Best has installed a new C02 Laser for customized rework applications. The system gives further capabilities for precision marking, drilling, scoring and organic material cleaning of electronic PCB materials. Marking applications include inscribing PCB laminates, semiconductor devices, sires, glass diodes and coated metal surfaces with letters, numbers, symbols and bar codes. Can precisely define new pads and traces, and etch off solder mask patterns to a few mils. Organic materials such as flux residues and contamination can be ablated off the surface of the board. Polyimide can be cut into various shapes for customized wave solder masking applications.
Rework stencil deliveries can now be compressed to five standard and 24-48 hrs on an expedited basis. StencilQuik rework stencils stay-in-place polyimide stencils speed up the BGA placement and rework process.
The custom-built laser micromachining system has a range of capabilities. Its source is a 9.3-micron C02laser galvanometer based beam delivery system. Feature sizes down to 150 microns are possible. Materials including plastics, glass, wood, thin films and other organic materials can be processed using AUTOCAD and other file types as the templates.
Business Electronics Soldering Technologies (Best), solder.net
S300 diamond blade depaneling saw singulates assembled PCBs. Saw blade is a 2.95" diameter, .021" thick cutting blade.
Provides a stress-free method to singulate panels with sensitive surface-mount components close to the edge of the parting section, leaves a smooth edge finish with minimal stress imparted to the PCB. Can also be used to singulate PCBs without scorelines, or to singulate PCBs with overhanging components on the parting line. Since the cutting depth can be set to just cut through the PCB itself, any components which overhang the parting line will remain intact. The working area of the saws are covered by a plexiglass enclosures.
The automatic, microprocessor-controlled, multiple-blade saw can be used for singulating side handling strips from DC/DC converters or SIMM cards. An operator places up to five panels at one time into the input tray of the xy table. Pushing the start button activates the microprocessor-controlled process to bring the PCB past the saw blades to the offload position. Up to eight blades can be set on a mandrell to cut multiple panels in one pass.
The Commercial Products division of Branson Ultrasonics announces a new industrial ultrasonic cleaning unit to handle difficult industrial cleaning applications all in a self-contained unit. Available in 10- or 22-gallon capacity, has digital display to set temperature and time. Temperature and time can be set from 1-99 min.; temperature up 60°C. Comes with basket and cover.
Compact units incorporate 3/16, 15 gauge stainless steel construction, and a modern, solid-state ultrasonic generator available in 25 or 40KHz. industrial transducers.
Cobar Solder Products’ has sold over 200 units of its COBOX retrofittable spray fluxer. Lance Larrabee, general manager, announced in a press release that “the COBOX 'Plug'n Spray' spray fluxer is a simple, drop-in replacement for foam, wave and first-generation spray-fluxers. It works with virtually any type of no-clean, alcohol or water-based, or VOC-free flux. Because it is so flexible, easy to clean and simple to install and operate, it has become especially popular, with over two hundred units sold since its introduction.” The fluxer is easy to disassemble and service, manufactured of stainless steel and titanium parts and features a magnetically-driven nozzle assembly. Its simple design, computer-controlled movement and short distance of 50 mm (2”) to the board surface, ensures uniform wetting and through-hole penetration/top side wicking without excess deposition or flux waste. Reportedly saves more than 60% of flux over comparable foam-type fluxers. Designed to work with the typical range for surface tension and capillary viscosity of water-based (VOC-free) fluxes, and eliminates over and under spraying problems. Features an air-driven, high precision nozzle with an adjustable cone. Is a field-retrofittable system, compatible with many soldering systems, and includes a fluxing unit, control cabinet and exhaust hood.
QTEK Stencil Clean removes solder paste, Pb-free pastes and other stencil print materials. Suitable for use in both vacuum and non-vacuum under-stencil cleaning mechanisms.
Formulated specifically for the removal of stencil contaminants, and is effective on solder paste residue.
The aliphatic hydrocarbon chemistry is non-flammable and non-corrosive, safe for use with stencils, frames, boards and the printer itself. Contains no ozone-depleting substances, is RoHS and WEEE compliant.
Penetrates solder paste and lifts it from the screen, removing contaminants from small apertures without scouring the stencil surface.
Has a high evaporation rate to leave surfaces clean and dry, and is said to provide superior solvency, as well as good wetting and dispersing characteristics.
Valor has announced full support and integration with all Siplace Pro Siemens placement systems.
Siemens users can benefit from Trilogy 5000 functionality, including fast, accurate CAD/BOM load, stencil optimization, rotation neutralization, machine/line optimization and balancing, Virtual Sticky Tape (VST) to reduce NPI debug time and advanced grouping functions (for low-/mid-volume, high-mix environments. Through Siplace Pro, the steps to final program generation are fewer and faster.
Julian Coates, Valor’s executive VP for marketing and product management, said, “The seamless integration between Valor’s Trilogy 5000 advanced assembly line engineering solution and the powerful Siplace Pro open interface delivers tremendous cost savings to Siemens customers by generating the fastest route from data load to optimized machine program generation. Siemens customers will enjoy reduced NPI cycle time, increased shop floor productivity, and quicker machine programming and set-up times.”