Boast sample rates up to 10 GS/s (interleaved) on the 600 MHz unit, and standard 2 Mpt/Ch memory (with optional memory up to 24 Mpt/Ch interleaved). These sample rates (at least 10X oversampling) result in better signal fidelity for fast edges or high frequency signals, and ensure accurate timing measurements when using all channels.
 
Mixed-signal option (MS-32) allows engineers to add 32 digital channels, each with 1 Mpt/Ch (32 Mpts total), to a four-channel WaveRunner Xi, which enhances mixed signal and embedded controller debug capability. 
 
Available in 400 and 600 MHz bandwidths. 400 MHz unit is available in four channels only; 600 MHz is available in two- and four-channel units. All models sample at 5 GS/s on all channels simultaneously, and the 600 MHz model interleaves to 10 GS/s. All models provide 2 Mpts/Ch of memory (4 Mpts/Ch interleaved), which equates to 400 ms capture time (at full sample rate). Up to 12 Mpts/Ch (24 Mpts/Ch interleaved) of memory is available.
 
Feature powerful analysis capability, fast viewing mode, local language UI, touch-screen inteface and built-in pointer, enhanced trigger capability and one PP008 probe per channel.
 
LeCroy Corp., lecroy.com

Following the launch of Multicore LF318, the Pb-free solder paste has been qualified by leading OEMs, such as Siemens, and CEMs. The halide-free, no-clean, pin-testable paste is said to achieve a consistently high degree of coalescence upon reflow and with high humidity resistance. Reportedly reduces common operational defects such as solder-balling, for reliable, repeatable performance.
 
The product qualification process at Siemens is comprehensive – as were the demands placed upon Multicore LF318 at the company’s Corporate Technology center in Berlin. The paste underwent a series of static tests to measure performance in relation to variables such as corrosion, solderballing and wetting. The product was also successfully exposed to a range of dynamic tests to ascertain the behavior of the paste during printing, evaluating print and slump performance. 
 
Henkel, electronics.henkel.com

M-Series range of mid- to high-volume SMD placers now includes the MG-2 chipshooter.  It will be launched at booth 2117 during Apex.

Said to provide high-speed, high-mix, high-accuracy production for applications such as automotive, memory boards and PC peripherals. Can be used alone to deliver chipshooting speeds up to 40k cph.  Or it can be used with the MG-1 and/or MG-8 multifunctional machines to boost line performance in applications requiring additional chipshooting capacity.

Features a high-precision dual-gantry system carrying four beams, each with six heads. Places components from 01005 to CSP, BGA, PLCC and QFP with a maximum size of 14 sq. mm, with placing accuracy of 50 micron at 3 sigma for chips.

Benefits include a small footprint and functional flexibility. Uses the same user interface, feeders, feeder trolleys and spare parts as the MG-1 and MG-8 and GEM X^II range.

Accepts 96 smart feeders and accommodates tape, stick and bulk feeders. Smart feeders are equipped with the latest RFID technology to enable fast, easy machine set-up and provide a real-time component inventory check. 

Assembléon, assembleon.com

PRO 1Tc selective soldering robot includes two iron tip soldering heads on a single soldering head platform. Is an inline handling, top-side selective soldering station designed to selective solder two points at the same time. When products can be aligned within a pallet in a symmetrical manner, it can solder two joints simultaneously, thus reducing cycle time.