Circuits Assembly Online Magazine - Current

Products

PowerMod connectors are RoHS compliant for Pb-free reflow soldering and are offered in three to 30 circuits with a maximum current of 30 amps.

Manufactured from high-temperature plastic Polyphenylene Sulfide (PPS). Has 285°C melt temperature, ideal for lead-free processes which may have a peak re-flow temperature of 260°C.

Available in straight PCB, right angle PCB, panel or cable mountings.

Anderson Power Products, www.andersonpower.com

BEST has introduced PCB circuit trace repair kits and materials to repair circuit traces of PCBs.

Kit includes “how to” slides, a large selection of different trace widths and thicknesses and the tools required to make the repairs. Offer a variety of tools to reduce the amount of time spent trimming circuit frames.

Business Electronics Soldering Technologies (BEST), www.solder.net

RoHStat procducts, including containers, mats, cords, wrist straps and heel grounders, are recommended for use in lead-free assembly/production areas. Contain no lead, carbon, cadmium, chromium, bromine, mercury or vinyl plasticizers, meets RoHS and Class Zero U.S. and European standards.

Static Solutions, staticsolutions.com

DEK has reportedly applied its mass imaging techniques to improve the uniformity of Thermal Interface Material (TIM) deposited between a silicon die and its package lid during semiconductor packaging. By using ProFlow DirEKt Imaging to mass image the TIM, semiconductor manufacturers can ensure uniform material thickness across the entire die surface. Advantages include better thermal conductivity between the die and the lid, which improves reliability and delivers greater lid coplanarity.

"Mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM," says Richard Heimsch, president. "Additionally, DEK's process makes it easier to verify uniform spreading and absence of voids before the package lid is assembled."

During the TIM process, die assembled onto substrates enter a flexible printing system that combines three processes - passive attach, TIM and lid sealing - into a single platform. The single printing system allows customers to re-deploy equipment between processes to meet changing manufacturing requirements and allows single-platform operator training.

Compared to traditional, serial dispensing, the parallel mass imaging process is said to increase true throughput and deliver greater control over the volume of material deposited. This technique also allows the shape of the TIM deposit to be more accurately controlled. Because the process does not require the TIM to be spread via lid placement, defects such as material voids or incomplete spreading are reportedly eliminated.

DEK, dek.com

Cobar Europe BV has implemented state-of-the-art QC testing and laboratory routines designed to yield more precise data for customers.

Eli Westerlaken, president and CEO, said, "As part of our continuous drive towards quality improvements and batch-to-batch reduction of variation of QC data, we have reviewed some of our lab routines and have improved them, to keep up with current methodologies being adopted across the industry. The result, we're pleased to say, has been improved reproducibility of testing routines such as acid number titration."

Westerlaken added that the titration routine, for example, will marginally change the measuring range of some of the company's products, but does not signal or reflect any change in raw material properties, product formulas or manufacturing methods.

"Our Cobar products remain unchanged; our SPC data will be more precise, however. Near-term, in some cases, users will see a small and temporary change in parameters such as Six Sigma numbers and Cpk values. In the long run, these improved routines will mean more verifiable data..."

Cobar, cobar.com

Austin American Technology has combined two cleaning systems - the X-Series multi-solvent system and the high-precision Mega series - into a single high-capacity, single-chamber closed-loop regenerative system, the X-40F. Developed for a Hi-rel military waterless application, cleans product up to 35 lbs. and 32 x 18". Has high-precision cleaning chemistry and technology provided by Mega, with cleaning chamber capacity and material handling capabilities of the X-series.

Single processing chamber minimizes footprint, specialized technologies enable wash, rinse and dry cycle automation in one chamber with minimized dragout or cross-contamination. Reportedly offers greater process efficiency and reduced costs though a proprietary ion bed filtration/regeneration system, allowing the rinse solvent to be recycled and cleaned ionically after each cycle.

Typically used for stencil and misprint cleaning. Does not require transferring between wash, rinse and dry; offers fully automated operation for a range of chemistries. Has a large processing chamber, closed-loop capability, plus counter-rotating spray wand and the ability to handle large product dimensions and weight.

Austin American Technology, www.aat-corp.com