sealing the wash zone with an entry and exit laminar flow of fluid, ittraps the atomized spray in the wash chamber, essentially eliminating atomized spray mist exhaust.
Options include: presoak stage, filtration, automatic chemical injection, top belt and various levels of spray pump performance packages.
CAM350 Release 9.1 is the latest version of the software for the verification and optimization of PCBs. Streams Rule Check is now included at no additional charge in the mid-level CAM-350 configurations. The release also enhances the interfaces to major CAD systems including Mentor, Cadence and AutoCAD.
Streams Rule Check allows Design Rule checks, Design for Manufacturing checks and Netlist Comparison checks to be run simultaneously (or all in one “stream”), shortening the time it takes to analyze a design. It also allows a designer to save the stream based on technology, manufacturing capabilities or other requirements and recall it for use on future designs. The company will also deliver this functionality to customers under maintenance.
Other enhancements include: DFF analysis checks; interface updates; soldermask analysis enhancements; enhancements to minimum space and minimum width analyses; Latium updates; full screen mode; and defect fixes