Products
Assembléon will introduces new capabilities at Productronica, from enhanced machine multifunctionality to full-functioned remote operation of multiple production lines making ‘lights-out’ manufacturing in the mid-volume sector a reality.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
New capabilities on the AX machine expand the component range from fine-pitch down to 01005s, with no decrease in speed. The machine features output scalability from 45 to 150k cph in 5k cph increments on the same footprint. Features supporting processing of a wide range of components include new digital vision systems, feeder options and z-force control. High feeder count allows a fixed set-up for production in many manufacturing environments; off-line set-up and verification using quick-change trolleys can also enable fast changeovers. Has on-line program editing and robot-level modularity.
AQ-2 ultra fine-pitch and oddform placer has an optimal output of 5.3k cph. Aligns with the AX for demanding component capabilities at any output. It places flip chips at 3.1 k cph, and large connectors or oddform component sat 3.9k cph.
With the same look and feel as the MG-1 (introduced at Apex), the MG-8 is equipped with a high-precision placement beam carrying three FNC heads, each carrying six nozzles, to handle components from 01005 to 55 x 100mm, with max. component height 25.5 mm. Precision z-force control delivers snap-in force for connectors and the delicate handling required to avoid cracking 01005s. Achieves accuracy ratings of 50 micron for chips and 30 micron for QFPs, and placement speed for ICs and QFPs of 7.5k cph. Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers. Coplanarity system checks three components simultaneously, a e side viewing camera option verifies 01005 or 0201 presence at the nozzle. Has a nozzle cleaning system.
AMS 2.0 Advanced Manufacturing Suite for mid-volume manufacturers is designed to integrate the placement function into the production environment. It is focused on maximizing total production efficiency and providing connectivity to other machines and software used in the factory. Controls one or many production lines containing standalone or multiple mid-volume machines. Provides a comprehensive set of hardware and software tools. Manufacturers can choose their entry level and build as their requirements develop.
Assembléon, assembleon.com
ArctiCore module technology, designed for thermal, mechanical and electrical performance, enables OEMs to cost-effectively increase available memory capacity to meet expanding application performance requirements.
Use a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core to increase the available area for mounting devices while enhancing thermal management, reliability and thinness.
Aluminum core acts as a heat sink and mechanical stiffener to provide rigid foundation support and increase the contact area for dissipating heat away from the devices. Heat reductions range from 4 to 25°C, said to minimize BGA ball stress cracking and reduce wear and tear through the use of a tapered connector edge that lessens system insertion stress.
Complements all types of standard memory devices, from DDR1 and DDR2 to dual-die, stacked or planar packages. Also has applications in mixed environments that use various chip technologies, such as DSPs, controllers and ASIC processors.
Staktek, staktek.com
IFS-X (Intelligent Feeder System - next generation) uses Cogiscan’s RFID Smart Feeder technology to provide feeder set-up validation.
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
The IFS-X system eliminates human errors while reducing machine set-up and changeover time. It provides real-time inventory of components, feeders and trolleys, both on and off the placement machine. It can also gather detailed component traceability reports.
Can be retrofitted to existing machines, trolleys and feeders.
Juki Automation Systems, jas-smt.com
Cogiscan, cogiscan.com
Newport Beach, CA – Router Solutions Inc. (RSI) has released an upgrade module for its data preparation software, CAMCAD. The fixture reuse analysis module allows CAMCAD or Agilent fixture files to be checked against new revisions of boards to determine if the existing fixture can be reused or if it must be rebuilt. Anlysis time is reportedly reduced to minutes, instead of hours or days.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Once CAMCAD has read the fixture files each existing probe location is checked against the new board to determine if the location is on the same net and still accessible. If this is the case it will be reported as retained. If the net name has been changed but the existing location is still valid then it will be reported as changed. If the net name is the same but the existing location is no longer accessible and an alternate accessible location on the net is found it will be reported as moved. If no accessible locations are found on an existing net it will be reported as unplaced. If the net no longer is found it will be reported as removed.
Router Solutions Inc., rsi-inc.com
ALPHA CoolCap was developed to cool components and semiconductor packages during high-temperature lead-free rework and reflow processes.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Provides protection for adjacent components during rework and protection for targeted components during reflow.
“The higher temperatures required in lead-free electronics assembly rework and reflow create challenges to maintaining processing goals,” said Tom Hunsinger, product manager with Cookson Electronics. “ALPHA CoolCaps and CoolShields provide protection for components and semiconductor packages from these high rework and reflow temperatures that can very often cause defects such as opens/shorts, component warpage and popcorning.”
Offered in standard BGA and QFP Rework Kits. CoolCaps fit over most common BGA and QFP packages; CoolShields fit beside connectors and rows of small components. No adhesive is required; no residue is left on boards or components.
Cookson Electronics Assembly Materials, alphametals.com.
Ionograph SMD IV ionic contamination test system uses an ultra-pure alcohol/water extraction media to test components quickly and without destruction.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Equipped with Bluetooth to allows users to transmit data from the instrument wirelessly to the SCS PowerView software for monitoring and analysis.
“The wireless Bluetooth communication feature in the Ionograph SMD IV will provide customers with increased flexibility and range in their testing,” said Bill Boyd, SCS equipment market manager.
The system is Intertek ETL SEMKO (ETL) certified, meets National Fire Protection Association (NFPA) standards and is nitrogen-inerted for increased safety.
Specialty Coating Systems, scscoatings.com
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