Chad Industries Inc. announced a 100% under board lead inspection option for its line of automated and semi-automated circuit board assembly systems.
The option allows for leads to be inspected during the insertion process and has been adapted to the company’s odd form assembly systems.
A camera has been mounted to a programmable X-Y stage below the board and inspects the leads once they have been inserted. The programmable stage allows the camera to move with the robot to each new location on the board as well as to multiple locations on the board for each insertion required for large parts.
"Driven by our customer demands to trap defects of Odd Form thru-hole components during the board assembly and not at a distant test station, Chad Industries developed a new vision tool and process to meet these needs," said Scott Klimczak, president of Chad Industries. "With this new design we are inspecting the component leads where it matters, after the part has been inserted."
Cobar 396-FTA VOC-free flux for Pb-free wave soldering applications has less than 2% solids, yielding clean post solder surfaces even on difficult solder resists. Said to deliver excellent soldering performance on most types of circuit boards. Eliminates solder balls as well as wetting and wicking issues, even on OSP assemblies.
Self-cleaning Wash Tank has no horizontal floor surfaces,
preventing solder paste from building up on the tank’s floor. Is
equipped with multiple funnels mounted on the tank floor. The end of
the funnels feeds into a small diameter metal tube. Water is pumped
through the tube at 15 ft/ sec., sweeping solder paste into a filter
housing.
Neither an operator nor a maintenance technician is
required to scrape solder paste from the bottom of a wash tank.
Prevents solder paste from entering a waste stream, eliminates direct
contact between an operator and the paste.
Available in SonicOne G3 automatic stencil cleaning systems and will be introduced on semi-automatic models throughout 2006. Aqueous Technologies Corp., aqueoustech.com
2-D vision inspection option on the 4710 detects lead defects. Is compatible with a high-speed camera, verifies all leads are within some tolerance before the chips are shipped to the customer. Detects edge pitch, which identifies skewed leads at 0.02 mm and trend edge position, which identifies lifted leads at 0.04 mm.
Used on automated programming systems, the vision system mounts onto a tape loader and integrates with BP Win and Jobmaster.
The 4710 is designed for high density devices and longer programming times, for programming Flash, as well as Microcontrollers, FPGAs, PLDs and other device types. Can program devices with densities up to 4 Gbits. Incorporates USB 2.0 standard bus for communications.
FLX2010-LCV flexible pick-and-place system is designed for high-mix/low-volume production. The company claims to feature the largest board size and feeder capacity in the industry while also taking up one of the smallest footprints.
FLX series offers changeover without downtime, via intelligent feeders, large feeder capacity and offline programming and job planning. Start at 5,000 CPH with 150 feeders inline and can expand to 15,000 CPH with over 470 feeders.
MIS software offers production planning, inventory control, quality control through bar code verification and traceability of lots. Offline setup gives the ability to produce without downtime. Requires only 110 V of power.
Can accept nearly any kind of feeding system, even an independent unit such as a vibratory bowl feeder for bulk components with no electrical connection to the machine. Equipped with laser and vision alignment systems.
PRO 1S and PRO 1Sm are single nozzle, selective soldering stations that solder components individually or in groups. The nozzle is surrounded by a nitrogen blanket.
The 30-lb. solder pot is Pb-free compliant and comes with a solder replenishment system and automatic spray fluxer system. PCBs or pallets enter the work cell on an in-line conveyor system. Programs may be set up through a data management system or overhead laser pointer. Once the x/y parameters are established, the z motion can maneuver around bottom-side components.