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ALPHA CoolCap thermal protection device cools components and semiconductor packages during high-temperature lead-free reflow and rework processes.
 
Said to provide cost-effective protection without a substantial investment in process changes and redesign, while maintaining the high yield and throughput required by electronic assemblers. The reusable custom-fitted caps keep semiconductor packages below 245°C or 260°C and minimize temperature variation within packages from over 10°C down to 2-5°C, while minimizing warpage, popcorning and delamination.
 
Can be used in no-clean, water-soluble or RMA processes as a temporary heat sink that can be placed on components either by hand or with existing pick-and-place equipment.  No adhesive is required and no residue is left on boards or components. Can be designed to cool the package body, allowing reflow underneath, or to "overcool" - preventing reflow in cases such as adjacent packages during rework. 
 
Cookson Electronics Assembly Materials, alphametals.com

Recent test results have validated the superior moisture resistance of protective coating PC10882, a mineral-filled epoxy dielectric material designed to be screen-printed onto a range of substrates as a protective coating for trimmed resistors and general circuit protection. The cured film is tough and offers protection against thermal shock, solvent attack, moisture, abrasion, oxidation and plating processes.

Although a proven solution in the marketplace for almost a decade, recent tests conducted over the last year surpass expectations in moisture and temperature resistance.

Moisture testing involved saturation in a pressure cooker for one hour before dipping into dip in 260°C solder pot and then performing a tape adhesion test.  
 
LORD Corporation, www.lord.com

ALPHA EF-6000 rosin-free wave solder flux is designed for lead-free and tin-lead processes. The alcohol-based, no-clean flux reportedly provides superior solderability and high yields as processes are transitioned from tin-lead to lead-free.
 
Offers in-circuit pintestability and electrical reliability in tin-lead and lead-free wave soldering applications.  IPC rated ROL0, exceeds the Bellcore and JIS standards for electromigration and surface insulation resistance. 
 
Cookson Electronics Assembly Materials, alphametals.com
The line of 5145P3 Series PCB mount mini-din connectors will now be available with a full metal shield and EMI/RFI gaskets on the mounting face for conducted and radiated noise suppression. Available in 3 through 8 pin configurations, the gasket option for is the same one used on the RJ-45 connector line. The new connectors also have high temperature material in the housing and can be ordered in a RoHS-compliant configuration. 
 
The conductive gasket provides EMI/RFI noise attenuation and is interchangeable with shielded and unshielded versions (same footprint and panel cutout). The connectors are said to be easy to mount.
 
They provide easily identified pin configurations for applications that require multiple mini-din connectors on a single PC board or device. 
 
Regal Electronics Inc., regalusa.com

EP77M-F is a two-component, silver filled, electrically conductive epoxy adhesive for high-performance bonding. The compound has a low volume resistivity of 10-3 ohm-cm. It will set up in 5-10 min. at room temperature, even when applied in very small amounts. Full cure usually takes 8-12 hrs at room temperature. Electrical conductivity is first detectable within 30-60 min.

 

Has high bond strength to similar and dissimilar substrates. Adheres to metals, glass, ceramics, vulcanized rubbers and most plastics. Bonds are resistant to thermal cycling and chemicals including water, oil and most organic solvents. Has a service operating range of 4°K to +125°C.

 

Has a one-to-one mix ratio, by weight or volume. Can be applied with minimal sagging or dripping even on vertical surfaces. It is 100% reactive and does not contain any diluents or solvents.

 

Available in glass jars, metal containers or syringes.

 

Masterbond, masterbond.com

 

SmartScope Quest 650, a large-measurement-volume dimensional metrology system, now has programmable five-axis measuring.  A motorized dual rotary indexer allows sensors to measure features anywhere on complex parts. Metrology software supports simultaneous five-axis motion, keeping the coordinate system aligned with the rotating part.  This system measures parts such as turbine blades, vanes and airfoils.
 
Includes high-speed linear motors, a large working volume, support of a variety of sensors (video, laser, touch probe, micro-probe) and the ability to switch between sensors at any point in a measurement routine.
 
The patented zoom lens, designed for precision video metrology, is telecentric and is said to provide a clear, high contrast image with virtually zero distortion.
 
Features a massive granite base and a thermally stable Meehanite bridge, providing stability over an xyz measurement volume of 600 x 660 x 300 mm (24 x 26 x 12"). The z-axis range can be extended to 400 mm (16").
 
 
Optical Gaging Products, ogpnet.com

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