Products
EP76M is a two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive. Has a one to one mix ratio by weight or volume. Has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. Thermal conductivity is 8-9 BTU/in/ft²/hr/°F. Readily develops a tensile shear strength of 2,000 psi when measured and cured at room temperature.
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
Said to feature superior durability, thermal shock and chemical resistance. Exhibits high bond strength to similar and dissimilar substrates. Coefficient of thermal expansion is 30 in/inx10^6/°C. Has a service operating temperature range of -60°F to +250°F. A higher temperature version, EP76MHT, can resist up to 400°F.
Contact pressure is only required for cure. The adhesive spreads evenly and smoothly, is 100% reactive and does not contain any diluents or solvents. Cures can be accelerated by the use of heat. Parts A and B are both colored gray. Available for use in glass jars and metal containers. Packaged in small and larger sizes (pint and quart units) for convenient application.
Master Bond Inc., www.masterbond.com
A new ProLINE-RoadRunner in-line programming solution is configured specifically for Siemens X-Series placement machines.
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Support is designed for the Siemens Flexible Feeder Interface ("FFI"). The FFI allows simple, flexible connection of a variety of different feeders to SIPLACE placement machines.
The in-line automated device programming solution programs flash memory and microcontroller devices and presents them to the pick-point of the SIPLACE machine for placement. By providing "Just in Time" programming capability, it results in inventory cost reductions and high quality standards.
Mounts directly onto the placement machine, with no additional floor space requirements.
Data I/O Corp., www.dataio.com
Concept FX is a multi-axis, x-ray inspection system featuring configuration flexibility with 80/90/130 kV x-ray source options, six axes of motion control, operator-friendly ergonomic design and a no-clamp sample tray for fast load and unload.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
The x-ray source and detector tilt offaxis in relation to the sample providing oblique object viewing in real-time. Has a small footprint of 46 x 52” yet is capable of inspecting PCBs up to 20 x 24”; 60% larger board handling than similar sized systems. The high-resolution high-magnification imaging train provides clear imaging of electrical connections. Applications include: failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation and rework verification.
Focalspot,.focalspot.com
Loctite 3549 is a high flow underfill formulated for use with advanced CSP and BGA packages. Is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing.
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
When fully cured, it reportedly delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices. Testing of the material to JEDEC drop test standards on 0.4 and 0.5 mm Pb-free devices has shown that it offers five times the reliability over non-underfilled Pb-free devices.
Compatible with modern lead-free solder materials and is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. Has long pot life (14 days at room temp. and up to 7 days at processing temp.) and simple, standard refrigeration temperature storage.
Henkel, electronics.henkel.com
Version 2.5 of the Environmental Material Aggregation and Reporting System (EMARS) completely supports the IPC-1752 Material Declarations standard for the RoHS directive.
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
"The IPC-1752 materials directive is a critical industry standard to help control the data formats and forms involved in complying with RoHS," said German Avila, product manager for environmental products. "Thoroughly understanding IPC-1752 is extremely important for OEMs and suppliers trying to streamline their processes and reduce the cost and burden of exchanging data related to RoHS. Our new version of EMARS has been designed to support IPC-1752 and ease the pain of gathering, organizing and storing the mass amounts of data involved in compliance."
EMARS is an off-the-shelf solution that can analyze and track compliance at the substance, material, part and product level as well as efficiently manage the data collection and reporting process. Version 2.5 fully supports the IPC-1752 Class 1 through Class 6 forms, providing the ability to generate IPC-1752 requests and reports, and validating and loading IPC-1752 reports.
Synapsis Technology, synapsistech.com
MicroLine 350Ci laser system offers stress-free depaneling of assembled PCBs. Uses a laser technology featuring higher cutting speeds then mechanical depaneling methods and requires no expensive artwork related tooling.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
The laser technique leaves no residual dust on the PCBs does not damage sensitive components. Cuts any contour while maintaining a higher precision than mechanical routing systems. Non-contact cutting with a laser means no mechanical stress for both the board and its components. Using a very small beam diameter allows components to be placed close to the edge of the board for optimum utilization of the panel.
The compact system can be integrated in an existing SMD production line, or used as a stand-alone work station. The laser works straight off of CAD data. The cutting speed is reportedly superior to most mechanical methods, especially when using thinner board materials. A dual fiducial camera system provides instant fiducial recognition over the entire working area.
LPKF Laser & Electronics, lpkfusa.com
Press Releases
- Stannol Welcomes James Wertin as Director of Technical Sales and Solutions – North America; Thomas Ruch Comments
- APE, Automated Production Equipment, Marks 56-year Milestone
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments
- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments