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General Purpose Powder heavy-duty ultrasonic cleaning powder is said to be fast-acting and long lasting. Two pounds of concentrated powder make up to 75 gallons of cleaning solution. Each scoop generates 1 gallon of general purpose cleaning solution (scoop provided). 
 
Easy to handle and store, mild to operator hands and biodegradable -- no acid, caustic or fuming problems. Odorless, ammonia-free and non-flammable.  
 
Applications include removal general oils, fingerprints, dust, packaging particulates, light oils and greases from components and products. Safe on all metals including aluminum and magnesium (when rinsed promptly), plastic and rubber components, and glass.
 
Branson Ultrasonics Corp., www.bransonic.com

 

PG0255NL series of low profile SMT flat coil inductors feature saturation current rating up to 30 Amps (A) and heating current rating up to 38A. Designed for the multiphase voltage regulator modules (VRM) supporting the increasing current needs of Vcore power in PC notebooks and other DC/DC applications.  

PG0255.201NL, PG0255.401NL, PG0255.601NL and PG0255.222NL have inductance values from 0.2 to 2.2 microhenries. VRM designers can tailor their designs for faster transient response with the lower inductance values or lower switching losses using lower switching frequencies with the higher inductance values. 

Low direct current resistance (DCR) of 0.55 to 7.0 milliohms and low alternating current loss result in lower copper losses. Inductor windings are made of rectangular copper (flat wire) wound helically, similar to a spring. Has a larger surface area than round wire for reduced skin effect loss. Also provides a self-terminating lead.

RoHS-compliant, standard footprint is 11.5 x 10.3 mm with a low profile of 4.0 mm maximum and operating temperature from -40 to +125°C.

Pulse, a Technitrol Co., www.pulseeng.com

IMD 2297 Quadrature 3dB hybrid coupler is ideal for RF/Microwave and telecom applications. Compact, low profile and surface-mountable, the thick film product on an aluminum nitride substrate operates at 6 GHz with a bandwidth of 10%. Its typical VSWR in matched 50-Ohm alumina system is 1.25:1 or better, with an input isolation of 18 dB or better. Insertion Loss is .6 dB; phase split +/- 3 degrees; and amplitude split +/-.5 dB.

 

Part dimensions are .322 x .322 in., with a thickness of .025. Other sizes and thicknesses available. Terminal spacing is .205". Input Power is up to 20W depending on base plate temperature.

 

IMS, ims-resistors.com

 

B1500A is a Windows-based semiconductor device analyzer that integrates capacitance versus voltage (CV) and current versus voltage (IV) measurements. Provides a complete, self-contained and expandable solution for parametric characterization and analysis capable of handling 65 nm lithographies and beyond. Has a 10-slot configuration and supports EasyEXPERT software.  
 
Supports three SMU types:
o High-resolution SMU (HRSMU)
o Medium-power SMU (MPSMU)
o High-power SMU (HPSMU)
 
A multi-frequency capacitance measurement unit is also available, and a 4.2 amp ground unit is included.
 
Besides integrating CV measurement into the device analyzer mainframe, the MFCMU can measure capacitance at up to 5 MHz and provide ± 25 V of DC bias. The combination of the MFCMU and SMUs within the same instrument enables these measurement resources to be more tightly coupled. When joined using the SMU CMU Unify Unit, supports capacitance measurement with ± 100 V of DC bias.
 
SCUU connects the two SMUs and the MFCMU together and can switch between the measurement resources without using a separate external switching matrix. Software handles all of the IV-CV switching, compensation and return path issues.
 
Can be used for a range of characterization needs for semiconductor devices and emerging materials, including nanotechnology devices.
 
Agilent Technologies Inc., www.agilent.com

 

Visual 3-D Engineering is a computer-based visualization method allows customers to see engineered solutions in full 3-D, including their product or tool in the cart.

The manufacturing solution allows customers to work with Bliss' engineers to share ideas instead of having to build expensive prototypes. Virtually all interference problems faced in new product development are eliminated.

"It is like looking at a photograph of a product that has not even been built yet," said Ken L. Bliss, president and CEO.

Bliss Industries, blissindustries.com

 

HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.

Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.

Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.

Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.

Mydata Automation

 

 

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