Auto-Focus software automatically selects the best reflow oven recipe for new products without running a profile by evaluating a database of previously setup products and extrapolating a new oven recipe based on product and oven characteristics. Instead of relying on a technician’s guess, the user enters the product’s length, width and weight. After a dozen products that cover the required range have been set up properly, the accuracy and quality of the oven recipes developed is so high that most users may no longer find it necessary to run a verification profile.
 
Valuable to high-mix facilities, high-value assemblers and facilities that want to minimize setup times. Reduces downtime for oven setup.
 
KIC, kicthermal.com
Booth 363

The manual version of Fineplacer Lambda is used for sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. Placement accuracy is ± 0.5 µm for the A6 and A6V models, or better than ± 0.5 µm for the A7V l. Can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system. 
 
Features an FA7 heating plate with a 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per sec.; thermal conductivity; low thermal expansion; and optional heated inert gas integration.
 
The automated configuration is equipped with the automatic module package, consisting of the Automatic Bonding Force Module, Motorized Microscope Movement, and PC Control and Bonding WIN Flip Chip Software. Provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
 
Advantages of the automated configuration include hands-off die placement; improved process repeatability ¾ pilot production worthy; places die with dimensions that exceed the optical field of view; provides up to 10 programmable microscope positions; upgradeable with integrated microscope; and features a measurement function as well as a placement mask generator.
 
Finetech Inc., finetechusa.com
Booth 1481

MS2 molten solder surfactant eliminates dross in wave soldering. Available for both leaded and lead-free processes, does not mix with the metal but forms a thin floating layer that covers the entire solder surface except the wave, which it does not disturb. Prevents dross from forming on the surface and immediately converts any dross generated by the wave back into usable metal. Said to reduce solder usage by as much as 40 to 75% and result in other dross-related cost savings.
 
P. Kay Metal, pkaymetal.com
Apex booth 2635