Products
Caster Cleaner said to improve performance and extend life of conductive wheels to reduce ESD risks caused by ungrounded carts. Enhances wheel performance by continually cleaning the wheel, reducing the build-up of dirt, wax and residue that may insulate the wheel from the floor. Extends the life of floor finishes, leaves less marking on the floor and keeps floors cleaner.
Provides an additional electrical path from the wheel to the stem of the caster, bypassing potentially insulative grease in caster bearings and wheel bushings that may cause an unreliable path to ground.
Install without tools in about 5 seconds to fully assembled and loaded carts; provide visual indication that the carts are grounded.
Optima spray fluxing system is said to improve flux deposition and through-hole penetration while eliminating post wave flux residue.
Features Ultra-Spray, which produces a precise, rectangular spray pattern; and Smart-Motion, for exact spray head speed and position control.
All set-up parameters are controlled electronically and password protected. Operator interface can store hundreds of recipes. Dual-flux tank option for rapid change between flux types. Can be retrofitted to any wave solder machine.
Ultrasonic Systems Inc., www.ultraspray.com
Anza RFID now offers ultra thin (085µm), small footprint (2 x 5 mm) RFID modules with optimized reliability. The planarized semiconductor package, MicroSite, offers product integrity for RFID devices in all frequencies. Custom design of RFID transponders for demanding environmental, medical and military applications is available in quantities of 100 to 100 million pieces.
The enhanced ultra sonic die bonding technology increases integration of fused metallurgy at the bond site. Several advanced methods for attaching the chip module to the antenna have created added flexibility for employing a MicroSite module to etched, printed or discreet wire antennae.
Intraglobal.net distributes RFID products through Anza RFID, a division of Special Equipment Engineering Inc.; www.anzatech.com.
The 120° "Y" workstation increases space efficiency while providing a more open and comfortable work area. This workstation cluster is designed for three or more people who may share a common central area, enabling communication and ready access to common equipment, supplies or reference materials.
Personal space is created for each user while allowing for more application possibilities and easy adaptation to changing tasks and work styles. Modular privacy panels vary the degree of privacy desired.
Based on a double-sided columnar system, these workstations can be sized to suit the application through the selection of module sizes ranging from 36 to 72" and column heights of up to 84".
Stacked dies enable highly integrated systems in a single package. Modern microelectronics demand more functionality at chip level, smaller models, shorter time-to-market, greater reliability of design and lower cost. SOCs (system on chip) have made progress, but will soon come up against economic limits - particularly with embedded technologies for improved performance (such as when at least two different process technologies are to be integrated on the chip). This technology mix could be implemented through different chips in the most suitable technology for the respective functions, if not for the challenges connecting multi-pin chips at board or substrate level leads and complicated routing and interference. A possible solution: stacked dies made of ultra-thin silicon.
The thin, flexible silicon chips used are very demanding, highly fragile and also often warped. Suitable equipment for processing these thin dies must take account of these features.
The 2200 apm+ multi-chip die bonder features high-precision linear motors with dynamic servo-control and automatic compensation for temperature drift. High-res camera systems allow positioning precision at the xy level of ± 7 µm at 3 s and a maximum tilt of ± 0.15 ° at 3 s. Z-axis can be individually controlled for bonding functions and adhesive application. For assembly on warped substrates, an ultra-light tool's low bond force works in the 0 - 6 g ± 50 mg range.
The wafer transport system processes up to 25 different wafers with five ejection tools. Features material-protecting synchronous sequence of motions to pick the chip up from the carrier material with the help of a vacuum. Can handle small chips with edge length starting at 170 µm and, for flip-chip assembly, 500-µm chips. Automatic tool changer holds up to six different tools, including a bond head that can be heated to 350°C.
Minneapolis, MN - Arranged by Dr. Ronald Lasky, Indium Corp of America/Dartmouth College, the SMTA Cost Estimating Guidelines with ProfitPro Software are intended to model real-time cost estimating (RTCE) in the electronics industry.
While RTCE is simple in concept, manual calculations are tedious and cumbersome since they include production variables such as cycle time, hours/shift, shifts/day, days/week, set up time and unscheduled/scheduled downtime. Yield loss and cost of repair must also be considered, as well as inventory turns and interest rates.
Using these variables, ProfitPro, an Excel-based software application, can model RTCE for high-volume low-mix to low-volume high-mix lines. The software also has default values of cost metrics if the user does not know them, and can calculate:
- The amount of profit gained if setup time is reduced.
- The amount of profit gained if cycle time is decreased.
- The amount of profit gained if new equipment or materials increases productivity.
Visit the SMTA Bookstore on smta.org for more information.
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