Products
PCB049 board and kit can evaluate mixed-technology Pb-free assembly. Tests a variety of JEDEC and EIAJ components.
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.
Indium Corp., indium.com
Evaluates solder paste wetting and spread, solder paste slump performance, solder preform pin-in-paste performance and wave flux hole fill performance. Helps provide pick-and-place equipment and placement accuracy, reflow process capabilities, effectiveness of cleaning processes, surface insulation resistance (SIR), surface finish interaction factors and lead-free underfill performance.
Four different optional finishes available for 8 x 10" boards: OSP, ImSn, ImAg and ENIG.
Each test kit includes a copy of CircuitCAM and CheckPoint software, ready-to-run CircuitCAM project files (CPFs), assembly documentation samples and templates, installation instructions and user manual.
Practical Components Inc., practicalcomponents.com
Indium Corp., indium.com
A-TEK is the exclusive distributor of the CSR 1200 Stand-Alone Depaneling machine manufactured by Getech Pte Ltd. The depaneler addresses the stringent electrical and safety requirements for CE certification.
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
A-Tek, atekllc.com
Stand-alone unit features two independent processing tables for continuous operation and system optimization. Can handle panel sizes up to 13.8 x 13.8” (350 x 350 mm). Larger panels up to 20.8 x 20.8” (528 x 528 mm) can be prcessed on the CSR1280.
A-Tek, atekllc.com
Booth 263
A full range of precious metal clad products for fabricating micro-switches, connectors and components used in high-reliability medical, military and consumer products is available from Anomet.
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
They are metallurgically bonded to a core material to meet specific high-reliability requirements for contact and corrosion resistance, biocompatibility or to simply reduce material cost.
Fabricated by hot and cold drawing, have a smooth, consistent surface finish. The cladding can be produced thinner than filled and thicker than plated wire or ribbon, and the products are reportedly more ductile and formable.
Functionally equivalent to solid products, available as wire and rod in sizes from 0.002 to 0.125” O.D. and as ribbon up to 1” W, with 2% or more cladding thickness, depending upon desired properties. Precious metals can include platinum, palladium, gold or silver and related alloys on cores such as stainless steel, copper, Kovar, niobium, nickel-iron, molybdenum, tantalum and titanium.
Anomet Products, www.anometproducts.com
Micro HVR addresses the high-volume rework market where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder. All steps are automated.
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips.
A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated. An additional fast linear axis accomodates large substrates.
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
Can be configured with solder paste dispense for 0201 devices. Can perform for extended periods of time at elevated temperatures.
Finetech, finetechusa.com
Booth 1481
IBIS, the Interferometric Bump Inspection System, offers production volume solder bump inspection on chip carriers. It inspects and reports on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that carriers are within specification for chip attachment.
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
Uses massively parallel digital signal processing technology coupled with true white light interferometry to reportedly offer 20 to 30X improvement over existing interferometry systems. This technology will be transportable to wafer and chip solder bump measurement in the future.
Lloyd Doyle Ltd., lloyd-doyle.com
Booth 2086
CDS6250 automatic system can dispense up to 150 drops/sec. (540,000 drops/hr.). Nanojet dispensing valve produces dots down to 2 nl. Three-axis system is programmable and can dispense adhesives with and without filler, pastes, oils, lubricants, colors, lacquer, flux, solder resist, conformal coating and more. Almost all media with a viscosity between 50 and 200,000 mPas can be dispensed.
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Unlike other needle-based dispensing systems, the gap between the jet valve and the substrate can vary. As a result, the dispenser can travel at a fixed height while the substrate’s height changes.
Very thin ropes can be dispensed by jetting one drop next to the other, or by dispensing into a thin needle. The valve can dispense media under pressure (up to 100 bar) at high temperatures up to 100°C.
RO300FC full convection reflow oven is said to allow fast, homogenous heating. The integrated convection technology has a vertical hot air stream that evenly heats the complete PCB. Both standard and Pb-free pastes can be used.
Features RO-CONTROL software for increased process simulation and control. The software offers many of the same features as thermal profilers.
The high air volume of guarantees equal heating rates in all the components and the substrate, which leads to a minimum Delta-T. Options for the 80" long oven include: chain conveyor for double-sided boards, computer control and an N2 option.
The temperature of the pre-heat and the peak zones along with the conveyor speed are programmable to obtain the required soldering profile. Measuring the zone temperatures directly in the convection airflow guarantees reproducible results with Delta-T values at ±2°C. Different profiles for solder and glue are integrated in the microprocessor control.
Can be used for prototypes, small batches and production runs up to 700 boards in an eight-hour shift.
Essemtec, essemtec.com
Apex booth 2433
Press Releases
- Stannol Welcomes James Wertin as Director of Technical Sales and Solutions – North America; Thomas Ruch Comments
- APE, Automated Production Equipment, Marks 56-year Milestone
- Kitron Signs Multi-Year Agreement for Advanced Sensor Manufacturing in Europe; Kristoffer Asklöv Comments
- Scanfil Boosts Investment in Electronics Manufacturing in the US; Christophe Sut Comments